JP2014504458A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014504458A5 JP2014504458A5 JP2013546301A JP2013546301A JP2014504458A5 JP 2014504458 A5 JP2014504458 A5 JP 2014504458A5 JP 2013546301 A JP2013546301 A JP 2013546301A JP 2013546301 A JP2013546301 A JP 2013546301A JP 2014504458 A5 JP2014504458 A5 JP 2014504458A5
- Authority
- JP
- Japan
- Prior art keywords
- preform
- tool
- powder
- weight
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 claims description 27
- 229910003460 diamond Inorganic materials 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 13
- 230000003750 conditioning effect Effects 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011863 silicon-based powder Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 3
- 229910052580 B4C Inorganic materials 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims 2
- 230000001143 conditioned effect Effects 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201061424870P | 2010-12-20 | 2010-12-20 | |
| US61/424,870 | 2010-12-20 | ||
| PCT/US2011/065970 WO2012088004A2 (en) | 2010-12-20 | 2011-12-20 | Cmp pad conditioning tool |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014504458A JP2014504458A (ja) | 2014-02-20 |
| JP2014504458A5 true JP2014504458A5 (enExample) | 2016-09-01 |
| JP6022477B2 JP6022477B2 (ja) | 2016-11-09 |
Family
ID=45953217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013546301A Expired - Fee Related JP6022477B2 (ja) | 2010-12-20 | 2011-12-20 | Ｃｍｐパッド状態調節ツール |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20120171935A1 (enExample) |
| EP (1) | EP2655015A2 (enExample) |
| JP (1) | JP6022477B2 (enExample) |
| KR (1) | KR101924241B1 (enExample) |
| CN (1) | CN103269831B (enExample) |
| AU (1) | AU2011349393B2 (enExample) |
| SG (1) | SG190811A1 (enExample) |
| WO (1) | WO2012088004A2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG193340A1 (en) | 2011-03-07 | 2013-10-30 | Entegris Inc | Chemical mechanical planarization pad conditioner |
| US9956664B2 (en) | 2012-08-02 | 2018-05-01 | 3M Innovative Properties Company | Abrasive element precursor with precisely shaped features and methods of making thereof |
| WO2014022465A1 (en) | 2012-08-02 | 2014-02-06 | 3M Innovative Properties Company | Abrasive articles with precisely shaped features and method of making thereof |
| JP2015530265A (ja) * | 2012-08-02 | 2015-10-15 | スリーエム イノベイティブ プロパティズ カンパニー | 精密に成形された形成部を有する研磨要素、その研磨要素から製造される研磨物品、及びそれらの作製方法 |
| SG11201608219WA (en) * | 2014-04-03 | 2016-10-28 | 3M Innovative Properties Co | Polishing pads and systems and methods of making and using the same |
| GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
| WO2017177072A1 (en) * | 2016-04-06 | 2017-10-12 | M Cubed Technologies, Inc. | Diamond composite cmp pad conditioner |
| WO2018204555A1 (en) * | 2017-05-02 | 2018-11-08 | M Cubed Technologies, Inc. | Laser machining of semiconductor wafer contact surfaces |
| TWI621503B (zh) * | 2017-05-12 | 2018-04-21 | Kinik Company Ltd. | 化學機械研磨拋光墊修整器及其製造方法 |
| KR102880334B1 (ko) | 2021-11-26 | 2025-10-31 | 삼성전자주식회사 | 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151686A (en) * | 1978-01-09 | 1979-05-01 | General Electric Company | Silicon carbide and silicon bonded polycrystalline diamond body and method of making it |
| DE68908549T2 (de) * | 1988-08-17 | 1994-02-10 | Univ Australian | Kompaktierter diamant mit niedrigem elektrischem spezifischem widerstand. |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| US6123612A (en) | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
| US6276998B1 (en) * | 1999-02-25 | 2001-08-21 | Applied Materials, Inc. | Padless substrate carrier |
| US6439986B1 (en) * | 1999-10-12 | 2002-08-27 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
| US20030109204A1 (en) * | 2001-12-06 | 2003-06-12 | Kinik Company | Fixed abrasive CMP pad dresser and associated methods |
| US6852016B2 (en) * | 2002-09-18 | 2005-02-08 | Micron Technology, Inc. | End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
| US20050227590A1 (en) * | 2004-04-09 | 2005-10-13 | Chien-Min Sung | Fixed abrasive tools and associated methods |
| US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
| US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
| KR100636793B1 (ko) * | 2004-12-13 | 2006-10-23 | 이화다이아몬드공업 주식회사 | Ｃｍｐ 패드용 컨디셔너 |
| RU2430827C2 (ru) * | 2005-08-25 | 2011-10-10 | Хироси ИСИЗУКА | Инструмент с полирующей поверхностью из спеченного вещества и способ его изготовления |
| JP4791121B2 (ja) | 2005-09-22 | 2011-10-12 | 新日鉄マテリアルズ株式会社 | 研磨布用ドレッサー |
| US7241206B1 (en) * | 2006-02-17 | 2007-07-10 | Chien-Min Sung | Tools for polishing and associated methods |
| US7815495B2 (en) * | 2007-04-11 | 2010-10-19 | Applied Materials, Inc. | Pad conditioner |
| CN101327578A (zh) * | 2007-06-22 | 2008-12-24 | 钻面奈米科技股份有限公司 | 研磨工具及其制造方法 |
| JP5311178B2 (ja) * | 2007-10-15 | 2013-10-09 | 株式会社ニコン | 研磨装置及び研磨装置における研磨パッドのドレス方法 |
| US8382557B2 (en) * | 2007-11-14 | 2013-02-26 | Saint-Gobain Abrasives, Inc. | Chemical mechanical planarization pad conditioner and methods of forming thereof |
| KR20100133415A (ko) | 2008-03-10 | 2010-12-21 | 모간 어드밴스드 세라믹스, 인코포레이티드 | 비평면 ｃｖｄ 다이아몬드 코팅된 ｃｍｐ ｐａｄ 컨디셔너 및 제조 방법 |
| JP2010125567A (ja) * | 2008-11-28 | 2010-06-10 | Mitsubishi Materials Corp | Ｃｍｐパッドコンディショナー |
| US20100186479A1 (en) | 2009-01-26 | 2010-07-29 | Araca, Inc. | Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs |
| KR101091030B1 (ko) * | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 |
-
2011
- 2011-12-15 US US13/326,464 patent/US20120171935A1/en not_active Abandoned
- 2011-12-20 CN CN201180061545.8A patent/CN103269831B/zh not_active Expired - Fee Related
- 2011-12-20 AU AU2011349393A patent/AU2011349393B2/en not_active Ceased
- 2011-12-20 EP EP11832158.7A patent/EP2655015A2/en not_active Withdrawn
- 2011-12-20 SG SG2013037270A patent/SG190811A1/en unknown
- 2011-12-20 WO PCT/US2011/065970 patent/WO2012088004A2/en not_active Ceased
- 2011-12-20 JP JP2013546301A patent/JP6022477B2/ja not_active Expired - Fee Related
- 2011-12-20 KR KR1020137015870A patent/KR101924241B1/ko not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014504458A5 (enExample) | ||
| JP6431586B2 (ja) | 研磨物品及びその形成方法 | |
| CN107207363B (zh) | 立方氮化硼多晶材料、切削工具、耐磨工具、研磨工具、和制造立方氮化硼多晶材料的方法 | |
| CN107207364B (zh) | 立方氮化硼多晶体、切削工具、耐磨工具、研磨工具、和立方氮化硼多晶体的制造方法 | |
| CN107406334B (zh) | 金刚石多晶体、切削工具、耐磨工具、磨削工具以及金刚石多晶体的制造方法 | |
| JP6022477B2 (ja) | Ｃｍｐパッド状態調節ツール | |
| JPH10330734A (ja) | 炭化珪素複合窒化珪素質研磨材及びその製法 | |
| TW200836883A (en) | Submicron alpha alumina high temperature bonded abrasives | |
| WO2002085812A1 (en) | Silicon nitride based composite sintered product and method for production thereof | |
| CN108349821A (zh) | 制造氮化硼多晶体的方法、氮化硼多晶体、切削工具、耐磨工具以及研磨工具 | |
| CN105019026A (zh) | 立方氮化硼多晶体、切削工具、耐磨工具、研磨工具、和制造立方氮化硼多晶体的方法 | |
| CN105088339A (zh) | 多晶金刚石体、切削工具、耐磨工具、磨削工具以及用于制造多晶金刚石体的方法 | |
| CN102892727B (zh) | 高强度金钢石-SiC压坯及其制造方法 | |
| Zhou et al. | Ultraprecision grinding of silicon wafers using a newly developed diamond wheel | |
| WO2013098153A1 (en) | Diamond composite and a method of making a diamond composite | |
| KR20180126039A (ko) | 전기용융 알루미나 입자, 전기용융 알루미나 입자의 제조방법, 숫돌 및 연마포지 | |
| JP2017185575A (ja) | ビトリファイド超砥粒ホイール | |
| JP2010189203A (ja) | ＳｉＣ系耐摩耗材料およびその製造方法 | |
| JP2017521274A (ja) | ガラス被覆ｃｂｎ研磨材とその作製方法 | |
| JP2006315898A (ja) | 立方晶窒化硼素焼結体 | |
| JPWO2020017039A1 (ja) | ダイヤモンド多結晶体及びそれを備えた工具 | |
| Yan et al. | Synthesis of alumina-bonded polycrystalline diamond by detonation | |
| Zhang et al. | Effect of Si coating on prevention of diamond degradation in diamond/glass composite | |
| JP6367122B2 (ja) | アルミナ焼結体、砥粒、砥石、研磨布、及びアルミナ焼結体の製造方法 | |
| CN102172902B (zh) | 一种具有磨粒自锐功能的砂轮工作层制作方法 |