JP2014216604A - Manufacturing method of resin sealing object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a resin sealing object, which is not likely to cause the quality deterioration and has a desire shape, at low costs.SOLUTION: A manufacturing method according to the invention includes: a liquid-repellent film formation process step (S1) where a liquid-repellent process mask (1) having an opening part (11) formed along an outer edge of a liquid-repellent agent application prevention part (13) for preventing a liquid-repellent agent (31) from being applied is installed on a mounting substrate (2) and the liquid-repellent agent (31) is sprayed to form a liquid-repellent film; and a resin sealing process step (S2) where a region (33), in which the liquid-repellent agent (31) is not applied, is sealed.

Description

  The present invention relates to a method for producing a resin-sealed product that uses a liquid-repellent film formed by a liquid-repellent treatment mask when a part is sealed with resin.

  In the manufacture of resin encapsulated materials such as LED light source light emitting modules using light emitting diodes (LEDs), a liquid repellent is applied to the surface of the mounting substrate made of ceramic and the like on the mounting substrate on which the components are mounted. After partially removing the liquid repellent applied to the area by plasma etching or the like, parts are placed in the area, and a resin containing phosphor (hereinafter, phosphor resin) is injected by a dispenser or the like to cure the resin. Manufacturing methods for sealing components have been used. A plurality of such LED light source light emitting modules are installed on a metal bar or the like and used as illumination for a backlight or the like.

  Patent Document 1 discloses a method for manufacturing an LED light source light emitting module (light emitting device). FIG. 16 is a flowchart showing a manufacturing method of the LED light source light emitting module according to the prior art described in Patent Document 1. As shown in FIG. 16, in the manufacturing method according to the prior art described in Patent Document 1, first, the steps of substrate installation (S101) and liquid repellent coating (S102) are performed in this order. Next, in process A (S103), the steps of mask placement (S1031), liquid repellent removal (S1032), and mask removal (S1033) are executed in this order. Next, after the process of component bonding (S104), in the process B (S105), as in the process A, the steps of mask installation (S1051), liquid repellent removal (S1052), and mask removal (S1053) are performed again. Run in order. Next, the steps of resin sealing (S106) and liquid repellent removal (S107) are executed in this order. Below, the manufacturing method which concerns on such a prior art is demonstrated in detail.

  FIG. 17 is a diagram illustrating a state of the mounting substrate 2 in the manufacturing method of the LED light source light emitting module according to the related art illustrated in FIG. 16, and (a) illustrates the state of the mounting substrate 2 in the substrate installation (S101) process. 4B shows a state of the mounting substrate 2 in the liquid repellent coating (S102) step. As shown in FIG. 17A, the mounting board 2 is placed on a fixed base or the like in the board placement (S101) step. Then, as shown in FIG. 17B, in the liquid repellent application (S102) step, the liquid repellent 31 is applied to the entire upper surface 2a of the mounting substrate 2 to form a liquid repellent film.

  18 is a diagram showing a mask installation (S1031) step in the method of manufacturing the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 18, an etching mask 101 is set on the surface of the mounting substrate 2 on which a liquid repellent film is formed by applying a liquid repellent.

  FIG. 19 is a view showing a liquid repellent removal (S1032) step in the manufacturing method of the LED light source light emitting module according to the prior art shown in FIG. 16, and (a) shows a state before the liquid repellent 31 is removed. (B) shows a state after the liquid repellent 31 is removed. As shown in FIG. 19A, an opening is provided in the etching mask 101, and an Au wire 2nd side terminal 43 is provided on the surface of the mounting substrate 2 located in the opening, A liquid repellent 31 is applied. Then, as shown in FIG. 19B, when the liquid repellent 31 is removed, the upper surface 2a of the mounting substrate 2 is exposed. FIG. 20 is a cross-sectional view showing removal of the liquid repellent 31 by plasma etching in the manufacturing method of the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 20, a liquid repellent film made of a liquid repellent 31 is formed on the surface of the mounting substrate 2, and an etching mask 101 is further provided on the liquid repellent film. FIG. 20 shows a cross section of the opening provided in the etching mask 101. As shown in FIG. 20, the liquid repellent applied on the surface of the mounting substrate 2 located in the opening is removed. Specifically, plasma treatment (for example, argon plasma) is used, and by causing the ions P to collide with the liquid repellent film, as shown by the liquid repellent 31a, atoms or molecules of the liquid repellent 31 jump out to the outside. go. By repeating this process, the liquid repellent 31 applied on the surface of the mounting substrate 2 other than the portion masked by the etching mask 101 is removed.

  FIG. 21 is a diagram showing a mask removal (S1033) and component bonding (S104) process in the method of manufacturing the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 21, the etching mask 101 shown in FIG. 19 is removed from the mounting substrate 2. Then, the components of the LED light source light emitting module 106 are bonded onto the surface of the mounting substrate 2 from which the liquid repellent 31 has been removed in the liquid repellent removal (S1032) step. FIG. 22 is an enlarged view of a portion indicated by a broken line 20 in FIG. As shown in FIG. 22, the LED chip 41 is installed on the surface 2a of the mounting substrate 2 from which the liquid repellent is removed, and the two LED chips 41 are connected to each other by Au wires 42. The Au wire 2nd side terminal is connected by the Au wire 42. When the components of the LED light source module 106 are bonded, the residual liquid repellent 31b that cannot be removed by plasma etching may come out due to heat curing of the resin for die bonding or heating during wire bonding. .

  FIG. 23 is a diagram showing a mask installation (S1051) and lyophobic agent removal (S1052) process in the manufacturing method of the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 23, the etching mask 101 is again placed on the surface of the mounting substrate 2 in the same manner as the mask placement (S1031) step. Then, similar to the liquid repellent removal (S1032) step, the exposed liquid repellent 31b is removed again by plasma etching.

  FIG. 24 is a diagram showing a mask removal (S1053) step in the method of manufacturing the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 24, the etching mask 101 is removed again as in the mask removal (S1033) step. In this manner, a region where the liquid repellent 31 is not applied is formed in the region of the surface 2a of the mounting substrate 2 at a position corresponding to the opening provided in the etching mask 101.

  FIG. 25 is a diagram showing a resin sealing (S106) step in the method of manufacturing the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 25, a liquid phosphor resin 51 is injected by a dispenser 5 into a region of the surface 2a of the mounting substrate 2 where the liquid repellent 31 is not applied. Here, the resin used for the phosphor resin is, for example, a silicone-based resin. FIG. 26 is a view showing a BB ′ cross section of FIG. 25. As shown in FIG. 26, the phosphor resin 51 is made liquid-repellent by the liquid repellent film made of the liquid repellent 31, and the phosphor resin 51 becomes a substantially hemispherical shape or a substantially semispherical shape due to the surface tension. Then, by curing the phosphor resin 51, the LED light source light emitting module 106 in which components (LED chip 41, Au wire 42, etc.) bonded on the surface of the mounting substrate 2 are sealed with the phosphor resin 51 is manufactured. .

  FIG. 27 is a view showing a liquid repellent removal (S107) step in the method of manufacturing the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 27, the liquid repellent 31 is completely removed by plasma etching again, as in the liquid repellent removal (S1032) step.

  FIG. 28 is a diagram showing a secondary molding process in the method of manufacturing the LED light source light emitting module according to the prior art shown in FIG. As shown in FIG. 28, similarly to the resin sealing (S106) step, a secondary mold for further sealing with a high transmittance transparent resin 71 so as to cover all the LED light source light emitting modules 106 with a dispenser or the like is performed. In this secondary mold, for example, a high transmittance transparent resin 71 is formed in a lens shape by compression molding or transfer molding using a mold. Thus, it manufactures in the state with which the LED light source light emission module 107 after several secondary molding was connected.

  FIG. 29 is a diagram showing the LED light source light emitting module 107 after the secondary molding according to the prior art. As shown in FIG. 29, the mounting substrate 2 shown in FIG. 28 is divided, and the LED light source light emitting module 107 after each secondary molding is completed.

  Patent Document 2 discloses a method of manufacturing an LED light source light emitting module (LED light source) that forms an oil-repellent film (liquid repellent film) using screen printing.

JP 2012-49229 A (published March 8, 2012) JP 10-144963 A (published May 29, 1998)

  However, in the prior art disclosed in Patent Document 1, the liquid repellent removal step (S1032, S1052, S107) is required three times as shown in FIG. There is. In addition, as shown in FIG. 22, due to the heat treatment at the time of component adhesion, the residual liquid repellent 31b that could not be removed by plasma etching may come out. That is, in the method of forming a liquid repellent film using an etching mask, the liquid repellent film is formed due to the etching processing time, the thickness of the liquid repellent film, the surface condition and surface material of the substrate on which the liquid repellent film is formed. There is a concern that the liquid repellent contained in the liquid film cannot be completely removed, resulting in deterioration of the quality of the resin encapsulated material. In addition, Patent Document 1 does not disclose a configuration for making the film thickness of the liquid-repellent film uniform, and a liquid-repellent film having a desired shape is formed to produce a resin-sealed product having a desired shape. Difficult to do.

  In the prior art disclosed in Patent Document 2, since the liquid repellent is applied by screen printing to form the liquid repellent film, it is difficult to control the film thickness of the liquid repellent film, and the film thickness tends to increase. Yes, when the viscosity of the liquid repellent is low, the liquid repellent spreads larger than the shape of a mask used for screen printing such as a mesh plate, and it becomes difficult to form a liquid repellent film having a desired shape. There is a problem that it becomes impossible to form a sealed resin product of the shape.

  In view of the above problems, an object of the present invention is to manufacture a resin-encapsulated article having a desired shape that is free from the risk of quality deterioration caused by a residue of a liquid repellent at a low cost.

  In order to solve the above-described problem, a method for manufacturing a resin-sealed product according to an aspect of the present invention includes a liquid repellent application preventing unit that prevents a liquid repellent from being applied to a region where components on a board are installed. And a liquid repellent treatment mask having an opening formed along the outer edge of the liquid repellent application preventing portion is placed on the substrate, and the liquid repellent treatment spray is sprayed on the liquid repellent treatment mask to dispose the liquid repellent on the substrate. A liquid repellent film forming process for forming a liquid repellent film, and a resin in which the part is placed in a region where the liquid repellent is not applied by the liquid repellent application preventing portion in the liquid repellent film forming process and the resin is sealed with a resin And a sealing process.

  According to one embodiment of the present invention, there is an effect that it is possible to manufacture a resin-sealed product having a desired shape without concern about quality deterioration caused by a residue of a liquid repellent at a low cost.

It is a figure which shows the manufacturing method and liquid repellent treatment mask of the LED light source light emitting module which concern on Embodiment 1, Comprising: (a) shows the flowchart of the manufacturing method using a liquid repellent treatment mask, (b) is (a). It is a figure which shows what kind of member is installed on a mounting board | substrate before a LED light source light emitting module is manufactured in the manufacturing method shown in FIG. It is a flowchart which shows a manufacturing method when the liquid repellent removal process becomes unnecessary in the manufacturing method shown to (a) of FIG. It is a top view which shows the liquid repellent process mask utilized with the manufacturing method shown to (a) of FIG. It is the figure which expanded the principal part of the liquid repellent process mask shown in FIG. It is a figure which shows the shape of the opening part in the AA 'cross section of the principal part of the liquid repellent treatment mask shown in FIG. 4, (a) has shown the case where the cross-sectional shape of an opening part is a square shape, b) shows the case where the cross-sectional shape of the opening is a tapered shape (trapezoidal shape). FIG. 6 is a view showing a gap between the liquid repellent films formed by the liquid repellent treatment mask shown in FIG. 5, and (a) shows a case where the sectional shape of the opening as shown in FIG. The gap of the liquid repellent film is shown, and FIG. 5B shows the gap of the liquid repellent film when the opening has a tapered cross section as shown in FIG. It is a figure which shows the board | substrate installation and mask installation process in the manufacturing method of the LED light source light emitting module shown to (a) of FIG. It is a figure which shows the liquid repellent application | coating process in the manufacturing method of the LED light source light emitting module shown to (a) of FIG. It is a figure which shows the mask removal process in the manufacturing method of the LED light source light emitting module shown to (a) of FIG. It is the figure which expanded the principal part of the liquid-repellent film shown in FIG. It is a figure which shows the components adhesion | attachment process in the manufacturing method of the LED light source light emitting module shown to (a) of FIG. It is a figure which shows the resin sealing process in the manufacturing method of the LED light source light emitting module shown to (a) of FIG. It is a figure which shows the structure of the principal part of the liquid repellent process mask which concerns on Embodiment 2. FIG. It is a figure which shows the other structure of the principal part of the liquid repellent process mask which concerns on Embodiment 2. FIG. It is a figure which shows the other structure of the principal part of the liquid repellent process mask which concerns on Embodiment 2. FIG. It is a flowchart which shows the manufacturing method of the LED light source light emission module which concerns on a prior art. It is a figure which shows the state of the mounting substrate in the manufacturing method of the LED light source light emitting module concerning a prior art, (a) has shown the state of the mounting substrate in a board | substrate installation process, (b) is a liquid repellent agent application process. This shows the state of the mounting board. It is a figure which shows the mask installation process in the manufacturing method of the LED light source light emission module which concerns on a prior art. It is a figure which shows the liquid repellent removal process in the manufacturing method of the LED light source light emitting module which concerns on a prior art, Comprising: (a) has shown the state before removing a liquid repellent, (b) after removing a liquid repellent Shows the state. It is sectional drawing which shows the removal of the liquid repellent by plasma etching in the manufacturing method of the LED light source light emitting module which concerns on a prior art. It is a figure which shows the mask removal and component adhesion process in the manufacturing method of the LED light source light emitting module concerning a prior art. It is the figure which expanded the site | part shown with the broken line of FIG. It is a figure which shows the mask installation and liquid repellent removal process in the manufacturing method of the LED light source light emitting module concerning a prior art. It is a figure which shows the mask removal process in the manufacturing method of the LED light source light emitting module which concerns on a prior art. It is a figure which shows the resin sealing process in the manufacturing method of the LED light source light emitting module which concerns on a prior art. It is a figure which shows the BB 'cross section of FIG. It is a figure which shows the liquid repellent removal process in the manufacturing method of the LED light source light emitting module which concerns on a prior art. It is a figure which shows the secondary mold process in the manufacturing method of the LED light source light emitting module which concerns on a prior art. It is a figure which shows the LED light source light emission module after the secondary molding which concerns on a prior art.

  Hereinafter, embodiments of the present invention will be described in detail.

Embodiment 1
One embodiment of the present invention will be described below with reference to FIGS.

<Method for Manufacturing LED Light Source Module 6 and Method for Forming Liquid Repellent Film>
FIG. 1 is a view showing a manufacturing method of a light emitting diode (LED) light source light emitting module (resin encapsulated material) 6 and a liquid repellent treatment mask 1 according to the present embodiment, and FIG. The flowchart of the manufacturing method using the process mask 1 is shown, (b) is a manufacturing method shown to (a), and what member is installed on the mounting substrate 2 before the LED light source light emitting module 6 is manufactured. It is a figure which shows how to go. As shown in FIGS. 1A and 1B, the manufacturing method is a region where components (LED chip 41, Au wire 42, etc.) on the mounting substrate (substrate) 2 are installed (adhered). A liquid repellent treatment mask 1 having an opening 11 provided along the outer edge of the liquid repellent application preventing portion 13 and the liquid repellent application preventing portion 13 for preventing the liquid repellent 31 from being applied to the surface is disposed on the mounting substrate 2. A liquid repellent film forming treatment step S1 for applying a liquid repellent agent 31 to the liquid repellent treatment mask 1 to form a liquid repellent film containing the liquid repellent agent 31 on the mounting substrate 2, and a liquid repellent coating application preventing step in the liquid repellent film forming treatment step S1. A resin seal in which the part is placed in a region 33 where the liquid repellent 31 is not applied (hereinafter referred to as a liquid repellent non-applied region) 33 and sealed with a resin containing phosphor (hereinafter referred to as phosphor resin (resin)) 51. Stop processing step S2. With the above configuration, it is possible to manufacture a resin-sealed product having a desired shape without concern about quality deterioration due to the residue of the liquid repellent 31.

  Specifically, in the liquid repellent film forming process S1, the steps of substrate installation (S11), mask installation (S12), liquid repellent application (S13), and mask removal (S14) are performed in this order, In addition, in the resin sealing treatment step S2, the steps of component adhesion (S15), resin sealing (S16), and liquid repellent removal (S17) are executed in this order.

  FIG. 2 is a flowchart showing the manufacturing method when the liquid repellent removal (S17) step is not necessary in the manufacturing method shown in FIG. As will be described later, when the width M of the liquid repellent film is shorter than a predetermined width, the step of removing the liquid repellent (S17) is omitted in the manufacturing method shown in FIG. Can do. Thereby, it is possible to manufacture a resin-sealed product having a desired shape with no concern about quality deterioration caused by the residue of the liquid repellent 31 at a lower cost.

[Liquid repellent treatment mask 1]
FIG. 3 is a plan view showing a liquid repellent treatment mask 1 used in the manufacturing method shown in FIG. As shown in FIG. 3, the liquid repellent treatment mask 1 has an opening 11. Here, the liquid repellent treatment mask 1 may include a plurality of sets of the liquid repellent application preventing portion 13 and the opening 11. According to the said structure, the some LED light source light emission module 6 can be manufactured at once.

  FIG. 4 is an enlarged view of a main part 10 of the liquid repellent treatment mask 1 shown in FIG. As shown in FIG. 4, the liquid repellent treatment mask 1 includes a liquid repellent application preventing portion 13 that prevents the liquid repellent 31 from being applied to a region 33 where components on the mounting substrate 2 are placed. Here, the opening portion 11 is provided along the outer edge of the liquid repellent application preventing portion 13. Further, the liquid repellent treatment mask 1 is connected to the liquid repellent application preventing portion 13 and a portion of the liquid repellent treatment mask 1 excluding the liquid repellent application preventing portion 13 and the opening 11. A suspension part (fixing part) 12 for fixing the position of the liquid application preventing part 13 is further provided.

  According to the above configuration, the liquid repellent application preventing portion 13 is integrated with the liquid repellent treatment mask 1 by the hanging portion 12, and the liquid repellent treatment is performed when the liquid repellent treatment mask 1 is installed on the mounting substrate 2 or removed from the mounting substrate 2. Apart from the mask 1, it is not necessary to install or remove the liquid repellent application preventing portion 13 on the mounting substrate 2, and the process of installing or removing the liquid repellent treatment mask 1 is simplified in the manufacture of the LED light source light emitting module 6. Can be

  In FIG. 4, the liquid repellent treatment mask 1 includes three (a plurality) suspension portions 12, but is not limited to this configuration, and the liquid repellent application preventing portion 13 is connected to the liquid repellent treatment mask 1. If they can be integrated, only one or two suspension parts 12 may be provided, or four or more suspension parts 12 may be provided. The liquid repellent treatment mask 1 includes a plurality of hanging portions 12, whereby the liquid repellent application preventing portion 13 can be more strongly integrated with the liquid repellent treatment mask 1. Further, the liquid repellent application preventing portion 13 may be circular or elliptical. According to the said structure, the LED light source light emitting module 6 whose bottom face shape is circular or elliptical can be manufactured.

  By the way, according to the shape of the suspension part 12, the area | region on the mounting substrate 2 to which the liquid repellent 31 which connects the liquid repellent non-application area | region 33 and the area | region on the mounting substrate 2 other than the liquid repellent non-application area | region 33 is not apply | coated (Hereinafter, the suspension portion-compatible liquid repellent non-application region) 32 (see FIG. 1B) may occur. When the phosphor resin 51 is injected into the liquid repellent non-application area 33, the phosphor resin 51 may flow out from the liquid repellent non-application area 33 through the suspension-compatible liquid repellent non-application area 32.

  Here, the suspension part 12 may have a linear shape with a width W of 30 μm or more and 50 μm or less. When the width X of the suspension portion corresponding liquid repellent non-application region 32 is narrow according to the shape of the suspension portion 12, the flow output acting on the phosphor resin 51 injected into the liquid repellent non-application region 33, and the phosphor resin The surface tension acting on 51 is balanced, and the phosphor resin 51 does not flow out from the liquid repellent non-application area 33 through the suspension-compatible liquid repellent non-application area 32.

  According to the above configuration, by making the width W of the suspending portion 12 into a linear shape of 30 μm or more, the suspending portion 12 can be accurately processed into a desired shape, and the liquid repellent application preventing portion 13 is stronger than the liquid repellent treatment mask 1. Can be integrated. Moreover, by making the width of the hanging portion 12 into a linear shape of 50 μm or less, the width X of the hanging portion corresponding liquid repellent non-application region 32 becomes 50 μm or less, and the surface tension acting on the phosphor resin 51 is the phosphor resin 51. It becomes stronger than the flow output acting on the. Thereby, the outflow of the resin from the liquid repellent non-application area 33 through the suspension portion corresponding liquid repellent non-application area 32 can be suppressed.

  FIG. 5 is a diagram showing the shape of the opening 11 in the AA ′ cross section of the main part 10 of the liquid repellent treatment mask 1 shown in FIG. 4, and FIG. 5A is a cross-sectional shape of the opening 11 having a square shape. A case is shown, and (b) shows a case where the cross-sectional shape of the opening 11 is a tapered shape (trapezoidal shape). As shown in FIG. 5A, the opening 11 penetrates between the upper surface 1a and the lower surface 1b of the liquid repellent treatment mask 1, and the length of the cross-sectional shape of the opening 11 is liquid repellent treatment. The mask 1 has a quadrangular shape including a side having a thickness t and a side having a length corresponding to the width L of the opening 11.

  Here, as shown in FIG. 5B, the opening 11 may have a tapered shape that becomes narrower on the mounting substrate 2 side. That is, the cross-sectional shape of the opening 11 may be a width La on the upper surface 1a of the liquid repellent treatment mask 1 and a width Lb narrower than the width La on the lower surface 1b.

  According to the above configuration, the liquid repellent 31 applied to the opening 11 from the side opposite to the mounting substrate 2 (the upper surface 1a side of the liquid repellent treatment mask 1) is the mounting substrate 2 side (the lower surface 1b side of the liquid repellent treatment mask 1). ) And a liquid repellent film in which the gap between the liquid repellents 31 is smaller or absent compared to other shapes can be formed. The reason for this will be described below.

  FIG. 6 is a view showing a gap between the liquid repellent films formed by the liquid repellent treatment mask 1 shown in FIG. 5, and FIG. 6A shows the cross-sectional shape of the opening 11 as shown in FIG. The gap Ca of the liquid repellent film in the case of a square shape is shown, and (b) shows the gap Cb of the liquid repellent film in the case where the opening 11 has a tapered cross section as shown in FIG. ing. As shown in FIG. 5A, when the opening 11 has a quadrangular cross-sectional shape, the liquid repellent 31 sprayed from the spray 3 and applied to the opening 11 from the side opposite to the mounting substrate 2 is In some cases, a liquid repellent film is formed on the mounting substrate 2 side, and a gap Ca is left between the liquid repellent film and the liquid repellent treatment mask 1. In this case, the planar shape of the opening 11 does not match the shape of the liquid repellent film, and it becomes difficult to form the liquid repellent film in a desired shape. However, as shown in FIG. 5B, when the cross-sectional shape of the opening 11 is tapered, the liquid repellent sprayed from the spray 3 and applied to the opening 11 from the side opposite to the mounting substrate 2. 31 is accumulated on the mounting substrate 2 side by a taper shape, forms a liquid repellent film on the mounting substrate 2 side, and the gap Cb between the liquid repellent film and the liquid repellent treatment mask 1 is smaller than the gap Ca. Or it can be absent.

  Further, the liquid repellent treatment mask 1 may be made of a metal, and the opening 11 may be formed using laser or etching. According to the above configuration, the liquid repellent treatment mask 1 having the opening 11 precisely processed into a desired shape is obtained.

  Below, each manufacturing process (step) in the manufacturing method of the LED light source light emitting module 6 using the above-mentioned liquid repellent treatment mask 1 is demonstrated in detail.

[Substrate Installation (S11) and Mask Installation (S12) Process]
FIG. 7 is a diagram showing a substrate installation (S11) and mask installation (S12) step in the method of manufacturing the LED light source light emitting module 6 shown in FIG. As shown in FIG. 7, the mounting substrate 2 is placed on a fixed base or the like in the substrate installation (S11) step, and the liquid repellent treatment mask 1 is placed on the surface of the mounting substrate 2 in the mask installation (S12) step. ing. Here, the liquid repellent treatment mask 1 is a positioning hole which is a hole for determining the position so as to coincide with the positioning hole 25 when it is installed on the mounting substrate 2 having the positioning hole (reference hole) 25 serving as a positioning reference. 15 may be further included. Here, the positioning hole 15 is installed, for example, at the center of the four sides of the liquid repellent treatment mask 1. According to the above configuration, the liquid repellent treatment mask 1 can be placed at an accurate position on the mounting substrate 2.

[Liquid repellent coating (S13) step]
FIG. 8 is a diagram showing a liquid repellent coating (S13) step in the method of manufacturing the LED light source light emitting module 6 shown in FIG. As shown in FIG. 8, the application of the liquid repellent by the spray method is performed. The liquid repellent 31 is sprayed from the spray 3 installed at a certain height, and the spray 3 is moved to move the spray position in the direction of the arrow. Thus, the liquid repellent 31 is applied to the entire surface of the mounting substrate 2 from the side where the liquid repellent treatment mask 1 is installed.

[Mask Removal (S14) Step]
FIG. 9 is a diagram showing a mask removal (S14) step in the manufacturing method of the LED light source light emitting module 6 shown in FIG. As shown in FIG. 9, a liquid repellent 31 is applied in accordance with the shape of the opening 11 of the liquid repellent treatment mask 1 to form a liquid repellent film. FIG. 10 is an enlarged view of the main part 30 of the liquid repellent film shown in FIG. As shown in FIG. 10, a liquid repellent film including the liquid repellent 31 and a suspension-compatible liquid repellent non-application region 32 are formed on the outer edge of the liquid repellent non-application region 33. In FIG. 10, three suspension-supporting liquid repellent non-application areas 32 are formed on the surface of the mounting substrate 2, but the present invention is not limited to this configuration, and corresponds to the number of suspension parts 12. Then, only one or two suspension-responding liquid repellent non-application regions 32 may be formed, or four or more may be formed.

[Part bonding (S15) process]
FIG. 11 is a diagram showing a component bonding (S15) step in the method of manufacturing the LED light source light emitting module 6 shown in FIG. As shown in FIG. 11, the components of the LED light source light emitting module 6 are bonded (installed) to the liquid repellent non-application area 33 (see FIG. 10). Here, in the method of forming the liquid repellent film using the etching mask 101 according to the prior art as shown in FIG. 21, the etching processing time, the thickness of the liquid repellent film, and the mounting for forming the liquid repellent film are performed. Due to the surface condition and surface material of the substrate 2, the liquid repellent 31 contained in the liquid repellent film may not be completely removed. When the component is installed, heat may be applied to the mounting substrate 2, and the liquid repellent 31 b (see FIG. 22) that cannot be removed by the heat is raised on the component mounting portion on the mounting substrate 2. As a result, parts may not be installed. However, in the method of forming the liquid repellent film using the liquid repellent treatment mask 1, it is not necessary to remove the liquid repellent film for processing the liquid repellent film into a desired shape. The liquid repellent 31 does not come out. Therefore, in manufacturing the LED light source light emitting module 6, there is no fear of quality deterioration of the LED light source light emitting module 6 due to the residue of the liquid repellent 31.

  Further, conventionally, after a liquid repellent 31 is applied to the mounting substrate 2 to form a liquid repellent film, an etching mask is placed on the mounting substrate 2, and the portion of the liquid repellent film corresponding to the shape of the opening provided in the etching mask Was removed by plasma etching, and the liquid repellent film was processed into a desired shape. However, after the liquid repellent treatment mask 1 is placed on the mounting substrate 2, the liquid repellent film is formed through the opening 11 provided in the liquid repellent treatment mask 1, thereby processing the liquid repellent film into a desired shape. In addition, it is not necessary to partially remove the liquid repellent film by plasma etching or the like. Therefore, the LED light source light emitting module 6 can be manufactured at low cost.

[Resin sealing (S16) step]
FIG. 12 is a diagram showing a resin sealing (S16) step in the method of manufacturing the LED light source light emitting module 6 shown in FIG. As shown in FIG. 12, the LED light source light emitting module 6 having a shape corresponding to the shape of the liquid repellent application preventing portion 13 is manufactured by sealing the component bonded in the component bonding (S15) step with the phosphor resin 51. it can. And the LED light source light emitting module 6 of a desired shape can be manufactured by processing the liquid repellent application preventing part 13 into a desired shape. Here, in the liquid repellent mask 1, the opening 11 may have a width L or a width Lb (see FIG. 5A and FIG. 5B) of 30 μm or more and 50 μm or less.

  Here, when the width M of the liquid repellent film is wide, a secondary molded product (resin-sealed product) in which the LED light source light emitting module 6 is further sealed with another resin (for example, high transmittance transparent resin) is manufactured. In this case, if the liquid repellent film is not removed, the resin is repelled by the liquid repellent film, and a secondary mold product having a desired shape may not be manufactured. The width M of the liquid repellent film is substantially the same as the width of the opening 11.

  According to the above configuration, by setting the width of the opening 11 to 30 μm or more, the opening 11 can be accurately processed into a desired shape, and a liquid repellent film having a desired shape can be formed. In addition, by setting the width of the opening 11 to 50 μm or less, the liquid repellency of the resin by the liquid repellent film can be suppressed, and a secondary molded product having a desired shape can be manufactured. In other words, the secondary mold product can be manufactured by sealing the resin sealing material with another resin without removing the liquid repellent film.

<Effect of this embodiment>
With the liquid repellent treatment mask 1 and the LED light source light emitting module 6 manufacturing method according to the present embodiment, the LED light source light emitting module 6 having a desired shape without concern about quality deterioration caused by the residue of the liquid repellent 31 is manufactured at low cost. Can do.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIGS. For convenience of explanation, members having the same functions as those described in the embodiment are given the same reference numerals, and descriptions thereof are omitted.

<Other structures and effects of the liquid repellent treatment mask>
FIG. 13 is a diagram showing a configuration of a main part 10a of the liquid repellent treatment mask according to the present embodiment. As shown in FIG. 13, the liquid repellent treatment mask according to this embodiment is different from the liquid repellent treatment mask 1 in that it has a main part 10 a instead of the main part 10 shown in FIG. 4. Specifically, the main part 10 a has a hanging part (fixed part) 12 a, and the hanging part 12 a has a linear shape having the same length as the shortest width Lmin of the opening 11 of the liquid repellent treatment mask 1. ing.

  For example, when the width Wa of the hanging portion 12a is 50 μm or less, the width X (see FIG. 10) of the hanging portion corresponding liquid repellent non-application region 32 becomes 50 μm or less, and the surface tension acting on the phosphor resin 51 is fluorescent. When it becomes stronger than the flow output acting on the body resin 51, the length of the hanging portion 12a can be made the same length as the width Lmin.

  FIG. 14 is a diagram showing a configuration of a main part 10b of the liquid repellent treatment mask according to the present embodiment. As shown in FIG. 14, the liquid repellent treatment mask according to this embodiment is different from the liquid repellent treatment mask 1 in that it has a main part 10 b instead of the main part 10 shown in FIG. 4. Specifically, the main part 10 b has a hanging part (fixed part) 12 b, and the hanging part 12 b is a linear shape having a length N that is longer than the shortest width Lmin of the opening 11 of the liquid repellent treatment mask 1. It has become.

  According to the above configuration, since the shape of the hanging portion corresponding liquid repellent non-application region 32 is a linear shape having a length N that is longer than the shortest width Lmin of the opening 11, the phosphor resin is not added to the liquid repellent non-application region 33. Compared with the case where the length of the hanging part corresponding liquid repellent non-application area 32 is the shortest width Lmin of the opening 11 when the 51 is injected, the liquid repellent non-application through the hanging part corresponding liquid repellent non-application area 32 is smaller. The outflow of the phosphor resin 51 from the application region 33 can be suppressed.

  FIG. 15 is a diagram showing a configuration of a main part 10c of the liquid repellent treatment mask according to the present embodiment. As shown in FIG. 15, the liquid repellent treatment mask according to this embodiment is different from the liquid repellent treatment mask 1 in that it has a main part 10 c instead of the main part 10 shown in FIG. 4. Specifically, the main part 10c has a suspension part (fixed part) 12c, and each suspension part 12c is composed of a plurality of (two) bent linear suspension parts. A square region is formed between the linear suspension portions constituting the suspension portion 12c.

  According to the above configuration, the liquid repellent application preventing portion 13 can be more strongly integrated with the liquid repellent treatment mask by reinforcing the suspension portion 12c with a plurality of line shapes.

[Summary]
In the manufacturing method of the resin encapsulated material (LED light source light emitting module 6) according to aspect 1 of the present invention, components (LED chip 41, Au wire 42, Au wire 2nd side terminal 43) on the substrate (mounting substrate 2) are installed. The liquid repellent treatment mask 1 having the liquid repellent application preventing portion 13 for preventing the liquid repellent 31 from being applied to the region to be applied and the opening 11 formed along the outer edge of the liquid repellent application preventing portion is formed on the substrate. And a liquid repellent film forming treatment step S1 for spraying the liquid repellent agent 31 on the liquid repellent treatment mask to form a liquid repellent film containing the liquid repellent agent on the substrate, and the liquid repellent film forming treatment step. And a resin sealing treatment step S2 in which the above components are placed in a region where the liquid repellent is not applied by the liquid application preventing portion (liquid repellent non-applied region 33) and sealed with a resin (phosphor resin 51). Here, “the liquid repellent was not applied by the liquid repellent application preventing portion” means that the liquid repellent film was not formed by spraying the liquid repellent.

  According to the above configuration, the liquid repellent film corresponding to the shape of the opening is formed so as to surround a region where the liquid repellent is not applied (sprayed) by the liquid repellent application preventing portion (hereinafter referred to as a liquid repellent non-application region). The The resin injected into the liquid repellent non-applied area remains in the area by being repelled by the liquid repellent film. Therefore, a resin-sealed product having a shape corresponding to the shape of the liquid repellent application preventing portion can be manufactured by installing a part in the liquid repellent non-application area and sealing with resin. And the resin-sealing thing of a desired shape can be manufactured by processing a liquid repellent application prevention part into a desired shape.

  Conventionally, after applying a liquid repellent to the substrate to form a liquid repellent film, an etching mask is placed on the substrate, and the portion of the liquid repellent film corresponding to the shape of the opening provided in the etching mask is removed by plasma etching. The liquid repellent film is processed into a desired shape. However, after a liquid repellent treatment mask is placed on the substrate, a liquid repellent film is formed through an opening provided in the liquid repellent treatment mask, so that the liquid repellent film is processed into a desired shape, such as plasma etching. This eliminates the need to partially remove the liquid repellent film. Therefore, the resin encapsulated material can be manufactured at a low cost.

  Further, in the conventional method of forming a liquid repellent film using an etching mask, it is caused by the etching processing time, the thickness of the liquid repellent film, the surface condition and surface material of the substrate on which the liquid repellent film is formed. The liquid repellent contained in the liquid repellent film may not be completely removed. When installing components, heat may be applied to the substrate, and the liquid repellent that could not be removed due to the heat will rise to the location where the components are installed on the substrate, and the components may not be installed. . However, in the method of forming a liquid repellent film using a liquid repellent treatment mask, it is not necessary to remove the liquid repellent film for processing the liquid repellent film into a desired shape. The liquid does not come out. Therefore, in the manufacture of the resin sealing material, there is no concern about the quality deterioration of the resin sealing material due to the residue of the liquid repellent.

  Further, by forming a liquid repellent film by spraying a liquid repellent, the film thickness of the liquid repellent film can be made uniform, and a liquid repellent film having a desired shape can be obtained. At this time, for example, it is possible to suppress consumption of a liquid repellent that is more than a necessary amount for adjusting the thickness of the liquid repellent film, thereby reducing costs.

  In the method for manufacturing a resin-sealed product (LED light source light emitting module 6) according to aspect 2 of the present invention, in the aspect 1, the liquid repellent treatment mask includes a plurality of sets of the liquid repellent application preventing portion and the opening. It may be.

  According to the said structure, a some resin sealing material can be manufactured at once.

  In the method for manufacturing a resin-sealed material (LED light source light emitting module 6) according to aspect 3 of the present invention, in the aspect 1 or 2, the liquid repellent application preventing portion may be circular or elliptical.

  According to the said structure, the resin sealing thing whose bottom shape is circular or an ellipse can be manufactured.

  In the manufacturing method of the resin encapsulated material (LED light source light emitting module 6) according to aspect 4 of the present invention, in any one aspect of the above aspects 1 to 3, the liquid repellent treatment mask includes the liquid repellent application preventing portion, The liquid repellent application preventing portion and the liquid repellent treatment mask other than the opening are connected to a portion of the liquid repellent treatment mask to fix the position of the liquid repellent application preventing portion in the liquid repellent treatment mask (hanging portion 12, 12a, 12b, 12c) may be further provided.

  According to the above configuration, the liquid repellent application preventing portion is integrated with the liquid repellent treatment mask by the fixing portion, and when the liquid repellent treatment mask is placed on the substrate or removed from the substrate, the liquid repellent treatment is applied separately from the liquid repellent treatment mask. It is not necessary to install or remove the prevention part from the substrate, and the process of installing or removing the liquid repellent treatment mask can be simplified in the production of the resin-encapsulated material.

  In the method for manufacturing a resin-sealed product (LED light source light emitting module 6) according to Aspect 5 of the present invention, in Aspect 4, the liquid repellent treatment mask includes the liquid repellent application preventing portion, the liquid repellent application preventing portion, and A fixing portion (hanging portions 12, 12a, 12b, 12c) that is connected to a portion of the liquid repellent treatment mask excluding the opening and fixes the position of the liquid repellent application preventing portion in the liquid repellent treatment mask. Further, the fixing portion may have a line shape longer than the shortest width Lmin of the opening of the liquid repellent treatment mask. Here, the line shape may be a straight line shape or a polygonal line shape, and may not be a line shape as long as the length can be defined.

  Depending on the shape of the fixed part, the area on the substrate that is not coated with the liquid repellent that connects the liquid repellent non-applied area and the area on the substrate other than the liquid repellent non-applied area An area (the suspension portion corresponding liquid repellent non-application area 32) may occur. When the resin is injected into the liquid repellent non-application region, the resin may flow out of the liquid repellent non-application region through the fixed portion corresponding liquid repellent non-application region.

  Here, since the surface molecules are attracted from the inside by the attractive force between the molecules of the resin, the surface tension that tries to make the surface area of the resin as small as possible acts on the liquid resin. If the fixed part corresponding liquid repellent non-application area is long, the force to flow out from the liquid repellent non-application area through the fixed part corresponding liquid repellent non-application area acting on the resin injected into the liquid repellent non-application area , Flow output) and the surface tension acting on the resin are balanced, and the resin does not flow out of the liquid repellent non-applied area through the fixed part corresponding liquid repellent non-applied area.

  According to the above configuration, since the shape of the fixed portion corresponding liquid repellent non-application region is a line shape longer than the shortest width of the opening, when the resin is injected into the liquid repellent non-application region, the fixed portion corresponding liquid repellent agent Compared with the case where the length of the non-application area is the shortest width of the opening, the outflow of the resin from the liquid-repellent non-application area through the fixed part-compatible liquid repellent non-application area can be suppressed.

  In the method for manufacturing a resin-sealed product (LED light source light emitting module 6) according to Aspect 6 of the present invention, in Aspect 4 or 5, the fixing portion may have a linear shape with a width W of 30 μm or more and 50 μm or less. . Here, the line shape may be a linear shape or a polygonal line shape, and may not be a line shape as long as the width can be defined.

  When the width of the fixed part corresponding liquid repellent non-application area (width X of the hanging part corresponding liquid repellent non-application area 32) is narrow, the flow output acting on the resin injected into the liquid repellent non-application area and the action on the resin Therefore, the resin does not flow out from the liquid repellent non-application area through the fixed part corresponding liquid repellent non-application area.

  According to the above configuration, the fixed portion can be processed into a desired shape with a linear shape having a width of 30 μm or more, and the liquid repellent application preventing portion can be strongly integrated with the liquid repellent treatment mask. it can. In addition, by making the width of the fixed portion 50 μm or less, the width of the fixed portion corresponding liquid repellent non-application region becomes 50 μm or less, and the surface tension acting on the resin is stronger than the flow output acting on the resin. Become. Thereby, the outflow of the resin from the liquid repellent non-application area through the fixed part corresponding liquid repellent non-application area can be suppressed.

  In the method for manufacturing a resin-sealed product (LED light source light emitting module 6) according to Aspect 7 of the present invention, in any one of Aspects 4 to 6, the liquid repellent treatment mask includes a plurality of the fixing portions. May be.

  According to the above configuration, the liquid repellent application preventing portion can be more strongly integrated with the liquid repellent treatment mask.

  In the method for manufacturing a resin-sealed material (LED light source light emitting module 6) according to Aspect 8 of the present invention, in any one of Aspects 1 to 7, the liquid repellent treatment mask is made of a metal, and the opening May be formed using laser or etching.

  According to the above configuration, a liquid repellent treatment mask having an opening processed into a desired shape with high accuracy can be obtained.

  In the manufacturing method of the resin sealing thing (LED light source light emitting module 6) which concerns on aspect 9 of this invention, in any one aspect of the said aspects 1-8, the said opening part is the width | variety (width | variety L of the said liquid repellent process mask). , Lb) may be 30 μm or more and 50 μm or less.

  When the width of the liquid repellent film is wide, the liquid repellent film is removed in the manufacture of the secondary molded product (LED light emitting module 107 after the secondary molding) in which the resin encapsulated material is further sealed with another resin. Otherwise, the resin may be repelled on the liquid repellent film and a secondary molded product having a desired shape may not be manufactured. The width of the liquid repellent film is substantially the same as the width of the opening.

  According to the above configuration, by setting the width of the opening to 30 μm or more, the opening can be accurately processed into a desired shape, and a liquid repellent film having a desired shape can be formed. In addition, by setting the width of the opening to 50 μm or less, the liquid repellency of the resin by the liquid repellent film can be suppressed, and a secondary mold product having a desired shape can be manufactured. In other words, the secondary mold product can be manufactured by sealing the resin sealing material with another resin without removing the liquid repellent film.

  In the method for manufacturing a resin-sealed product (LED light source light emitting module 6) according to Aspect 10 of the present invention, in any one of Aspects 1 to 9, the opening is tapered in the cross section of the liquid repellent treatment mask. You may have a shape.

  According to the above configuration, the liquid repellent applied to the opening from the side opposite to the substrate is accumulated on the substrate side due to the taper shape, and the liquid repellent film has a small or no gap between the liquid repellent and the other shapes. Can be formed.

  In the method for manufacturing a resin-sealed product (LED light source light emitting module 6) according to aspect 11 of the present invention, in any one aspect of the above aspects 1 to 10, the liquid repellent treatment mask has a reference hole (which is a reference for positioning). When the liquid repellent mask is placed on the substrate having the positioning hole 25), it may further include a positioning hole 15 which is a hole for determining the position so as to coincide with the reference hole.

  According to the above configuration, the liquid repellent treatment mask can be placed at an accurate position on the substrate.

[Additional Notes]
The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

  The present invention can be used for manufacturing LED light-emitting modules.

1 Liquid repellent treatment mask 2 Mounting substrate (substrate)
6 LED light source module (resin encapsulated material)
11 Opening part 12 Hanging part (fixed part)
12a Hanging part (fixed part)
12b Hanging part (fixed part)
12c Hanging part (fixed part)
13 Liquid repellent application prevention part 15 Positioning hole 25 Positioning hole (reference hole)
31 Liquid repellent 32 Liquid suspension repellent non-application area (area)
33 Liquid repellent non-application area (area)
41 LED chip (components)
42 Au wire (component)
43 Au wire 2nd terminal (components)
51 Phosphor resin (resin)
S1 Liquid repellent film forming process S2 Resin sealing process

Claims (5)

A liquid repellent treatment mask having a liquid repellent application preventing portion for preventing a liquid repellent from being applied to a region on which a component is placed on a substrate and an opening formed along an outer edge of the liquid repellent application preventing portion A liquid repellent film forming treatment step of forming a liquid repellent film containing the liquid repellent agent on the substrate by spraying the liquid repellent agent on the liquid repellent treatment mask;
A resin sealing treatment step in which the component is placed in a region where the liquid repellent agent is not applied by the liquid repellent application preventing portion in the liquid repellent film forming treatment step, and the resin sealing treatment step is carried out. Manufacturing method of sealing thing. The liquid repellent treatment mask is connected to the liquid repellent application preventing portion and the liquid repellent treatment mask portion excluding the liquid repellent application preventing portion and the opening, and the liquid repellent agent in the liquid repellent treatment mask. It further includes a fixing part that fixes the position of the application preventing part,
The method for manufacturing a resin-encapsulated product according to claim 1, wherein the fixing portion has a linear shape longer than the shortest width of the opening of the liquid repellent treatment mask.   The method for producing a resin-encapsulated product according to claim 2, wherein the fixed portion has a linear shape with a width of 30 µm to 50 µm.   The method for producing a resin-encapsulated product according to claim 2, wherein the liquid repellent treatment mask includes a plurality of the fixing portions.   The liquid repellent treatment mask further includes a positioning hole which is a hole for determining the position so as to coincide with the reference hole when the liquid repellent treatment mask is placed on a substrate having a reference hole serving as a positioning reference. The manufacturing method of the resin sealing material of any one of Claim 1 to 4 characterized by the above-mentioned.