JP2014501678A - 2つの接合相手、すなわち金属/セラミックを有するセラミックをレーザービームで接合するための方法 - Google Patents
2つの接合相手、すなわち金属/セラミックを有するセラミックをレーザービームで接合するための方法 Download PDFInfo
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- JP2014501678A JP2014501678A JP2013533196A JP2013533196A JP2014501678A JP 2014501678 A JP2014501678 A JP 2014501678A JP 2013533196 A JP2013533196 A JP 2013533196A JP 2013533196 A JP2013533196 A JP 2013533196A JP 2014501678 A JP2014501678 A JP 2014501678A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000000779 smoke Substances 0.000 description 3
- 229910001151 AlNi Inorganic materials 0.000 description 2
- 101700004678 SLIT3 Proteins 0.000 description 2
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910018173 Al—Al Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/658—Atmosphere during thermal treatment
- C04B2235/6586—Processes characterised by the flow of gas
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/665—Local sintering, e.g. laser sintering
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/402—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Laser Beam Processing (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
a)厚さ0.7mmおよび12×18mmの寸法の平らなアルミニウム板を、厚さ0.63mmの僅かにより大きい平らなAlN基体上に置き、YAGレーザーを反応性ガスで、ならびに反応性ガスなしに(さらなる反応性ガスなしに空気で開放して)AlN基体上に垂直に転向させる。AlN基体は、上側で金メッキ処理された接点と一緒にLEDを支持する。1つのパターン(図1参照)には、長さ3mmの小さな形状のスリットがセラミック中にアルミニウム板の下方にまで入れられる。
Claims (15)
- 2つの接合相手を予定された接合場所で接合するための方法であって、一方の接合相手(1)が、セラミックからなり、かつもう一方の接合相手が、金属またはセラミックからなる上記方法において、それらの接合相手を互いに前記接合場所で接触するように配置し、そしてレーザービームを前記接合場所で接合相手の一方に向けて、レーザービームがこの接合相手を通り抜けかつ少なくとも部分的にもう一方の接合相手中に侵入するようにすることを特徴とする、上記方法。
- レーザービームを、セラミックに向けることを特徴とする、請求項1記載の方法。
- 有利に1〜5mm、特に有利に3mmの長さを有するスリット(5)がレーザービームによって入射されることを特徴とする、請求項1または2記載の方法。
- 個々のスリット(5)からなるパターン(2)は、レーザービームによって接合相手中へと入射され、全てのスリット(5)が、縦スリット(3)を形成するかまたは縦スリット(3)に対して垂直に走る横スリット(4)を形成することを特徴とする、請求項1から3までのいずれか1項に記載の方法。
- それぞれ1つの縦スリット(3)に1つの横スリット(4)が隣接して入射されることを特徴とする、請求項4記載の方法。
- 全ての縦スリット(3)は、互いに平行に走る縦列(6)で固定された間隔(8)で互いに存在し、および全ての横スリット(4)は、互いに平行に走る横列(7)で固定された間隔(9)で互いに存在し、およびそれぞれの横スリット(4)に1つの縦スリット(3)が隣接して入射されることを特徴とする、請求項4または5記載の方法。
- 一方の接合相手(1)は、セラミックの窒化アルミニウムからなり、かつもう一方の接合相手は、金属のアルミニウムからなることを特徴とする、請求項1から6までのいずれか1項に記載の方法。
- 2つの接合相手は、同一かまたは異なるセラミックからなることを特徴とする、請求項1から6までのいずれか1項に記載の方法。
- レーザービームは、静止空気、流動空気または流動する窒素からなる雰囲気中で一方の接合相手(1)に導かれることを特徴とする、請求項1から8までのいずれか1項に記載の方法。
- 2つの接合相手のためには、平らな板が使用されることを特徴とする、請求項1から9までのいずれか1項に記載の方法。
- 金属製の接合相手は、0.5〜3.0mmの厚さを有することを特徴とする、請求項10記載の方法。
- セラミック製の接合相手(1)は、0.5〜2.0mmの厚さを有する窒化アルミニウム基体であることを特徴とする、請求項10または11記載の方法。
- セラミックは、AlN基体であり、および上側で金メッキ処理された接点を有するLEDを支持することを特徴とする、請求項1から12までのいずれか1項に記載の方法。
- レーザービームを発生させるために、YAGレーザーが使用されることを特徴とする、請求項1から13までのいずれか1項に記載の方法。
- セラミック製のソケット上のLEDsまたはLED回路を金属製のケーシングと接合するための、請求項1から14までのいずれか1項に記載の方法の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102010048193.9 | 2010-10-13 | ||
DE102010048193 | 2010-10-13 | ||
PCT/EP2011/067781 WO2012049200A1 (de) | 2010-10-13 | 2011-10-12 | Verfahren zum fügen zweier fügepartner, d.h. keramik mit metall/keramik, mit einem laserstrahl |
Publications (1)
Publication Number | Publication Date |
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JP2014501678A true JP2014501678A (ja) | 2014-01-23 |
Family
ID=45418616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013533196A Pending JP2014501678A (ja) | 2010-10-13 | 2011-10-12 | 2つの接合相手、すなわち金属/セラミックを有するセラミックをレーザービームで接合するための方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20130248499A1 (ja) |
EP (1) | EP2627471B1 (ja) |
JP (1) | JP2014501678A (ja) |
KR (1) | KR20140029360A (ja) |
CN (1) | CN103153524A (ja) |
BR (1) | BR112013009010A2 (ja) |
DE (1) | DE102011084328A1 (ja) |
RU (1) | RU2013121193A (ja) |
TW (1) | TW201236793A (ja) |
WO (1) | WO2012049200A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19848179A1 (de) * | 1998-10-20 | 2000-05-18 | Horst Exner | Verfahren zum Verschweißen von Körpern und Verwendung von Laserstrahlen zum Verschweißen von Körpern |
JP2007080868A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
Family Cites Families (20)
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US4400870A (en) * | 1980-10-06 | 1983-08-30 | Texas Instruments Incorporated | Method of hermetically encapsulating a semiconductor device by laser irradiation |
FR2624041A1 (fr) * | 1987-12-02 | 1989-06-09 | Otic Fischer & Porter | Procede de soudage au moyen d'un faisceau laser, notamment applicable au soudage de pieces en verre |
US5703341A (en) * | 1993-11-23 | 1997-12-30 | Lockheed Martin Energy Systems, Inc. | Method for adhesion of metal films to ceramics |
WO1996033837A1 (de) * | 1995-04-25 | 1996-10-31 | Mdc Max Dätwyler Bleienbach Ag | Verfahren zur oberflächenvorbereitung eines werkstückes mit einem metallischen trägermaterial und werkstück mit einem metallischen trägermaterial |
FR2787737B1 (fr) * | 1998-12-23 | 2001-01-19 | Commissariat Energie Atomique | Composition de brasure, procede d'assemblage de pieces en materiaux a base d'alumine par brasage refractaire avec ladite composition de brasure, assemblage et joint refractaire ainsi obtenus |
JP4756200B2 (ja) * | 2000-09-04 | 2011-08-24 | Dowaメタルテック株式会社 | 金属セラミックス回路基板 |
US6586704B1 (en) * | 2001-05-15 | 2003-07-01 | The United States Of America As Represented By The United States Department Of Energy | Joining of materials using laser heating |
WO2002096826A2 (en) * | 2001-05-29 | 2002-12-05 | Koninklijke Philips Electronics N.V. | Metal-ceramic bond |
DE10149140A1 (de) * | 2001-10-05 | 2003-04-17 | Bosch Gmbh Robert | Verfahren zur Verbindung einer Siliziumplatte mit einer weiteren Platte |
US6945674B2 (en) * | 2002-07-16 | 2005-09-20 | Ccs, Inc. | Light irradiating unit |
JP3935037B2 (ja) * | 2002-09-30 | 2007-06-20 | Dowaホールディングス株式会社 | アルミニウム−セラミックス接合基板の製造方法 |
WO2004105142A1 (en) * | 2003-05-26 | 2004-12-02 | Matsushita Electric Works, Ltd. | Light-emitting device |
JP3871680B2 (ja) * | 2004-04-26 | 2007-01-24 | 電気化学工業株式会社 | セラミック基板、セラミック回路基板およびそれを用いた電力制御部品。 |
DE102004033933B4 (de) * | 2004-07-08 | 2009-11-05 | Electrovac Ag | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
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CN101671810B (zh) * | 2008-09-09 | 2011-06-22 | 北京有色金属研究总院 | 一种分布式熔焊实现靶材与背板连接的方法 |
CN101676060B (zh) * | 2008-09-19 | 2012-03-07 | 湖北中航精机科技股份有限公司 | 利用激光焊接车辆座椅板材的方法 |
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2011
- 2011-10-12 JP JP2013533196A patent/JP2014501678A/ja active Pending
- 2011-10-12 KR KR1020137012044A patent/KR20140029360A/ko not_active Application Discontinuation
- 2011-10-12 DE DE102011084328A patent/DE102011084328A1/de not_active Withdrawn
- 2011-10-12 US US13/878,603 patent/US20130248499A1/en not_active Abandoned
- 2011-10-12 RU RU2013121193/02A patent/RU2013121193A/ru not_active Application Discontinuation
- 2011-10-12 EP EP11770738.0A patent/EP2627471B1/de not_active Not-in-force
- 2011-10-12 BR BR112013009010A patent/BR112013009010A2/pt not_active IP Right Cessation
- 2011-10-12 TW TW100136892A patent/TW201236793A/zh unknown
- 2011-10-12 WO PCT/EP2011/067781 patent/WO2012049200A1/de active Application Filing
- 2011-10-12 CN CN2011800494237A patent/CN103153524A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19848179A1 (de) * | 1998-10-20 | 2000-05-18 | Horst Exner | Verfahren zum Verschweißen von Körpern und Verwendung von Laserstrahlen zum Verschweißen von Körpern |
JP2007080868A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
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EP2627471B1 (de) | 2015-04-01 |
KR20140029360A (ko) | 2014-03-10 |
BR112013009010A2 (pt) | 2017-10-31 |
US20130248499A1 (en) | 2013-09-26 |
TW201236793A (en) | 2012-09-16 |
CN103153524A (zh) | 2013-06-12 |
RU2013121193A (ru) | 2014-11-20 |
WO2012049200A1 (de) | 2012-04-19 |
EP2627471A1 (de) | 2013-08-21 |
DE102011084328A1 (de) | 2012-04-19 |
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