JP2014229683A - Imaging element and imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure reliability of electrical connection by the micro bumps of an imaging chip and a signal processing chip, when the imaging chip and signal processing chip expand thermally.SOLUTION: An imaging element includes an imaging chip having an image capturing region provided with a plurality of pixels, a signal processing chip laminated on the imaging chip in a region other than the image capturing region, and having a conversion circuit for converting pixel signals outputted from the plurality of pixels into digital signals, a substrate connected electrically with the signal processing chip, a support member being bonded to one point substantially in the center of a surface opposite from the surface provided with the image capturing region, and an elastic member provided between the substrate and support member, and having elasticity in a direction parallel with the upper surface of the support member.

Description

  The present invention relates to an imaging element and an imaging apparatus.

Conventionally, the imaging chip and the signal processing chip are provided so as to partially overlap in an area other than the imaging area of the imaging chip. In this case, the signal processing chip is fixed to the glass substrate on the side opposite to the imaging chip (see, for example, Patent Document 1).
Patent Document 1 Japanese Patent Application Laid-Open No. 2011-23595

  However, when the imaging chip and the signal processing chip are thermally expanded at the time of energization, the connection position between the imaging chip and the signal processing chip is changed compared to that at the time of non-energization. When the imaging chip and the signal processing chip are electrically connected by micro bumps, if the connection position between the imaging chip and the signal processing chip changes, the reliability of electrical connection between the two decreases.

  The imaging device according to the first aspect of the present invention includes an imaging chip having an imaging region provided with a plurality of pixels, and a pixel signal output from the plurality of pixels that is stacked on the imaging chip in a region other than the imaging region. A signal processing chip having a conversion circuit for converting to a signal, a substrate electrically connected to the signal processing chip, and a point at a substantially center of the surface of the imaging chip opposite to the surface provided with the imaging region; A support member to be bonded; and an elastic member provided between the substrate and the support member and having elasticity in a direction parallel to the upper surface of the support member.

  Moreover, the imaging device in the 2nd aspect of this invention is equipped with said imaging device.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a figure which shows the upper surface of the image pick-up element in 1st Embodiment. It is a figure which shows the cross section of the AA part in FIG. FIG. 3 is an enlarged view of an FPC portion in FIG. 2. It is a figure which shows the upper surface of the BB cross-section part in FIG. It is a figure which shows the upper surface of the BB cross-section part in FIG. It is a figure which shows the cross section of CC part in FIG. It is a figure which shows the cross section of the DD part in FIG. It is a figure which shows the cross section of the EE part in FIG. It is a figure which shows the cross section of the FF part in FIG. It is a figure which shows the cross section of the image pick-up element in 2nd Embodiment. It is a figure which shows the cross section of the image pick-up element in 3rd Embodiment. It is sectional drawing of the single-lens reflex camera provided with the image pick-up element in 4th Embodiment.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a diagram illustrating an upper surface of the image sensor 100 according to the first embodiment. FIG. 2 is a view showing a cross section of the AA portion in FIG. The imaging device 100 includes a fixed plate 101 as a support member, an imaging chip 201, a signal processing chip 203, an FPC 204 as a substrate, a lower support unit 208, an upper support unit 209, a frame member 301, an optical low-pass filter 401, and an optical low-pass filter. 402. The FPC 204 that is a flexible substrate is an example of a substrate connected to the signal processing chip 203. In FIG. 1, the optical low-pass filter 401 and the optical low-pass filter 402 are omitted.

  The fixed plate 101 has an imaging chip bonding portion 102 that bonds the imaging chip 201 to the fixed plate 101. The imaging chip 201 is placed on the fixed plate 101 via the imaging chip bonding part 102. In this example, the material of the fixing plate 101 is aluminum, but is not necessarily limited to a metal such as aluminum.

  The imaging chip 201 includes an imaging area 202 in which a plurality of pixels are provided in the central portion of the upper surface of the imaging chip 201. The central part is, for example, the optical axis 103. In addition, the signal processing chip 203 is stacked on the imaging chip 201 in an area other than the imaging area 202. The signal processing chip 203 includes a conversion circuit that converts pixel signals output from a plurality of pixels into digital signals. The imaging chip 201 of this example is partially overlapped and electrically connected to the signal processing chip 203 at the end thereof.

  A microlens 205 is provided on the upper surface of the imaging chip 201 in contact with the imaging region 202. Note that the center position of the imaging chip 201 may coincide with the position of the optical axis 103 of the optical system that irradiates the imaging region 202 with light.

  In the imaging chip bonding portion 102 of this example, one point at the approximate center of the surface opposite to the surface on which the imaging region 202 is provided is bonded to the fixed plate 101. By bonding and fixing one point at the center of the imaging chip 201, it is possible to prevent the imaging chip 201 from warping due to a difference in thermal expansion coefficient between the imaging chip 201 and another member.

  The imaging chip 201 is electrically connected to the signal processing chip 203 via the micro bump 206. By connecting multiple points between the imaging chip 201 and the signal processing chip 203 by the micro bumps 206, the imaging chip 201 and the signal processing chip 203 are connected by more signal lines (buses) than the conventional bumps. can do. Therefore, the bus width can be increased. Therefore, a high transmission rate from the imaging chip 201 to the signal processing chip 203 can be realized.

  The FPC 204 is electrically connected to the signal processing chip 203 via the bump 207. That is, the FPC 204 is electrically connected to the imaging chip 201 via the signal processing chip 203. The FPC 204 is provided so as to partially overlap the signal processing chip 203 in a region of the signal processing chip 203 that does not overlap the imaging chip 201. The FPC 204 serves as an electrical path for sending an electrical signal from the signal processing chip 203 to an external circuit outside the frame member 301.

  The FPC 204 is pulled out from the inside of the frame member 301 on which the imaging chip 201 is arranged to the outside of the frame member 301. The other end of the FPC 204 is electrically connected to an external circuit outside the frame member 301. The FPC 204 is fixed between the fixing plate 101 and the frame member 301 by using a rubber frame 304 as an FPC fixing member.

  The signal processing chip 203 includes at least a signal processing circuit that receives an analog signal output from the imaging chip 201 and processes the analog signal. For example, the signal processing chip 203 includes at least an AD converter that receives an analog signal output from the imaging chip 201 and converts the analog signal into a digital signal. In addition to the AD converter, the signal processing chip 203 removes noise from the read signal for reading the analog signal generated by the imaging chip, a timing control circuit for driving the read circuit, and the read signal. A removal signal circuit or the like may be included.

  The frame member 301 is provided so as to surround the imaging chip 201 and the signal processing chip 203. The frame member 301 is provided on the upper surface of the fixed plate 101 and is provided up to a position higher than the upper surfaces of the imaging chip 201 and the signal processing chip 203 in the height direction perpendicular to the upper surface of the fixed plate 101. The material of the frame member 301 is a metal, for example. The material of the frame member 301 may be a resin.

  The frame member 301 has a flange 302 that protrudes from the inner wall at a position higher than the upper surface of the imaging chip 201 or the signal processing chip 203 to the upper side of the signal processing chip 203. The collar portion 302 does not overlap the imaging chip 201 but protrudes to a position where it partially overlaps the signal processing chip 203.

  The collar portion 302 has a rectangular frame shape. An optical low-pass filter 401 is placed in contact with the incident light side of the collar portion 302. The optical low-pass filter 401 seals the opening of the rectangular frame of the collar 302.

  The frame member 301 has a boss 303. The boss 303 is formed to protrude in the direction of the fixed plate 101 from the lower surface of the frame member 301 facing the fixed plate 101. The fixed plate 101 has a recess into which the end of the boss 303 is inserted. The boss 303 passes through the FPC 204 to fix the FPC 204. The boss 303 may be provided on the upper surface of the fixed plate 101. In this case, a recess is formed on the lower surface of the frame member 301.

  A rubber frame 304 as a substrate fixing member seals between the fixing plate 101 and the frame member 301. The rubber frame 304 is provided between the frame member 301 and the FPC 204 and between the FPC 204 and the fixing plate 101, and sandwiches both surfaces of the FPC 204. The rubber frame 304 may be a gel-like member or an adhesive.

  The rubber frame 304 is provided in the frame member 301 at a position through which the FPC 204 passes. The rubber frame 304 fixes the FPC 204 to the frame member 301 by sandwiching and pressing the FPC 204 between the fixing plate 101 and the frame member 301.

  The rubber frame 304 is provided twice between the fixed plate 101 and the frame member 301. The rubber frame 304 of the present example includes an upper inner peripheral fixing member 305 and a lower inner peripheral fixing member 306 provided on the imaging chip 201 side with respect to the boss 303, and the opposite side of the imaging chip 201 with respect to the boss 303. The upper outer periphery fixing member 307 and the lower outer periphery fixing member 308 are provided. The upper inner periphery fixing member 305 and the upper outer periphery fixing member 307 are provided with the boss 303 interposed therebetween.

  The upper inner periphery fixing member 305 and the upper outer periphery fixing member 307 are provided in the groove of the frame member 301. Further, the lower inner periphery fixing member 306 and the lower outer periphery fixing member 308 are provided in the groove of the fixing plate 101. The groove of the frame member 301 is arranged over one circumference of the frame member 301. The groove of the fixed plate 101 is also arranged over the circumference on the fixed plate 101 corresponding to the groove of the frame member 301.

  The depth of the groove of the frame member 301 is different between a position where the FPC 204 passes and a position where the FPC 204 does not pass. At a position where the FPC 204 passes, the rubber frame 304 and the FPC 204 are in close contact with each other. On the other hand, at a position where the FPC 204 does not pass, the upper inner peripheral fixing member 305 and the upper outer peripheral fixing member 307, the lower inner peripheral fixing member 306, and the lower outer peripheral fixing member 308 are in close contact with each other. Therefore, depending on the thickness of the FPC 204 and the like, the depth of the groove of the frame member 301 at a position where the FPC 204 passes is shallower than the depth of the groove at a position where the FPC 204 does not pass.

  The upper inner periphery fixing member 305 is provided between the frame member 301 and the FPC 204. The lower inner periphery fixing member 306 is provided between the FPC 204 and the fixing plate 101. The upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 are provided on the imaging chip 201 side with respect to the boss 303, and fix the FPC 204 with the FPC 204 interposed therebetween. The upper outer periphery fixing member 307 is provided between the frame member 301 and the FPC 204. The lower outer periphery fixing member 308 is provided between the FPC 204 and the fixing plate 101. The upper outer periphery fixing member 307 and the lower outer periphery fixing member 308 are provided on the opposite side of the imaging chip 201 with respect to the boss 303, and fix the FPC 204 with the FPC 204 interposed therebetween.

  In this example, each rubber frame 304 is a rubber frame. When the rubber frame 304 is a rubber frame, the frame member 301 can be repeatedly attached and detached. The rubber frame 304 only needs to be in close contact between the fixed plate 101 and the frame member 301. In this example, the cross-sectional shape of the rubber frame 304 when not pressed is a circle. However, the cross-sectional shape of the rubber frame 304 under non-pressing may be an ellipse or a polygon.

  Since the FPC 204 is fixed by the boss 303 and the rubber frame 304, stress applied to the FPC 204 from the outside of the frame member 301 is blocked by the frame member 301. Therefore, the stress applied to the FPC 204 from outside the frame member 301 is not transmitted to the signal processing chip 203. For example, even when the FPC 204 is pulled outside the frame member 301, the force is not transmitted to the connection portion between the FPC 204 and the signal processing chip 203. For this reason, the connection part of the imaging chip 201 and the signal processing chip 203 can be protected.

  The FPC 204 is fixed at the signal processing chip 203 and the rubber frame 304 while being bent at room temperature. The FPC 204 of this example is fixed by a bump 207 connected to the signal processing chip 203, and an upper inner peripheral fixing member 305 and a lower inner peripheral fixing member 306, respectively. The FPC 204 is provided on both sides of the imaging chip 201 in a bent state.

  The height at which the FPC 204 is fixed to the frame member 301 in the direction perpendicular to the upper surface of the fixing plate 101 is different from the height at which the FPC 204 is fixed to the signal processing chip 203. In this example, the position where the FPC 204 and the signal processing chip 203 are fixed via the bump 207, and the position where the FPC 204 and the frame member 301 are fixed by the upper inner peripheral fixing member 305 and the lower inner peripheral fixing member 306, The height in the direction perpendicular to the upper surface of the fixed plate 101 is different. By fixing the FPC 204 at different heights, the FPC 204 is fixed in a bent shape. Therefore, even when the position of the signal processing chip 203 changes due to thermal expansion or the like, the movement of the signal processing chip 203 is not restricted. The FPC 204 may be arranged so as to maintain a bent state within the range of use of the use temperature of the image sensor 100.

  The optical low-pass filter 401 is provided in contact with the flange 302 provided so as to protrude to the imaging chip 201 side. The optical low-pass filter 401 of this example is a quartz plate having a phase plate on the incident light side. The optical low-pass filter 401 is fixed to the flange 302 via an adhesive member 404 that fixes the optical low-pass filter 401. A sealing space is formed by the fixing plate 101, the rubber frame 304, the frame member 301, the adhesive member 404 for fixing the optical low-pass filter 401, and the optical low-pass filter 401.

  The optical low-pass filter 402 is fixed to the uppermost portion of the frame member 301 via the seal portion 405. The optical low-pass filter 402 of this example is a quartz plate having an infrared cut film on the incident light side. The optical low-pass filter 402 of this example has a piezoelectric element 403 at the edge thereof. The piezoelectric element 403 vibrates the optical low-pass filter 402 to remove dust attached to the surface of the optical low-pass filter 402. A flexible material may be used for the seal portion 405 so that vibration generated by the piezoelectric element 403 is not suppressed.

  A lower support portion 208 as an elastic member is provided between the FPC 204 and the fixed plate 101. The lower support 208 in this example is provided between the fixed plate 101 and the region where the FPC 204 and the signal processing chip 203 overlap. In the present specification, the term “support” refers to supporting an object while allowing a change in position of the object. However, the supporting direction is not limited to supporting from below. In this example, the lower support portion 208 supports the signal processing chip 203 and the FPC 204 on the fixed plate 101.

  The lower support portion 208 is a support member having elasticity in a direction parallel to the upper surface of the fixed plate 101 and a direction perpendicular to the upper surface of the fixed plate 101. The lower support part 208 supports the signal processing chip 203 by elastic restoring force. For example, the lower support portion 208 is a sponge-like support member. Since the lower support 208 has elasticity, it can be flexibly deformed while supporting the signal processing chip 203 and the FPC 204. The lower support portion 208 can be flexibly deformed in the horizontal direction and the vertical direction of the fixed plate 101. Therefore, the lower support portion 208 makes the signal processing chip 203 and the FPC 204 movable in the horizontal direction and the vertical direction of the fixed plate 101. In this specification, the horizontal direction means a direction parallel to the upper surface of the fixed plate 101, and the vertical direction means a direction perpendicular to the upper surface of the fixed plate 101.

  The upper support portion 209 as an elastic member has elasticity similarly to the lower support portion 208. The upper support portion 209 is provided between the upper surface of the signal processing chip 203 and the flange portion 302. The upper support part 209 supports the signal processing chip 203 by elastic restoring force.

  On the surfaces of the lower support part 208 and the upper support part 209, a heat conducting part having a higher thermal conductivity than the lower support part 208 and the upper support part 209 is formed. For example, the lower support portion 208 is a sponge-like material. A conductive sheet is provided on the surface of the lower support portion 208. Since the thermal conductivity of the conductive sheet is better than that of the sponge-like material, the thermal conductivity is improved as compared with the case where the conductive sheet is not wound on the surface. Therefore, the lower support 208 and the upper support 209 provided with the conductive sheet can dissipate the heat generated by the signal processing chip 203 to the fixed plate 101 and the frame member 301.

  The imaging chip 201 and the signal processing chip 203 may generate heat when energized and thermally expand in the horizontal direction of the fixed plate 101. In this case, the signal processing chip 203 moves in the horizontal direction of the fixed plate 101 with the thermal expansion of the imaging chip 201 and itself.

  In this example, since the signal processing chip 203 is supported by the lower support 208 and the upper support 209, the signal processing chip 203 can move in the horizontal direction of the fixed plate 101. Therefore, the position of the signal processing chip 203 can be changed according to the thermal expansion of the imaging chip 201. Therefore, even when the imaging chip 201 and the signal processing chip 203 are thermally expanded, reliability of electrical connection between the imaging chip 201 and the signal processing chip 203 using the micro bumps 206 can be ensured.

  FIG. 3 is an enlarged view of the FPC portion in FIG. The aa portion is a portion where the FPC 204 is fixed to the signal processing chip 203. The bb portion is a portion where the FPC 204 is fixed to the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 in the frame member 301. The aa portion and the bb portion are arranged substantially in parallel. Furthermore, the height in the direction perpendicular to the fixed plate 101 differs between the aa portion and the bb portion. In this configuration, the FPC 204 is fixed in a state of being bent.

  The deflection amount of the FPC 204 is sufficiently larger than the sum of the displacement amount due to thermal deformation of the imaging chip 201 and the signal processing chip 203 and the displacement amount due to the signal processing chip 203 following the displacement of the imaging chip 201. The amount of bending refers to the difference between the length between two sides when the two sides of the FPC 204 are fixed and made flat and the linear distance between the two fixed points.

  The frame member 301 and the fixing plate 101 have a recess corresponding to the cross-sectional shape of the rubber frame 304 at a position where the rubber frame 304 is provided. In this example, the frame member 301 has a groove recessed on the lower surface facing the fixing plate 101 according to the cross-sectional shapes of the upper inner peripheral fixing member 305 and the upper outer peripheral fixing member 307. Furthermore, the fixing plate 101 has grooves that are recessed in accordance with the cross-sectional shapes of the lower inner peripheral fixing member 306 and the lower outer peripheral fixing member 308 on the upper surface facing the frame member 301. The rubber frame 304 is disposed in each groove, so that the relative position with respect to the frame member 301 and the fixed plate 101 is stabilized. Therefore, it becomes easy to fix the FPC 204 by the rubber frame 304.

  A stress relaxation member 506 and a stress relaxation member 508 are provided between the frame member 301 and the FPC 204 and between the fixed plate 101 and the FPC 204, respectively. The stress relieving member 506 and the stress relieving member 508 relieve the compressive stress from the frame member 301 and the fixed plate 101 to the FPC 204 and prevent the electric wiring in the FPC 204 from being disconnected. Further, the stress relaxation member may be provided between at least one of the frame member 301 and the FPC 204 and between the FPC 204 and the fixing plate 101.

  The micro bump 206 electrically connects the pad 210 provided on the surface of the imaging chip 201 and the pad 211 provided on the surface of the signal processing chip 203. An underfill 212 is provided between the pad 210 and the pad 211. The underfill 212 is, for example, a resin mainly composed of an epoxy resin. The underfill 212 physically bonds between the imaging chip 201 and the signal processing chip 203 and between the pad 210 and the pad 211.

  Even if the imaging chip 201 and the signal processing chip 203 are fixed with an underfill, if the stress generated when the FPC 204 is pulled is applied to the bonding portion between the imaging chip 201 and the signal processing chip 203, the imaging chip 201 And the electrical connection and reliability of the FPC 204 are reduced. However, according to the image sensor 100, since the FPC 204 is fixed by the rubber frame 304 between the fixed plate 101 and the frame member 301, the stress generated in the FPC 204 can be cut off.

  The bump 207 electrically connects the pad 213 provided on the surface of the signal processing chip 203 and the FPC 204. The bump 207 is, for example, an Au bump.

  FIG. 4 is a view showing the upper surface of the BB cross section in FIG. A direction in which the FPC 204 crosses the frame member 301 is a first direction, and a direction perpendicular to the first direction and parallel to the surface of the fixed plate 101 is a second direction.

  The FPC 204 is pulled out from the inside of the frame member 301 where the imaging chip 201 and the signal processing chip 203 are disposed, to the outside of the frame member 301 through the inside of the frame member 301.

  The FPC 204 has a convex portion 214 protruding in the second direction. The convex portion 214 is provided in a portion of the FPC 204 that passes through the inside of the frame member 301 and fits with the concave portion 309 in the second direction of the frame member 301. In the present example, the FPC 204 has a pair of convex portions 214 that protrude from the opposite sides in the second direction to the opposite sides. The pair of convex portions 214 fits with the pair of concave portions 309 of the frame member 301 in the second direction. Since the convex part 214 of the FPC 204 fits into the concave part 309 of the frame member 301, positioning inside the frame member 301 becomes easy. Further, since the pair of convex portions 214 and the pair of concave portions 309 are fitted in the second direction, the strength for fixing the FPC 204 is increased.

  The FPC 204 has a hole 215. In addition, one of the fixed plate 101 and the frame member 301 has a boss 303 that fits to either the fixed plate 101 or the frame member 301. The boss 303 passes through the hole 215. In the first direction, the length of the hole 215 is larger than the length of the boss 303. Also in the second direction, the length of the hole 215 may be larger than the length of the boss 303. That is, the hole 215 has play with respect to the boss 303. Therefore, the position of the FPC 204 can be finely adjusted with respect to the boss 303.

  A gap 500 is formed between the convex portion 214 of the FPC 204 and the concave portion 309 of the frame member 301. The gap 500 is provided between the pair of convex portions 214 of the FPC 204 and the pair of concave portions 309 of the frame member 301. In this example, the gap 500 is a first direction gap 501 that is parallel to the first direction, a second gap 502 that is provided on the imaging chip 201 side with respect to the boss 303 and is parallel to the second direction, and The second gap 504 is provided on the opposite side of the boss 303 from the imaging chip 201 side and is parallel to the second direction.

  The rubber frame 304 is a gap 500 between the convex part 214 of the FPC 204 and the concave part 309 of the frame member 301 and covers the gap 500 formed in a direction parallel to the second direction. In this example, the upper inner periphery fixing member 305 of the rubber frame 304 covers the second gap 502 that is parallel to the second direction. The upper outer peripheral fixing member 307 covers the second gap 504 that is parallel to the second direction. Similarly, the lower inner peripheral fixing member 306 of the rubber frame 304 covers the second gap 502 that is parallel to the second direction, and the lower outer peripheral fixing member 308 is the second gap 504 that is parallel to the second direction. May be covered.

  In this example, the width 503 of the second gap 502 is smaller than the width 315 of the upper inner periphery fixing member 305 of the rubber frame 304 when being pressed between the frame member 301 and the fixing plate 101. Further, the width 505 of the second gap 504 is smaller than the width 317 of the upper outer peripheral fixing member 307 of the rubber frame 304 when it is pressure-bonded between the frame member 301 and the fixing plate 101.

  The width 315 of the upper inner periphery fixing member 305 when being pressed between the frame member 301 and the fixing plate 101 is larger than the narrowest width among the widths 503 of the second gap 502. More preferably, the width 315 of the upper inner periphery fixing member 305 when being crimped between the frame member 301 and the fixing plate 101 is larger than the widest width of the widths 503 of the second gap 502.

  As described above, the second gap 502 and the second gap 504 are sealed by the rubber frame 304. Therefore, the imaging chip 201 and the signal processing chip 203 disposed inside the frame member 301 can be sealed. At that time, the rubber frame 304 fixes the FPC 204.

  The stress relaxation member 506 is provided in contact with the FPC 204. In FIG. 4, the stress relaxation member 506 provided on the frame member 301 side with respect to the FPC 204 is indicated by a dotted line. The stress relaxation member 506 has a hole 507 at a portion through which the boss 303 passes. The shape of the hole 507 of the stress relaxation member 506 may be the same as the shape of the hole 215 of the FPC 204. Further, a stress relaxation member 508 may be provided on the opposite side of the stress relaxation member 506 with respect to the FPC 204. In that case, the stress relaxation member 508 also has a hole similar to the hole 507 of the stress relaxation member 506.

  FIG. 5 is a view showing the upper surface of the BB cross section in FIG. In order to make it easy to specify the position of the cross section, the drawing is separate from FIG. 5 is a sectional view taken along the line CC in FIG. 5, a sectional view taken along the line DD, FIG. 7, a sectional view taken along the line EE, and a sectional view taken along the line FF in FIG.

  FIG. 6 is a view showing a cross section of the CC section in FIG. However, the upper inner peripheral fixing member 305, the upper outer peripheral fixing member 307, the stress relaxation member 506, and the FPC 204 under the stress relaxation member 506 are in contact with each other, and the frame member 301 is separated from the fixing plate 101 in the arrow direction. FIG.

  The frame member 301 and the fixing plate 101 have a recess 318 and a recess 319 corresponding to the thicknesses of the stress relaxation member 506 and the stress relaxation member 508, respectively, at positions where the FPC 204 passes. In the recess 318 of the frame member 301, the upper inner peripheral fixing member 305 and the upper outer peripheral fixing member 307 are in close contact with the stress relaxation member 506. Further, in the recess 319 of the fixing plate 101, the lower inner peripheral fixing member 306 and the lower outer peripheral fixing member 308 are in close contact with the stress relaxation member 508.

  In a state where the fixing plate 101 and the frame member 301 are pressure-bonded, the upper inner peripheral fixing member 305 and the upper outer peripheral fixing member 307 are deformed according to the shapes of the FPC 204 and the stress relaxation member 506. Therefore, the upper inner peripheral fixing member 305 and the upper outer peripheral fixing member 307 can be in close contact with the FPC 204 and the stress relaxation member 506.

  In this example, the frame member 301 has a boss 303 that fits into the fixed plate 101. The boss 303 passes through the hole 215 of the FPC 204, the hole 507 of the stress relaxation member 506, and the hole 509 of the stress relaxation member 508. The cross-sectional areas of the hole 215, the hole 507, and the hole 509 are larger than the cross-sectional area of the boss 303.

  FIG. 7 is a view showing a cross section taken along the line DD in FIG. The DD partial cross section is a cross-sectional view of the frame member 301 as viewed from the outside. The cross-sectional view is a cross-sectional view showing a state in which the frame member 301 is separated from the fixing plate 101 in the arrow direction while the frame member 301, the upper inner peripheral fixing member 305, the stress relaxation member 506, and the FPC 204 are kept in contact with each other. .

  FIG. 8 is a view showing a cross section of the EE portion in FIG. The cross-sectional view is a cross-sectional view of the frame member 301 viewed from the inside to the outside. The sectional view is a sectional view showing a state in which the fixing plate 101 and the frame member 301 are in close contact with the upper inner peripheral fixing member 305 and the lower inner peripheral fixing member 306 interposed therebetween.

  The upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 tightly fix the FPC 204 with the FPC 204 interposed therebetween. Further, the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 are in close contact with each other in a region where the FPC 204 is not in close contact and fixing. Therefore, the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 fix the FPC 204 and eliminate the gap between the fixing plate 101 and the frame member 301.

  FIG. 9 is a view showing a cross section of the FF portion in FIG. The cross-sectional view is a cross-sectional view showing a state in which the fixing plate 101 and the frame member 301 are in close contact with the upper inner peripheral fixing member 305 and the lower inner peripheral fixing member 306 interposed therebetween. When the fixing plate 101 and the frame member 301 are in close contact with each other, the rubber frame 304 has a portion where there is a gap 500 (particularly, the second gap 502 and the second gap 504) between the frame member 301 and the FPC 204 and no gap. The parts are different in shape. The shape of the FPC fixing member corresponding to the second gap 502 and the second gap 504 is shown in the front of the drawing, and the shape of the FPC fixing member corresponding to the portion without the gap is shown in the back of the drawing.

  A part of the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 that are visible in front of the drawing are in close contact with the stress relaxation member 506 and the stress relaxation member 508, respectively. In addition, the other parts of the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 that are visible in front of the drawing are in close contact with each other. Therefore, the inner gap between the frame member 301 and the FPC 204 and the gap between the FPC 204 and the fixing plate 101 are respectively closed by the upper inner circumference fixing member 305 and the lower inner circumference fixing member 306 that are visible in front of the drawing.

  A part of the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 visible in the back of the drawing is in close contact with the stress relaxation member 506 and the stress relaxation member 508, respectively. In addition, other portions of the upper inner periphery fixing member 305 and the lower inner periphery fixing member 306 that are visible in the back of the drawing are in close contact with the FPC 204. The state at the back of the drawing is the same as the CC cross section of FIG. The same applies to the upper outer periphery fixing member 307 and the lower outer periphery fixing member 308 that can be seen in the back of the drawing.

  Since the FPC 204 is closely fixed by the rubber frame 304, the stress applied to the FPC 204 is closely fixed between the fixing plate 101 and the frame member 301. Therefore, the stress applied to the FPC 204 from the outside of the frame member 301 is blocked between the fixed plate 101 and the frame member 301. In addition, entry of dust and the like from the outside of the frame member 301 is also blocked between the fixed plate 101 and the frame member 301.

  FIG. 10 is a diagram illustrating a cross-section of the image sensor 110 according to the second embodiment. In the cross section, the image sensor 110 is placed on a fixed plate 101 as a support member. The imaging device 110 includes an imaging chip 201, an FPC 204 as a substrate, a frame member 301, an optical low-pass filter 401, and a 402 optical low-pass filter 402. Hereinafter, differences from the first embodiment will be described.

  In this example, the imaging chip 216 has an imaging area 217 in which pixels are formed. In addition, the imaging chip 216 has a signal processing circuit 218 adjacent to the imaging region 217. That is, the imaging chip 216 is integrally formed with the imaging region 217 and the signal processing circuit 218. The signal processing circuit 218 performs the same processing as the signal processing chip 203 in the first embodiment.

  The FPC 204 is provided in an area where the imaging area 217 is not provided. That is, the FPC 204 is provided in contact with an area where the imaging chip signal processing circuit 218 is formed, which is an area where the imaging area 217 is not provided in the imaging chip 201. The FPC 204 is electrically connected to the imaging chip signal processing circuit 218 via the bump 207.

  The cc portion is a first overlapping portion between the imaging chip 216 and the FPC 204. The dd portion is a second overlapping portion between the FPC 204 and the upper inner peripheral fixing member 305 and the lower inner peripheral fixing member 306 in the frame member. Here, the cc portion and the dd portion are substantially parallel. Furthermore, the height in the direction perpendicular to the fixed plate 101 differs between the cc portion and the dd portion. In this configuration, the FPC 204 is fixed in a state of being bent.

  Since the FPC 204 is closely fixed by the rubber frame 304, the stress applied to the FPC 204 is closely fixed between the fixing plate 101 and the frame member 301. Therefore, the stress applied to the FPC 204 from the outside of the frame member 301 is blocked between the fixed plate 101 and the frame member 301. In addition, entry of dust and the like from the outside of the frame member 301 is also blocked between the fixed plate 101 and the frame member 301.

  FIG. 11 is a diagram illustrating a cross-section of the image sensor 120 according to the third embodiment. In the cross section, the imaging device 120 includes an imaging chip 201, a signal processing chip 203, an FPC 204 as a substrate, a lower support 208, an upper support 209, a frame member 301, an optical low-pass filter on the surface of a fixed plate 104 as a support member. 401 and an optical low-pass filter 402. Hereinafter, differences from the first embodiment will be described.

  The imaging element 120 is placed on the fixed plate 104 having the support protrusion 105 in the vicinity of the imaging chip 201. The signal processing chip 203 is disposed so as to partially overlap the imaging chip 201 in an area other than the imaging area 202. However, the end of the signal processing chip 203 in this example is partially overlapped with the surface of the imaging chip 201 that faces the fixed plate 104.

  The signal processing chip 203 is electrically connected to the imaging chip 201 via the micro bumps 206 and is electrically connected to the FPC 204 via the bumps 207 as in the first embodiment. However, in this example, the signal processing chip 203 is provided at a position closer to the fixed plate 104 than the imaging chip 201. Therefore, the signal processing chip 203 is supported by the lower support portion 208, while the FPC 204 is supported by the upper support portion 209.

  The electrical connection relationship between the signal processing chip 203 and the imaging chip 201 and the FPC 204 is the same as that in the first embodiment, but the positional relationship between the signal processing chip 203 and the imaging chip 201 and the FPC 204 is different from that in the first embodiment. In this example, the signal processing chip 203 is electrically connected to a surface opposite to the surface on which the imaging region 202 of the imaging chip 201 is provided. Further, the signal processing chip 203 is in contact with a lower support portion 208 as an elastic member provided between the signal processing chip 203 and the fixed plate 104. Further, the upper support portion 209 as an elastic member is provided between the FPC 204 and the flange portion 302. Note that the FPC 204 is the same in that the FPC 204 is fixed in a bent state. In this example, the first overlapping portion between the FPC 204 and the signal processing chip 203 and the second overlapping portion between the FPC 204 and the upper inner peripheral fixing member 305 and the lower inner peripheral fixing member 306 are substantially parallel and fixed. The vertical height with respect to the plate 104 is different. In this configuration, the FPC 204 is fixed in a bent state.

  FIG. 12 is a cross-sectional view of a single-lens reflex camera 600 including the image sensor 100 according to the fourth embodiment. The single-lens reflex camera 600 includes a lens unit 700 and a camera body 800. A lens unit 700 is attached to the camera body 800. The lens unit 700 includes an optical system arranged along the optical axis 103 in the lens barrel, and guides an incident subject light flux to the image sensor 100 of the camera body 800.

  The camera body 800 includes a main mirror 872 and a sub mirror 874 behind the body mount 860 coupled to the lens mount 750. The main mirror 872 is pivotally supported between an oblique position obliquely provided to the subject light beam incident from the lens unit 700 and a retracted position retracted from the subject light beam. The sub mirror 874 is pivotally supported with respect to the main mirror 872 so as to be rotatable.

  When the main mirror 872 is in the oblique position, most of the subject light beam incident through the lens unit 700 is reflected by the main mirror 872 and guided to the focus plate 852. The focus plate 852 is disposed at a position conjugate with the light receiving surface of the imaging chip 201 to visualize the subject image formed by the optical system of the lens unit 700. The subject image formed on the focus plate 852 is observed from the viewfinder 850 through the pentaprism 854 and the viewfinder optical system 856. A part of the subject light beam incident on the main mirror 872 at the oblique position passes through the half mirror area of the main mirror 872 and enters the sub mirror 874. The sub mirror 874 reflects a part of the light beam incident from the half mirror region toward the focusing optical system 880. The focusing optical system 880 guides a part of the incident light beam to the focus detection sensor 882.

  The focus plate 852, the pentaprism 854, the main mirror 872, and the sub mirror 874 are supported by a mirror box 870 as a structure. The mirror box 870 is attached to the image sensor 100. When the main mirror 872 and the sub mirror 874 are retracted to the retracted position and the front curtain and the rear curtain of the shutter unit 840 are opened, the subject luminous flux transmitted through the lens unit 700 reaches the light receiving surface of the imaging chip 201.

  A body substrate 820 and a rear display unit 834 are sequentially arranged behind the image sensor 100. A rear display unit 834 employing a liquid crystal panel or the like appears on the rear surface of the camera body 800. Electronic circuits such as a CPU 822 and an image processing ASIC 824 are mounted on the body substrate 820. The output of the imaging chip 201 is delivered to the image processing ASIC 824 via the flexible substrate.

  In the above-described embodiment, the single-lens reflex camera 600 has been described as an example of the imaging device, but the camera body 800 may be regarded as an imaging device. The imaging device is not limited to the interchangeable lens camera including the mirror unit, but may be a interchangeable lens camera that does not include the mirror unit or a lens-integrated camera regardless of the presence or absence of the mirror unit.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Image sensor, 101 Fixed plate, 102 Imaging chip adhesion part, 103 Optical axis, 104 Fixed plate, 105 Support protrusion, 110 Image sensor, 120 Image sensor, 201 Imaging chip, 202 Imaging area, 203 Signal processing chip, 204 FPC, 205 micro lens, 206 micro bump, 207 bump, 208 lower support part, 209 upper support part, 210 pad, 211 pad, 212 underfill, 213 pad, 214 convex part, 215 hole part, 216 imaging chip, 217 imaging area, 218 Signal processing circuit, 301 frame member, 302 collar, 303 boss, 304 rubber frame, 305 upper inner periphery fixing member, 306 lower inner periphery fixing member, 307 upper outer periphery fixing member, 308 lower outer periphery fixing member, 309 recess, 315 Width 3 7 width, 318 recess, 319 recess, 401 optical low pass filter, 402 optical low pass filter, 403 piezoelectric element, 404 adhesive member, 405 seal portion, 500 gap, 501 first direction gap, 502 second gap, 503 width, 504 first Double gap, 505 width, 506 Stress relief member, 507 hole, 508 Stress relief member, 509 hole, 600 single lens reflex camera, 700 lens unit, 750 lens mount, 800 camera body, 820 body substrate, 822 CPU, 824 image Processing ASIC, 834 Rear display unit, 840 Shutter unit, 850 Viewfinder, 852 Focus plate, 854 Pentaprism, 856 Viewfinder optical system, 860 Body mount, 870 Mirror box, 872 Main mirror, 874 Sub mirror, 880 focusing optical system, 882 focus detection sensor

Claims (11)

An imaging chip having an imaging region provided with a plurality of pixels;
A signal processing chip having a conversion circuit that is stacked on the imaging chip in a region other than the imaging region and converts pixel signals output from the plurality of pixels into digital signals;
A substrate electrically connected to the signal processing chip;
Of the imaging chip, a support member that is bonded to a point in the approximate center of the surface opposite to the surface on which the imaging region is provided;
An imaging device comprising: an elastic member provided between the substrate and the support member and having elasticity in a direction parallel to an upper surface of the support member. The substrate is provided to partially overlap the signal processing chip,
The imaging device according to claim 1, wherein the elastic member is provided between a region where the substrate and the signal processing chip overlap and the support member. A frame member that surrounds the imaging chip and from which the substrate is pulled out;
The imaging device according to claim 2, further comprising a substrate fixing member provided at a position where the substrate passes through the frame member and fixing the substrate to the frame member. The frame member has a flange protruding from the inner wall to the upper side of the signal processing chip,
The elastic member is also provided between the upper surface of the signal processing chip and the flange portion,
The imaging device according to claim 3, wherein each of the elastic members has elasticity in a direction perpendicular to an upper surface of the support member. The substrate is flexible;
5. The height of a position where the substrate is fixed to the frame member is different from a height of a position where the substrate is fixed to the signal processing chip in a direction perpendicular to the upper surface of the support member. Image sensor. The imaging device according to claim 5, wherein a portion of the substrate that is fixed to the frame member and a portion that is fixed to the signal processing chip are arranged in parallel. Either one of the support member and the frame member has a boss that fits to the other of the support member and the frame member,
The substrate has a hole;
The boss penetrates the hole,
The imaging device according to any one of claims 3 to 6, wherein a length of the hole is larger than a length of the boss in a first direction in which the substrate crosses the frame member.   The imaging device according to claim 3, wherein the substrate fixing member seals between the support member and the frame member. It further comprises a low-pass filter provided in contact with the collar,
The imaging device according to claim 4, wherein a sealed space is formed by the support member, the substrate fixing member, the frame member, an adhesive member that fixes the low-pass filter, and the low-pass filter. The imaging device according to any one of claims 1 to 9, wherein a heat conduction portion having a higher heat conductivity than the elastic member is formed on a surface of the elastic member.   An imaging device comprising the imaging device according to any one of claims 1 to 10.

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