JP2014509446A5 - - Google Patents
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- JP2014509446A5 JP2014509446A5 JP2013547532A JP2013547532A JP2014509446A5 JP 2014509446 A5 JP2014509446 A5 JP 2014509446A5 JP 2013547532 A JP2013547532 A JP 2013547532A JP 2013547532 A JP2013547532 A JP 2013547532A JP 2014509446 A5 JP2014509446 A5 JP 2014509446A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrostatic clamp
- operate
- heating block
- torr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
図1aは、ベース12と加熱ブロック14とが互いに結合される従来技術に係る静電クランプ10の構成を示す。静電クランプ10は加熱ブロック14により支持される基板を抵抗加熱するのに用いられ得る加熱器(図示せず)を含む。静電クランプ10は基板に対し1以上の処理を行う低圧力チャンバなどの処理チャンバ内の基板ホルダとして動作してもよい。そのような低圧力チャンバの例としては、例えば基板の処理の前に10−7トル以下の圧力へ減圧を行い、10−7〜100 トルの範囲の環境ガス圧において動作し得るプラズマおよびイオンビームツールが挙げられる。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/983,710 US8669540B2 (en) | 2011-01-03 | 2011-01-03 | System and method for gas leak control in a substrate holder |
US12/983,710 | 2011-01-03 | ||
PCT/US2011/065796 WO2012094139A1 (en) | 2011-01-03 | 2011-12-19 | System and method for gas leak control in a substrate holder |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014509446A JP2014509446A (ja) | 2014-04-17 |
JP2014509446A5 true JP2014509446A5 (ja) | 2014-09-18 |
JP6052184B2 JP6052184B2 (ja) | 2016-12-27 |
Family
ID=45569727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013547532A Active JP6052184B2 (ja) | 2011-01-03 | 2011-12-19 | 静電クランプおよびイオン注入システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8669540B2 (ja) |
JP (1) | JP6052184B2 (ja) |
KR (1) | KR101937911B1 (ja) |
CN (2) | CN105552004B (ja) |
TW (1) | TWI484588B (ja) |
WO (1) | WO2012094139A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9869392B2 (en) | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
US9859142B2 (en) | 2011-10-20 | 2018-01-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
US20140318455A1 (en) * | 2013-04-26 | 2014-10-30 | Varian Semiconductor Equipment Associates, Inc. | Low emissivity electrostatic chuck |
US10090211B2 (en) | 2013-12-26 | 2018-10-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
US10535499B2 (en) * | 2017-11-03 | 2020-01-14 | Varian Semiconductor Equipment Associates, Inc. | Varied component density for thermal isolation |
CN111816604B (zh) * | 2020-08-18 | 2021-03-12 | 北京智创芯源科技有限公司 | 一种晶片刻蚀方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0997830A (ja) * | 1995-07-21 | 1997-04-08 | Fuji Electric Co Ltd | 静電チャックホールダ、ウエハ保持機構ならびにその使用方法 |
JPH09213781A (ja) * | 1996-02-01 | 1997-08-15 | Tokyo Electron Ltd | 載置台構造及びそれを用いた処理装置 |
JP4256503B2 (ja) * | 1997-10-30 | 2009-04-22 | 東京エレクトロン株式会社 | 真空処理装置 |
US6019164A (en) * | 1997-12-31 | 2000-02-01 | Temptronic Corporation | Workpiece chuck |
JP2001068538A (ja) * | 1999-06-21 | 2001-03-16 | Tokyo Electron Ltd | 電極構造、載置台構造、プラズマ処理装置及び処理装置 |
JP2002009139A (ja) * | 2000-06-20 | 2002-01-11 | Nikon Corp | 静電チャック |
JP2002009064A (ja) * | 2000-06-21 | 2002-01-11 | Hitachi Ltd | 試料の処理装置及び試料の処理方法 |
US7161121B1 (en) * | 2001-04-30 | 2007-01-09 | Lam Research Corporation | Electrostatic chuck having radial temperature control capability |
JP4698097B2 (ja) * | 2001-09-26 | 2011-06-08 | 京セラ株式会社 | ウェハ支持部材 |
JP2003124298A (ja) * | 2001-10-17 | 2003-04-25 | Anelva Corp | プラズマ支援ウェハー処理反応容器の二重静電チャックウェハーステージ |
JP3881908B2 (ja) * | 2002-02-26 | 2007-02-14 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
US6646233B2 (en) * | 2002-03-05 | 2003-11-11 | Hitachi High-Technologies Corporation | Wafer stage for wafer processing apparatus and wafer processing method |
JP2004282047A (ja) * | 2003-02-25 | 2004-10-07 | Kyocera Corp | 静電チャック |
US6897403B2 (en) * | 2003-03-05 | 2005-05-24 | Hitachi High-Technologies Corporation | Plasma processing method and plasma processing apparatus |
JP2006261541A (ja) * | 2005-03-18 | 2006-09-28 | Tokyo Electron Ltd | 基板載置台、基板処理装置および基板処理方法 |
US7815740B2 (en) * | 2005-03-18 | 2010-10-19 | Tokyo Electron Limited | Substrate mounting table, substrate processing apparatus and substrate processing method |
JP5007179B2 (ja) * | 2007-08-29 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US7709364B1 (en) * | 2009-05-19 | 2010-05-04 | Advanced Ion Beam Technology, Inc. | Method and apparatus for low temperature ion implantation |
US9082804B2 (en) * | 2011-02-07 | 2015-07-14 | Varian Semiconductor Equipment Associates, Inc. | Triboelectric charge controlled electrostatic clamp |
-
2011
- 2011-01-03 US US12/983,710 patent/US8669540B2/en active Active
- 2011-12-19 JP JP2013547532A patent/JP6052184B2/ja active Active
- 2011-12-19 CN CN201511000843.2A patent/CN105552004B/zh active Active
- 2011-12-19 KR KR1020137020404A patent/KR101937911B1/ko active IP Right Grant
- 2011-12-19 CN CN201180062710.1A patent/CN103299415B/zh active Active
- 2011-12-19 WO PCT/US2011/065796 patent/WO2012094139A1/en active Application Filing
- 2011-12-29 TW TW100149600A patent/TWI484588B/zh active
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