JP2014510407A - 光電子部品のためのヒートシンク・アセンブリ及びこれを製造する方法 - Google Patents

光電子部品のためのヒートシンク・アセンブリ及びこれを製造する方法 Download PDF

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Publication number
JP2014510407A
JP2014510407A JP2013557144A JP2013557144A JP2014510407A JP 2014510407 A JP2014510407 A JP 2014510407A JP 2013557144 A JP2013557144 A JP 2013557144A JP 2013557144 A JP2013557144 A JP 2013557144A JP 2014510407 A JP2014510407 A JP 2014510407A
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JP
Japan
Prior art keywords
heat sink
insert
sink assembly
thermally active
assembly according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013557144A
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English (en)
Japanese (ja)
Other versions
JP2014510407A5 (enExample
Inventor
キンモ ヨケライネン
ヴィッレ モイラネン
ハワード ループレヒト
Original Assignee
ライトサーム リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ライトサーム リミテッド filed Critical ライトサーム リミテッド
Publication of JP2014510407A publication Critical patent/JP2014510407A/ja
Publication of JP2014510407A5 publication Critical patent/JP2014510407A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00—Subject matter not provided for in other groups of this subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2013557144A 2011-03-08 2012-03-08 光電子部品のためのヒートシンク・アセンブリ及びこれを製造する方法 Pending JP2014510407A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161450187P 2011-03-08 2011-03-08
GB1103850.2A GB2488982B (en) 2011-03-08 2011-03-08 Heat sink assembly for opto-electronic components and a method for producing the same LED heatsink
US61/450,187 2011-03-08
GB1103850.2 2011-03-08
PCT/FI2012/000014 WO2012120185A2 (en) 2011-03-08 2012-03-08 Heat sink assembly for opto-electronic components and a method for producing the same

Publications (2)

Publication Number Publication Date
JP2014510407A true JP2014510407A (ja) 2014-04-24
JP2014510407A5 JP2014510407A5 (enExample) 2015-04-23

Family

ID=43923323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013557144A Pending JP2014510407A (ja) 2011-03-08 2012-03-08 光電子部品のためのヒートシンク・アセンブリ及びこれを製造する方法

Country Status (6)

Country Link
US (1) US9175842B2 (enExample)
EP (1) EP2707653A4 (enExample)
JP (1) JP2014510407A (enExample)
CN (1) CN103608622A (enExample)
GB (2) GB2509654A (enExample)
WO (1) WO2012120185A2 (enExample)

Cited By (2)

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JP2016058261A (ja) * 2014-09-10 2016-04-21 信越ポリマー株式会社 放熱ソケットおよびその製造方法、ならびに放熱ソケットを含むｌｅｄコンポーネント
JP2020520537A (ja) * 2017-05-10 2020-07-09 フージョウ ミンシュオ オプトエレクトロニック テクノロジー カンパニー リミテッドＨｕｚｈｏｕ Ｍｉｎｇｓｈｕｏ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． グラフェン放熱式ｌｅｄランプ

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US9227347B2 (en) * 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
US9052093B2 (en) * 2013-03-14 2015-06-09 Cree, Inc. LED lamp and heat sink
JPWO2014192280A1 (ja) * 2013-05-29 2017-02-23 パナソニックＩｐマネジメント株式会社 Ｌｅｄユニット
GB2523844B (en) * 2014-03-08 2016-04-27 Lighttherm Ltd LED lamp with embedded circuitry
WO2016156463A1 (en) * 2015-03-31 2016-10-06 Koninklijke Philips N.V. Led lighting module with heat sink and a method of replacing an led module
CN205030031U (zh) * 2015-10-12 2016-02-10 中磊电子（苏州）有限公司 导热塑料散热器与通信装置
DE102016005291B4 (de) * 2016-04-29 2024-01-11 Ksg Austria Gmbh Verfahren zur Herstellung eines elektronischen Gerätes in der Form eines Spritzgußteils mit eingelegter Leiterplatte
US20170356640A1 (en) * 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
DE102017104794B4 (de) * 2017-03-08 2020-03-26 Bruker Daltonik Gmbh Ionenmobilitätsspektrometer
CN112923339A (zh) * 2021-04-02 2021-06-08 苏州梦时达新能源科技有限公司 基于氮化物材料的led模组压铸导热散热器

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058261A (ja) * 2014-09-10 2016-04-21 信越ポリマー株式会社 放熱ソケットおよびその製造方法、ならびに放熱ソケットを含むｌｅｄコンポーネント
JP2020520537A (ja) * 2017-05-10 2020-07-09 フージョウ ミンシュオ オプトエレクトロニック テクノロジー カンパニー リミテッドＨｕｚｈｏｕ Ｍｉｎｇｓｈｕｏ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． グラフェン放熱式ｌｅｄランプ
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Also Published As

Publication number Publication date
GB2488982B (en) 2014-10-08
GB201407035D0 (en) 2014-06-04
CN103608622A (zh) 2014-02-26
EP2707653A4 (en) 2015-04-01
GB2509654A (en) 2014-07-09
WO2012120185A2 (en) 2012-09-13
GB2488982A (en) 2012-09-19
EP2707653A2 (en) 2014-03-19
GB201103850D0 (en) 2011-04-20
WO2012120185A3 (en) 2012-11-01
US9175842B2 (en) 2015-11-03
US20130335970A1 (en) 2013-12-19

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