JP2014505319A - 電子部品の熱管理のためのシステムおよび方法 - Google Patents

電子部品の熱管理のためのシステムおよび方法 Download PDF

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Publication number
JP2014505319A
JP2014505319A JP2013538947A JP2013538947A JP2014505319A JP 2014505319 A JP2014505319 A JP 2014505319A JP 2013538947 A JP2013538947 A JP 2013538947A JP 2013538947 A JP2013538947 A JP 2013538947A JP 2014505319 A JP2014505319 A JP 2014505319A
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conductive member
heat
thermally conductive
heat source
thermally
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Japanese (ja)
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JP2014505319A5 (https=
Inventor
ブライアン・ホワイト
クレイグ・ロンバード
デイビッド・エス・ラッシュモア
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ナノコンプ テクノロジーズ インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
JP2013538947A 2010-11-12 2011-11-11 電子部品の熱管理のためのシステムおよび方法 Pending JP2014505319A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41308710P 2010-11-12 2010-11-12
US61/413,087 2010-11-12
PCT/US2011/060440 WO2012065107A1 (en) 2010-11-12 2011-11-11 Systems and methods for thermal management of electronic components

Publications (2)

Publication Number Publication Date
JP2014505319A true JP2014505319A (ja) 2014-02-27
JP2014505319A5 JP2014505319A5 (https=) 2014-12-25

Family

ID=46046750

Family Applications (1)

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JP2013538947A Pending JP2014505319A (ja) 2010-11-12 2011-11-11 電子部品の熱管理のためのシステムおよび方法

Country Status (4)

Country Link
US (1) US20120118552A1 (https=)
EP (1) EP2637868A4 (https=)
JP (1) JP2014505319A (https=)
WO (1) WO2012065107A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017007234A (ja) * 2015-06-23 2017-01-12 日本ゼオン株式会社 熱伝導シートおよびその製造方法
WO2020241177A1 (ja) * 2019-05-31 2020-12-03 日立造船株式会社 積層体および積層体の製造方法

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EP2570385A3 (en) * 2005-05-03 2013-10-16 Nanocomp Technologies, Inc. Carbon composite materials and methods of manufacturing same
CA2850951A1 (en) 2005-07-28 2007-01-28 Nanocomp Technologies, Inc. Systems and methods for formation and harvesting of nanofibrous materials
US9061913B2 (en) * 2007-06-15 2015-06-23 Nanocomp Technologies, Inc. Injector apparatus and methods for production of nanostructures
WO2009021069A1 (en) * 2007-08-07 2009-02-12 Nanocomp Technologies, Inc. Electrically and thermally non-metallic conductive nanostructure-based adapters
JP2010537410A (ja) * 2007-08-14 2010-12-02 ナノコンプ テクノロジーズ インコーポレイテッド ナノ構造材料ベースの熱電発電装置
JP5864253B2 (ja) * 2008-05-07 2016-02-17 ナノコンプ テクノロジーズ インコーポレイテッド ナノ構造複合材シートの形成方法
AU2009244152A1 (en) * 2008-05-07 2009-11-12 Nanocomp Technologies, Inc. Nanostructure-based heating devices and method of use
US8354593B2 (en) * 2009-07-10 2013-01-15 Nanocomp Technologies, Inc. Hybrid conductors and method of making same
US8722171B2 (en) 2011-01-04 2014-05-13 Nanocomp Technologies, Inc. Nanotube-based insulators
WO2014204561A1 (en) 2013-06-17 2014-12-24 Nanocomp Technologies, Inc. Exfoliating-dispersing agents for nanotubes, bundles and fibers
EP3253709A4 (en) 2015-02-03 2018-10-31 Nanocomp Technologies, Inc. Carbon nanotube structures and methods for production thereof
US10581082B2 (en) 2016-11-15 2020-03-03 Nanocomp Technologies, Inc. Systems and methods for making structures defined by CNT pulp networks
US11279836B2 (en) 2017-01-09 2022-03-22 Nanocomp Technologies, Inc. Intumescent nanostructured materials and methods of manufacturing same
US10128022B1 (en) * 2017-10-24 2018-11-13 Northrop Grumman Systems Corporation Lightweight carbon nanotube cable comprising a pair of plated twisted wires
KR102260128B1 (ko) * 2019-05-29 2021-06-02 숭실대학교산학협력단 절연외피가 없는 탄소나노튜브 전선을 권선한 자화소자
CN112086235B (zh) * 2020-08-28 2025-03-18 广东澳通特种电缆有限公司 一种防火防水电缆组件
US12230419B1 (en) 2021-07-09 2025-02-18 Hrl Laboratories, Llc Carbon nanotube ultraconductor
JP2023030574A (ja) * 2021-08-23 2023-03-08 ローム株式会社 半導体装置および半導体装置の製造方法
JP7766426B2 (ja) * 2021-08-23 2025-11-10 ローム株式会社 半導体装置

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JP2005116839A (ja) * 2003-10-08 2005-04-28 Sony Corp 熱伝導体、冷却装置、電子機器及び熱伝導体の製造方法
US20080001284A1 (en) * 2006-05-26 2008-01-03 The Hong Kong University Of Science And Technolgoy Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use
JP2009057249A (ja) * 2007-08-31 2009-03-19 Sumitomo Electric Ind Ltd 炭素構造体、複合部材およびその製造方法
US20100000754A1 (en) * 2008-05-07 2010-01-07 Nanocomp Technologies, Inc. Carbon nanotube-based coaxial electrical cables and wiring harness
JP2012010583A (ja) * 2010-05-27 2012-01-12 Yazaki Corp 誘導モータの回転子

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TWI463615B (zh) * 2004-11-04 2014-12-01 台灣積體電路製造股份有限公司 以奈米管為基礎之具方向性導電黏著
US7651963B2 (en) * 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
KR100674404B1 (ko) * 2005-07-05 2007-01-29 재단법인서울대학교산학협력재단 탄소나노튜브가 코팅된 방열판 및 그 제조방법
US20080166563A1 (en) * 2007-01-04 2008-07-10 Goodrich Corporation Electrothermal heater made from thermally conducting electrically insulating polymer material
CN101286383B (zh) * 2007-04-11 2010-05-26 清华大学 电磁屏蔽线缆
CN101556839B (zh) * 2008-04-09 2011-08-24 清华大学 线缆
US8632879B2 (en) * 2008-04-25 2014-01-21 The University Of Kentucky Research Foundation Lightweight thermal management material for enhancement of through-thickness thermal conductivity
US20100021682A1 (en) * 2008-07-25 2010-01-28 Florida State University Research Foundation Composite material and method for increasing z-axis thermal conductivity of composite sheet material
US8445788B1 (en) * 2009-01-05 2013-05-21 The Boeing Company Carbon nanotube-enhanced, metallic wire
CN101931841A (zh) * 2009-06-26 2010-12-29 清华大学 音圈骨架及扬声器
CN102372253B (zh) * 2010-08-23 2014-01-15 清华大学 碳纳米管复合线状结构及其制备方法
CN102372252B (zh) * 2010-08-23 2016-06-15 清华大学 碳纳米管复合线及其制备方法
US8853540B2 (en) * 2011-04-19 2014-10-07 Commscope, Inc. Of North Carolina Carbon nanotube enhanced conductors for communications cables and related communications cables and methods

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2005116839A (ja) * 2003-10-08 2005-04-28 Sony Corp 熱伝導体、冷却装置、電子機器及び熱伝導体の製造方法
US20080001284A1 (en) * 2006-05-26 2008-01-03 The Hong Kong University Of Science And Technolgoy Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use
JP2009057249A (ja) * 2007-08-31 2009-03-19 Sumitomo Electric Ind Ltd 炭素構造体、複合部材およびその製造方法
US20100000754A1 (en) * 2008-05-07 2010-01-07 Nanocomp Technologies, Inc. Carbon nanotube-based coaxial electrical cables and wiring harness
JP2012010583A (ja) * 2010-05-27 2012-01-12 Yazaki Corp 誘導モータの回転子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017007234A (ja) * 2015-06-23 2017-01-12 日本ゼオン株式会社 熱伝導シートおよびその製造方法
WO2020241177A1 (ja) * 2019-05-31 2020-12-03 日立造船株式会社 積層体および積層体の製造方法

Also Published As

Publication number Publication date
EP2637868A4 (en) 2015-04-22
EP2637868A1 (en) 2013-09-18
US20120118552A1 (en) 2012-05-17
WO2012065107A1 (en) 2012-05-18

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