JP2014504458A5 - - Google Patents

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Publication number
JP2014504458A5
JP2014504458A5 JP2013546301A JP2013546301A JP2014504458A5 JP 2014504458 A5 JP2014504458 A5 JP 2014504458A5 JP 2013546301 A JP2013546301 A JP 2013546301A JP 2013546301 A JP2013546301 A JP 2013546301A JP 2014504458 A5 JP2014504458 A5 JP 2014504458A5
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JP
Japan
Prior art keywords
preform
tool
powder
weight
diamond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013546301A
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English (en)
Japanese (ja)
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JP2014504458A (ja
JP6022477B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/065970 external-priority patent/WO2012088004A2/en
Publication of JP2014504458A publication Critical patent/JP2014504458A/ja
Publication of JP2014504458A5 publication Critical patent/JP2014504458A5/ja
Application granted granted Critical
Publication of JP6022477B2 publication Critical patent/JP6022477B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013546301A 2010-12-20 2011-12-20 Ｃｍｐパッド状態調節ツール Expired - Fee Related JP6022477B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424870P 2010-12-20 2010-12-20
US61/424,870 2010-12-20
PCT/US2011/065970 WO2012088004A2 (en) 2010-12-20 2011-12-20 Cmp pad conditioning tool

Publications (3)

Publication Number Publication Date
JP2014504458A JP2014504458A (ja) 2014-02-20
JP2014504458A5 true JP2014504458A5 (enrdf_load_stackoverflow) 2016-09-01
JP6022477B2 JP6022477B2 (ja) 2016-11-09

Family

ID=45953217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013546301A Expired - Fee Related JP6022477B2 (ja) 2010-12-20 2011-12-20 Ｃｍｐパッド状態調節ツール

Country Status (8)

Country Link
US (1) US20120171935A1 (enrdf_load_stackoverflow)
EP (1) EP2655015A2 (enrdf_load_stackoverflow)
JP (1) JP6022477B2 (enrdf_load_stackoverflow)
KR (1) KR101924241B1 (enrdf_load_stackoverflow)
CN (1) CN103269831B (enrdf_load_stackoverflow)
AU (1) AU2011349393B2 (enrdf_load_stackoverflow)
SG (1) SG190811A1 (enrdf_load_stackoverflow)
WO (1) WO2012088004A2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9132526B2 (en) 2011-03-07 2015-09-15 Entegris, Inc. Chemical mechanical planarization conditioner
WO2014022453A1 (en) 2012-08-02 2014-02-06 3M Innovative Properties Company Abrasive element precursor with precisely shaped features and method of making thereof
CN104736299A (zh) 2012-08-02 2015-06-24 3M创新有限公司 具有精确成形特征部的研磨制品及其制造方法
KR20150039795A (ko) * 2012-08-02 2015-04-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 정밀하게 형상화된 특징부를 갖는 연마 요소, 그로부터 제작되는 연마 물품, 및 그의 제조 방법
KR102350350B1 (ko) * 2014-04-03 2022-01-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
GB201504759D0 (en) * 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
CN109153106B (zh) * 2016-04-06 2022-05-13 M丘比德技术公司 金刚石复合物cmp垫调节器
WO2018204555A1 (en) * 2017-05-02 2018-11-08 M Cubed Technologies, Inc. Laser machining of semiconductor wafer contact surfaces
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
KR20230077918A (ko) 2021-11-26 2023-06-02 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법

Family Cites Families (23)

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US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
DE68908549T2 (de) * 1988-08-17 1994-02-10 Univ Australian Kompaktierter diamant mit niedrigem elektrischem spezifischem widerstand.
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
US20030109204A1 (en) * 2001-12-06 2003-06-12 Kinik Company Fixed abrasive CMP pad dresser and associated methods
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
KR100636793B1 (ko) * 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너
AU2006282293B2 (en) * 2005-08-25 2011-06-23 Hiroshi Ishizuka Tool with sintered body polishing surface and method of manufacturing the same
JP4791121B2 (ja) 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US7815495B2 (en) * 2007-04-11 2010-10-19 Applied Materials, Inc. Pad conditioner
CN101327578A (zh) * 2007-06-22 2008-12-24 钻面奈米科技股份有限公司 研磨工具及其制造方法
JP5311178B2 (ja) * 2007-10-15 2013-10-09 株式会社ニコン 研磨装置及び研磨装置における研磨パッドのドレス方法
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