CN103269831B - Cmp垫整修工具 - Google Patents

Cmp垫整修工具 Download PDF

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Publication number
CN103269831B
CN103269831B CN201180061545.8A CN201180061545A CN103269831B CN 103269831 B CN103269831 B CN 103269831B CN 201180061545 A CN201180061545 A CN 201180061545A CN 103269831 B CN103269831 B CN 103269831B
Authority
CN
China
Prior art keywords
mechanical polishing
chemical mechanical
polishing pads
refacer
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180061545.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN103269831A (zh
Inventor
加里·E·鲁兰
查尔斯·拉里
托马斯·查尔斯·伊斯黎
詹姆士·格雷厄姆
马克·施魏策尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diamond Innovations Inc
Original Assignee
Diamond Innovations Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamond Innovations Inc filed Critical Diamond Innovations Inc
Publication of CN103269831A publication Critical patent/CN103269831A/zh
Application granted granted Critical
Publication of CN103269831B publication Critical patent/CN103269831B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201180061545.8A 2010-12-20 2011-12-20 Cmp垫整修工具 Expired - Fee Related CN103269831B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424870P 2010-12-20 2010-12-20
US61/424,870 2010-12-20
PCT/US2011/065970 WO2012088004A2 (en) 2010-12-20 2011-12-20 Cmp pad conditioning tool

Publications (2)

Publication Number Publication Date
CN103269831A CN103269831A (zh) 2013-08-28
CN103269831B true CN103269831B (zh) 2017-06-09

Family

ID=45953217

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180061545.8A Expired - Fee Related CN103269831B (zh) 2010-12-20 2011-12-20 Cmp垫整修工具

Country Status (8)

Country Link
US (1) US20120171935A1 (enrdf_load_stackoverflow)
EP (1) EP2655015A2 (enrdf_load_stackoverflow)
JP (1) JP6022477B2 (enrdf_load_stackoverflow)
KR (1) KR101924241B1 (enrdf_load_stackoverflow)
CN (1) CN103269831B (enrdf_load_stackoverflow)
AU (1) AU2011349393B2 (enrdf_load_stackoverflow)
SG (1) SG190811A1 (enrdf_load_stackoverflow)
WO (1) WO2012088004A2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9132526B2 (en) 2011-03-07 2015-09-15 Entegris, Inc. Chemical mechanical planarization conditioner
WO2014022453A1 (en) 2012-08-02 2014-02-06 3M Innovative Properties Company Abrasive element precursor with precisely shaped features and method of making thereof
CN104736299A (zh) 2012-08-02 2015-06-24 3M创新有限公司 具有精确成形特征部的研磨制品及其制造方法
KR20150039795A (ko) * 2012-08-02 2015-04-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 정밀하게 형상화된 특징부를 갖는 연마 요소, 그로부터 제작되는 연마 물품, 및 그의 제조 방법
KR102350350B1 (ko) * 2014-04-03 2022-01-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
GB201504759D0 (en) * 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
CN109153106B (zh) * 2016-04-06 2022-05-13 M丘比德技术公司 金刚石复合物cmp垫调节器
WO2018204555A1 (en) * 2017-05-02 2018-11-08 M Cubed Technologies, Inc. Laser machining of semiconductor wafer contact surfaces
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
KR20230077918A (ko) 2021-11-26 2023-06-02 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106393A (en) * 1988-08-17 1992-04-21 Australian National University Diamond compact possessing low electrical resistivity
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
CN101247923A (zh) * 2005-08-25 2008-08-20 石塚博 具有烧结体研磨部的工具及其制造方法
CN101327578A (zh) * 2007-06-22 2008-12-24 钻面奈米科技股份有限公司 研磨工具及其制造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
US20030109204A1 (en) * 2001-12-06 2003-06-12 Kinik Company Fixed abrasive CMP pad dresser and associated methods
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
KR100636793B1 (ko) * 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너
JP4791121B2 (ja) 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
US7815495B2 (en) * 2007-04-11 2010-10-19 Applied Materials, Inc. Pad conditioner
JP5311178B2 (ja) * 2007-10-15 2013-10-09 株式会社ニコン 研磨装置及び研磨装置における研磨パッドのドレス方法
WO2009064345A2 (en) * 2007-11-14 2009-05-22 Saint-Gobain Abrasives, Inc. A chemical mechanical planarization pad conditioner and methods of forming thereof
WO2009114413A1 (en) 2008-03-10 2009-09-17 Morgan Advanced Ceramics, Inc. Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
JP2010125567A (ja) * 2008-11-28 2010-06-10 Mitsubishi Materials Corp Ｃｍｐパッドコンディショナー
US20100186479A1 (en) 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106393A (en) * 1988-08-17 1992-04-21 Australian National University Diamond compact possessing low electrical resistivity
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
CN101247923A (zh) * 2005-08-25 2008-08-20 石塚博 具有烧结体研磨部的工具及其制造方法
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
CN101327578A (zh) * 2007-06-22 2008-12-24 钻面奈米科技股份有限公司 研磨工具及其制造方法

Also Published As

Publication number Publication date
SG190811A1 (en) 2013-07-31
WO2012088004A3 (en) 2012-12-13
WO2012088004A2 (en) 2012-06-28
AU2011349393A1 (en) 2013-06-06
AU2011349393B2 (en) 2016-11-10
JP2014504458A (ja) 2014-02-20
KR20130132480A (ko) 2013-12-04
KR101924241B1 (ko) 2018-11-30
CN103269831A (zh) 2013-08-28
US20120171935A1 (en) 2012-07-05
EP2655015A2 (en) 2013-10-30
JP6022477B2 (ja) 2016-11-09

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170609

Termination date: 20201220