JP2014507070A - リソグラフィ装置およびデバイス製造方法 - Google Patents
リソグラフィ装置およびデバイス製造方法 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/705—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys
- H01H13/7065—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys characterised by the mechanism between keys and layered keyboards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/86—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the casing, e.g. sealed casings or casings reducible in size
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/064—Optical isolation of switch sites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2221/00—Actuators
- H01H2221/024—Transmission element
- H01H2221/03—Stoppers for on or off position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2223/00—Casings
- H01H2223/034—Bezel
- H01H2223/036—Bezel forming chamfered apertures for keys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2227/00—Dimensions; Characteristics
- H01H2227/028—Key stroke
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H3/00—Mechanisms for operating contacts
- H01H3/02—Operating parts, i.e. for operating driving mechanism by a mechanical force external to the switch
- H01H3/12—Push-buttons
- H01H3/122—Push-buttons with enlarged actuating area, e.g. of the elongated bar-type; Stabilising means therefor
- H01H3/125—Push-buttons with enlarged actuating area, e.g. of the elongated bar-type; Stabilising means therefor using a scissor mechanism as stabiliser
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【選択図】 図5aおよび図5b
Description
[0001] 本出願は、参照により全体が本明細書に組み込まれる、2011年2月18日に出願の米国特許仮出願第61/444,148号の利益を主張する。
上の式で、λは、使用される放射の波長であり、NAは、パターンを印刷するために使用される投影システムの開口数であり、k1は、レイリー定数とも呼ばれているプロセス依存調節係数であり、CDは、印刷されたフィーチャのフィーチャサイズ(またはクリティカルディメンジョン)である。式(1)から、フィーチャの最小印刷可能サイズは、露光波長λを短くすること、開口数NAを大きくすること、あるいはk1の値を小さくすること、の3つの方法によって縮小することができると言える。
Claims (13)
- リソグラフィ装置用の基板サポートであって、
基板を保持する基板テーブルと、
前記基板テーブル用のサポートブロックと、を備え、
動作中、前記基板テーブルは、前記サポートブロックによって支持され、かつ前記サポートブロックにクランプされ、
前記サポートブロックの表面上には、前記クランプ中、前記基板テーブルに対して当接するための第1組のバールが設けられ、
前記基板テーブルの表面上には、前記クランプ中、前記サポートブロックに対して当接するための第2組のバールが設けられる、
基板サポート。 - 前記クランプは、静電クランプを備え、前記基板テーブルの前記サポートブロックへのクランプは、静電的に実行される、請求項1に記載の基板サポート。
- 前記静電クランプの電極は、単一の連続的な導電層を備える、請求項2に記載の基板サポート。
- 前記第1組のバールは、該バールが延在する表面から測定した場合に、前記第2組のバールよりも10倍以上高い、請求項1〜3のいずれか1項に記載の基板サポート。
- 前記第1組のバールは、該バールが延在する表面から測定した場合に、前記第2組のバールよりも100倍以上高い、請求項1〜4のいずれか1項に記載の基板サポート。
- 前記第1組のバールは、それぞれ、0.5mmを超える高さである、請求項1〜5のいずれか1項に記載の基板サポート。
- 前記第2組のバールは、それぞれ、100μm未満の高さである、請求項1〜6のいずれか1項に記載の基板サポート。
- 前記サポートブロックは、ミラーブロックを備える、請求項1〜7のいずれか1項に記載の基板サポート。
- 前記第2組のバールは、クランプ中、前記基板テーブルと前記サポートブロックとの間の接触面積を最小限に抑えるように構成される、請求項1〜8のいずれか1項に記載の基板サポート。
- 前記第1組のバールは、前記基板サポートの横方向の加速中、前記基板テーブルと前記サポートブロックとの間のスリップを最小限に抑えるように構成される、請求項1〜9のいずれか1項に記載の基板サポート。
- 前記第1組のバールのそれぞれは、前記サポートブロックの前記表面から円筒状の栓を除去することにより形成されている、請求項1〜10のいずれか1項に記載の基板サポート。
- 前記サポートブロックの上面は、前記第1組のバールのバール間の導電層により覆われる、請求項1〜11のいずれか1項に記載の基板サポート。
- 放射ビームを調整する照明システムと、
前記放射ビームの断面にパターンを付与してパターン付き放射ビームを形成することが可能なパターニングデバイスを支持するサポートと、
前記パターン付き放射ビームを前記基板のターゲット部分上に投影する投影システムと、
請求項1〜12に記載の基板サポートと、を備えた
リソグラフィ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161444148P | 2011-02-18 | 2011-02-18 | |
US61/444,148 | 2011-02-18 | ||
PCT/EP2011/073356 WO2012110144A1 (en) | 2011-02-18 | 2011-12-20 | Lithographic apparatus and device manufacturing method. |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014507070A true JP2014507070A (ja) | 2014-03-20 |
JP2014507070A5 JP2014507070A5 (ja) | 2015-02-19 |
JP5989677B2 JP5989677B2 (ja) | 2016-09-14 |
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ID=45420641
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Application Number | Title | Priority Date | Filing Date |
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JP2013553815A Active JP5989677B2 (ja) | 2011-02-18 | 2011-12-20 | 基板サポートおよびリソグラフィ装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9366973B2 (ja) |
JP (1) | JP5989677B2 (ja) |
TW (1) | TWI539242B (ja) |
WO (1) | WO2012110144A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016148855A1 (en) * | 2015-03-19 | 2016-09-22 | Applied Materials, Inc. | Method and apparatus for reducing radiation induced change in semiconductor structures |
JP2018533763A (ja) | 2015-10-29 | 2018-11-15 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置用基板テーブル、および基板の装填方法 |
KR102616658B1 (ko) | 2017-06-06 | 2023-12-21 | 에이에스엠엘 네델란즈 비.브이. | 지지 테이블로부터 대상물을 언로딩하는 방법 |
US10806016B2 (en) * | 2017-07-25 | 2020-10-13 | Kla Corporation | High power broadband illumination source |
CN113330369A (zh) | 2018-12-19 | 2021-08-31 | Asml荷兰有限公司 | 具有用于调节晶片的热调节系统的光刻设备 |
WO2020177971A1 (en) * | 2019-03-01 | 2020-09-10 | Asml Netherlands B.V. | Object holder comprising an electrostatic clamp |
EP3882700A1 (en) * | 2020-03-16 | 2021-09-22 | ASML Netherlands B.V. | Object holder, tool and method of manufacturing an object holder |
Citations (4)
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JPH09237827A (ja) * | 1996-03-01 | 1997-09-09 | Hitachi Ltd | 静電吸着装置及びそれを用いた電子ビーム露光装置 |
JP2004207399A (ja) * | 2002-12-24 | 2004-07-22 | Canon Inc | 基板保持装置 |
JP2005045259A (ja) * | 2003-07-23 | 2005-02-17 | Asml Netherlands Bv | リソグラフィ装置、デバイス製造法、及びそれによって製造されるデバイス |
WO2009002577A1 (en) * | 2007-06-21 | 2008-12-31 | Immersion Corporation | Haptic health feedback monitoring |
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US4506184A (en) | 1984-01-10 | 1985-03-19 | Varian Associates, Inc. | Deformable chuck driven by piezoelectric means |
KR900001241B1 (ko) * | 1985-04-17 | 1990-03-05 | 가부시기가이샤 히다찌세이사꾸쇼 | 광 노출 장치 |
EP1359466A1 (en) * | 2002-05-01 | 2003-11-05 | ASML Netherlands B.V. | Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method |
EP1507172A1 (en) | 2003-08-12 | 2005-02-16 | ASML Netherlands B.V. | Lithographic apparatus and apparatus adjustment method |
US7532310B2 (en) * | 2004-10-22 | 2009-05-12 | Asml Netherlands B.V. | Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck |
JP4298739B2 (ja) | 2006-11-06 | 2009-07-22 | キヤノン株式会社 | 基板吸着装置 |
US7940511B2 (en) * | 2007-09-21 | 2011-05-10 | Asml Netherlands B.V. | Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp |
NL1036735A1 (nl) | 2008-04-10 | 2009-10-13 | Asml Holding Nv | Shear-layer chuck for lithographic apparatus. |
NL1036898A1 (nl) | 2008-05-21 | 2009-11-24 | Asml Netherlands Bv | Substrate table, sensor and method. |
NL2003470A (en) | 2008-10-07 | 2010-04-08 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
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2011
- 2011-12-20 WO PCT/EP2011/073356 patent/WO2012110144A1/en active Application Filing
- 2011-12-20 US US13/983,203 patent/US9366973B2/en active Active
- 2011-12-20 JP JP2013553815A patent/JP5989677B2/ja active Active
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2012
- 2012-01-04 TW TW101100375A patent/TWI539242B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09237827A (ja) * | 1996-03-01 | 1997-09-09 | Hitachi Ltd | 静電吸着装置及びそれを用いた電子ビーム露光装置 |
JP2004207399A (ja) * | 2002-12-24 | 2004-07-22 | Canon Inc | 基板保持装置 |
JP2005045259A (ja) * | 2003-07-23 | 2005-02-17 | Asml Netherlands Bv | リソグラフィ装置、デバイス製造法、及びそれによって製造されるデバイス |
WO2009002577A1 (en) * | 2007-06-21 | 2008-12-31 | Immersion Corporation | Haptic health feedback monitoring |
Also Published As
Publication number | Publication date |
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TWI539242B (zh) | 2016-06-21 |
WO2012110144A1 (en) | 2012-08-23 |
US9366973B2 (en) | 2016-06-14 |
TW201235798A (en) | 2012-09-01 |
JP5989677B2 (ja) | 2016-09-14 |
US20130321788A1 (en) | 2013-12-05 |
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