JP2014505319A5 - - Google Patents
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- Publication number
- JP2014505319A5 JP2014505319A5 JP2013538947A JP2013538947A JP2014505319A5 JP 2014505319 A5 JP2014505319 A5 JP 2014505319A5 JP 2013538947 A JP2013538947 A JP 2013538947A JP 2013538947 A JP2013538947 A JP 2013538947A JP 2014505319 A5 JP2014505319 A5 JP 2014505319A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- heat
- thermally conductive
- heat source
- thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 60
- 239000002041 carbon nanotube Substances 0.000 claims description 53
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 41
- 239000004020 conductor Substances 0.000 claims description 30
- 238000012546 transfer Methods 0.000 claims description 20
- 239000000835 fiber Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000002657 fibrous material Substances 0.000 description 5
- 239000004519 grease Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910021397 glassy carbon Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41308710P | 2010-11-12 | 2010-11-12 | |
| US61/413,087 | 2010-11-12 | ||
| PCT/US2011/060440 WO2012065107A1 (en) | 2010-11-12 | 2011-11-11 | Systems and methods for thermal management of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014505319A JP2014505319A (ja) | 2014-02-27 |
| JP2014505319A5 true JP2014505319A5 (https=) | 2014-12-25 |
Family
ID=46046750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013538947A Pending JP2014505319A (ja) | 2010-11-12 | 2011-11-11 | 電子部品の熱管理のためのシステムおよび方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120118552A1 (https=) |
| EP (1) | EP2637868A4 (https=) |
| JP (1) | JP2014505319A (https=) |
| WO (1) | WO2012065107A1 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2570385A3 (en) * | 2005-05-03 | 2013-10-16 | Nanocomp Technologies, Inc. | Carbon composite materials and methods of manufacturing same |
| CA2850951A1 (en) | 2005-07-28 | 2007-01-28 | Nanocomp Technologies, Inc. | Systems and methods for formation and harvesting of nanofibrous materials |
| US9061913B2 (en) * | 2007-06-15 | 2015-06-23 | Nanocomp Technologies, Inc. | Injector apparatus and methods for production of nanostructures |
| WO2009021069A1 (en) * | 2007-08-07 | 2009-02-12 | Nanocomp Technologies, Inc. | Electrically and thermally non-metallic conductive nanostructure-based adapters |
| JP2010537410A (ja) * | 2007-08-14 | 2010-12-02 | ナノコンプ テクノロジーズ インコーポレイテッド | ナノ構造材料ベースの熱電発電装置 |
| JP5864253B2 (ja) * | 2008-05-07 | 2016-02-17 | ナノコンプ テクノロジーズ インコーポレイテッド | ナノ構造複合材シートの形成方法 |
| AU2009244152A1 (en) * | 2008-05-07 | 2009-11-12 | Nanocomp Technologies, Inc. | Nanostructure-based heating devices and method of use |
| US8354593B2 (en) * | 2009-07-10 | 2013-01-15 | Nanocomp Technologies, Inc. | Hybrid conductors and method of making same |
| US8722171B2 (en) | 2011-01-04 | 2014-05-13 | Nanocomp Technologies, Inc. | Nanotube-based insulators |
| WO2014204561A1 (en) | 2013-06-17 | 2014-12-24 | Nanocomp Technologies, Inc. | Exfoliating-dispersing agents for nanotubes, bundles and fibers |
| EP3253709A4 (en) | 2015-02-03 | 2018-10-31 | Nanocomp Technologies, Inc. | Carbon nanotube structures and methods for production thereof |
| JP6455336B2 (ja) * | 2015-06-23 | 2019-01-23 | 日本ゼオン株式会社 | 熱伝導シートおよびその製造方法 |
| US10581082B2 (en) | 2016-11-15 | 2020-03-03 | Nanocomp Technologies, Inc. | Systems and methods for making structures defined by CNT pulp networks |
| US11279836B2 (en) | 2017-01-09 | 2022-03-22 | Nanocomp Technologies, Inc. | Intumescent nanostructured materials and methods of manufacturing same |
| US10128022B1 (en) * | 2017-10-24 | 2018-11-13 | Northrop Grumman Systems Corporation | Lightweight carbon nanotube cable comprising a pair of plated twisted wires |
| KR102260128B1 (ko) * | 2019-05-29 | 2021-06-02 | 숭실대학교산학협력단 | 절연외피가 없는 탄소나노튜브 전선을 권선한 자화소자 |
| JP2020196145A (ja) * | 2019-05-31 | 2020-12-10 | 日立造船株式会社 | 積層体および積層体の製造方法 |
| CN112086235B (zh) * | 2020-08-28 | 2025-03-18 | 广东澳通特种电缆有限公司 | 一种防火防水电缆组件 |
| US12230419B1 (en) | 2021-07-09 | 2025-02-18 | Hrl Laboratories, Llc | Carbon nanotube ultraconductor |
| JP2023030574A (ja) * | 2021-08-23 | 2023-03-08 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP7766426B2 (ja) * | 2021-08-23 | 2025-11-10 | ローム株式会社 | 半導体装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116839A (ja) * | 2003-10-08 | 2005-04-28 | Sony Corp | 熱伝導体、冷却装置、電子機器及び熱伝導体の製造方法 |
| TWI463615B (zh) * | 2004-11-04 | 2014-12-01 | 台灣積體電路製造股份有限公司 | 以奈米管為基礎之具方向性導電黏著 |
| US7651963B2 (en) * | 2005-04-15 | 2010-01-26 | Siemens Energy, Inc. | Patterning on surface with high thermal conductivity materials |
| KR100674404B1 (ko) * | 2005-07-05 | 2007-01-29 | 재단법인서울대학교산학협력재단 | 탄소나노튜브가 코팅된 방열판 및 그 제조방법 |
| US8890312B2 (en) * | 2006-05-26 | 2014-11-18 | The Hong Kong University Of Science And Technology | Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use |
| US20080166563A1 (en) * | 2007-01-04 | 2008-07-10 | Goodrich Corporation | Electrothermal heater made from thermally conducting electrically insulating polymer material |
| CN101286383B (zh) * | 2007-04-11 | 2010-05-26 | 清华大学 | 电磁屏蔽线缆 |
| JP2009057249A (ja) * | 2007-08-31 | 2009-03-19 | Sumitomo Electric Ind Ltd | 炭素構造体、複合部材およびその製造方法 |
| CN101556839B (zh) * | 2008-04-09 | 2011-08-24 | 清华大学 | 线缆 |
| US8632879B2 (en) * | 2008-04-25 | 2014-01-21 | The University Of Kentucky Research Foundation | Lightweight thermal management material for enhancement of through-thickness thermal conductivity |
| JP5864253B2 (ja) * | 2008-05-07 | 2016-02-17 | ナノコンプ テクノロジーズ インコーポレイテッド | ナノ構造複合材シートの形成方法 |
| US20100021682A1 (en) * | 2008-07-25 | 2010-01-28 | Florida State University Research Foundation | Composite material and method for increasing z-axis thermal conductivity of composite sheet material |
| US8445788B1 (en) * | 2009-01-05 | 2013-05-21 | The Boeing Company | Carbon nanotube-enhanced, metallic wire |
| CN101931841A (zh) * | 2009-06-26 | 2010-12-29 | 清华大学 | 音圈骨架及扬声器 |
| CN102918754B (zh) * | 2010-05-27 | 2015-03-11 | 矢崎总业株式会社 | 感应电动机的转子、以及使用该转子的感应电动机 |
| CN102372253B (zh) * | 2010-08-23 | 2014-01-15 | 清华大学 | 碳纳米管复合线状结构及其制备方法 |
| CN102372252B (zh) * | 2010-08-23 | 2016-06-15 | 清华大学 | 碳纳米管复合线及其制备方法 |
| US8853540B2 (en) * | 2011-04-19 | 2014-10-07 | Commscope, Inc. Of North Carolina | Carbon nanotube enhanced conductors for communications cables and related communications cables and methods |
-
2011
- 2011-11-11 EP EP11839038.4A patent/EP2637868A4/en not_active Withdrawn
- 2011-11-11 US US13/294,698 patent/US20120118552A1/en not_active Abandoned
- 2011-11-11 JP JP2013538947A patent/JP2014505319A/ja active Pending
- 2011-11-11 WO PCT/US2011/060440 patent/WO2012065107A1/en not_active Ceased
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