JP2014504458A5 - - Google Patents

Download PDF

Info

Publication number
JP2014504458A5
JP2014504458A5 JP2013546301A JP2013546301A JP2014504458A5 JP 2014504458 A5 JP2014504458 A5 JP 2014504458A5 JP 2013546301 A JP2013546301 A JP 2013546301A JP 2013546301 A JP2013546301 A JP 2013546301A JP 2014504458 A5 JP2014504458 A5 JP 2014504458A5
Authority
JP
Japan
Prior art keywords
preform
tool
powder
weight
diamond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013546301A
Other languages
English (en)
Japanese (ja)
Other versions
JP6022477B2 (ja
JP2014504458A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/065970 external-priority patent/WO2012088004A2/en
Publication of JP2014504458A publication Critical patent/JP2014504458A/ja
Publication of JP2014504458A5 publication Critical patent/JP2014504458A5/ja
Application granted granted Critical
Publication of JP6022477B2 publication Critical patent/JP6022477B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013546301A 2010-12-20 2011-12-20 Ｃｍｐパッド状態調節ツール Expired - Fee Related JP6022477B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424870P 2010-12-20 2010-12-20
US61/424,870 2010-12-20
PCT/US2011/065970 WO2012088004A2 (en) 2010-12-20 2011-12-20 Cmp pad conditioning tool

Publications (3)

Publication Number Publication Date
JP2014504458A JP2014504458A (ja) 2014-02-20
JP2014504458A5 true JP2014504458A5 (enExample) 2016-09-01
JP6022477B2 JP6022477B2 (ja) 2016-11-09

Family

ID=45953217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013546301A Expired - Fee Related JP6022477B2 (ja) 2010-12-20 2011-12-20 Ｃｍｐパッド状態調節ツール

Country Status (8)

Country Link
US (1) US20120171935A1 (enExample)
EP (1) EP2655015A2 (enExample)
JP (1) JP6022477B2 (enExample)
KR (1) KR101924241B1 (enExample)
CN (1) CN103269831B (enExample)
AU (1) AU2011349393B2 (enExample)
SG (1) SG190811A1 (enExample)
WO (1) WO2012088004A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6133218B2 (ja) 2011-03-07 2017-05-24 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
US10710211B2 (en) 2012-08-02 2020-07-14 3M Innovative Properties Company Abrasive articles with precisely shaped features and method of making thereof
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
CN115625629A (zh) * 2012-08-02 2023-01-20 3M创新有限公司 具有精确成形特征部的研磨元件、用其制成的研磨制品及其制造方法
WO2015153597A1 (en) * 2014-04-03 2015-10-08 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
GB201504759D0 (en) * 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
DE112017001938T5 (de) * 2016-04-06 2019-01-17 M Cubed Technologies, Inc. Diamantverbundwerkstoff-Konditionierer für ein CMP-Tuch
WO2018204556A1 (en) * 2017-05-02 2018-11-08 M Cubed Technologies, Inc. Inert gas-assisted laser machining of ceramic-containing articles
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
KR102880334B1 (ko) 2021-11-26 2025-10-31 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법
CN117798840A (zh) * 2023-12-28 2024-04-02 苏州赛尔科技有限公司 一种划片刀预切板及其制备方法与应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
DE68908549T2 (de) * 1988-08-17 1994-02-10 Univ Australian Kompaktierter diamant mit niedrigem elektrischem spezifischem widerstand.
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US20030109204A1 (en) * 2001-12-06 2003-06-12 Kinik Company Fixed abrasive CMP pad dresser and associated methods
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
KR100636793B1 (ko) * 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너
CN101693353A (zh) * 2005-08-25 2010-04-14 石塚博 具有烧结体研磨部的工具及其制造方法
JP4791121B2 (ja) 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US7815495B2 (en) * 2007-04-11 2010-10-19 Applied Materials, Inc. Pad conditioner
CN101327578A (zh) * 2007-06-22 2008-12-24 钻面奈米科技股份有限公司 研磨工具及其制造方法
JP5311178B2 (ja) * 2007-10-15 2013-10-09 株式会社ニコン 研磨装置及び研磨装置における研磨パッドのドレス方法
US8382557B2 (en) * 2007-11-14 2013-02-26 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and methods of forming thereof
JP2011514848A (ja) 2008-03-10 2011-05-12 モルガン アドバンスド セラミックス， インコーポレイテッド 非平面のｃｖｄダイヤモンド被覆ｃｍｐパッドコンディショナーおよびその製造方法
JP2010125567A (ja) * 2008-11-28 2010-06-10 Mitsubishi Materials Corp Ｃｍｐパッドコンディショナー
US20100186479A1 (en) 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법

Similar Documents

Publication Publication Date Title
JP6431586B2 (ja) 研磨物品及びその形成方法
CN107207363B (zh) 立方氮化硼多晶材料、切削工具、耐磨工具、研磨工具、和制造立方氮化硼多晶材料的方法
CN107207364B (zh) 立方氮化硼多晶体、切削工具、耐磨工具、研磨工具、和立方氮化硼多晶体的制造方法
CN107406334B (zh) 金刚石多晶体、切削工具、耐磨工具、磨削工具以及金刚石多晶体的制造方法
JP6022477B2 (ja) Ｃｍｐパッド状態調節ツール
TW200836883A (en) Submicron alpha alumina high temperature bonded abrasives
WO2002085812A1 (en) Silicon nitride based composite sintered product and method for production thereof
CN108349821A (zh) 制造氮化硼多晶体的方法、氮化硼多晶体、切削工具、耐磨工具以及研磨工具
CN105088339A (zh) 多晶金刚石体、切削工具、耐磨工具、磨削工具以及用于制造多晶金刚石体的方法
TWI378909B (en) High resistivity silicon carbide
Zhou et al. Ultraprecision grinding of silicon wafers using a newly developed diamond wheel
CN102892727B (zh) 高强度金钢石-SiC压坯及其制造方法
JP2025539348A (ja) 固定砥粒ナノ研削プレート、関連物品および関連方法
JP2017185575A (ja) ビトリファイド超砥粒ホイール
JP2008018532A (ja) 研削砥石の製造方法
JP2010189203A (ja) ＳｉＣ系耐摩耗材料およびその製造方法
Yan et al. Synthesis of alumina-bonded polycrystalline diamond by detonation
JPWO2020017039A1 (ja) ダイヤモンド多結晶体及びそれを備えた工具
JP6772743B2 (ja) ダイヤモンド多結晶体の製造方法、ダイヤモンド多結晶体、切削工具、耐摩工具および研削工具
JP2006315898A (ja) 立方晶窒化硼素焼結体
JP6367122B2 (ja) アルミナ焼結体、砥粒、砥石、研磨布、及びアルミナ焼結体の製造方法
CN102172902B (zh) 一种具有磨粒自锐功能的砂轮工作层制作方法
JP2016082127A (ja) 研磨工具
WO2004061040A1 (ja) 立方晶窒化ホウ素砥粒及びその製造方法並びにそれを用いた砥石及び研磨布紙
JP6763937B2 (ja) ビトリファイド超砥粒ホイール