JPH0327556A - Mask for dam frame - Google Patents
Mask for dam frameInfo
- Publication number
- JPH0327556A JPH0327556A JP16215489A JP16215489A JPH0327556A JP H0327556 A JPH0327556 A JP H0327556A JP 16215489 A JP16215489 A JP 16215489A JP 16215489 A JP16215489 A JP 16215489A JP H0327556 A JPH0327556 A JP H0327556A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- dam
- resin
- dam frame
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 abstract description 21
- 239000011347 resin Substances 0.000 abstract description 21
- 238000007789 sealing Methods 0.000 abstract description 14
- 239000004065 semiconductor Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 2
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は、基板西にマウン１・乃至ボンデイングした半
導体素子などを樹脂封止する際に用いるタムフレーム用
マスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Industrial Field of Application) The present invention relates to a tom frame mask used when a mount 1 or a semiconductor element bonded to the west of a substrate is sealed with a resin.
（従来の技術）
たとえば配線県板の所定面に半導体素子などをマウン１
・乃至ボンディングし、これを樹脂てモルド封止して成
る樹脂封止型回路部品は、各柚電子機器類で広く尖用に
供されている。ところで、この種の尉脂封止型１ｒｌ路
部品の製追においては、址板面にボンディングした半導
体素了なとの樹脂封止は一般に次の如く行われている。(Prior art) For example, semiconductor devices are mounted on a predetermined surface of a wiring board.
・Resin-sealed circuit components made by bonding and mold-sealing with resin are widely used in various electronic devices. By the way, in the manufacture of this type of resin-sealed 1rl road component, the resin sealing of the semiconductor element bonded to the base plate surface is generally performed as follows.
すなわち、址板面に予め、たとえばエボキシ樹脂製のダ
ムフレームを接着したり、或るいはスクリーン印刷でダ
ム枠を形戊して樹脂の流出を防１１−シた形とし、゛１
′．導体素丁一などをボンディングした後、ししくは所
要の領域向に、半導体素子などをボンディングしたから
、上記の如くダム枠を形威して樹１１Ｗの流出を防止し
た形とし、所要の樹脂を注入，硬化させてモールド封止
している。That is, a dam frame made of, for example, epoxy resin is adhered to the surface of the foundation board in advance, or a dam frame is formed by screen printing to prevent the resin from flowing out.
'． After bonding the conductor element 1, etc., or bonding the semiconductor element, etc. in the required area, the dam frame is formed as described above to prevent the wood 11W from flowing out, and the required resin is bonded. is injected, cured, and sealed in a mold.
（発明が解決しようとする課題）
しかし、上記樹脂封止の手段においては、次のような不
都合が認められる。すなわち、封止樹脂の流出を防止す
るため、ダム枠を設ける必要がある。しかして、上記ダ
ムフレームを接着，配置する場合は、各ダムフレームを
個々に接着，配置するため作菜が煩雑になり、コス１・
アップになるばかりでなく、量産に適さないと言う間Ｈ
，１がある。(Problems to be Solved by the Invention) However, the following disadvantages are recognized in the above resin sealing means. That is, in order to prevent the sealing resin from flowing out, it is necessary to provide a dam frame. However, when gluing and arranging the above-mentioned dam frames, each dam frame has to be glued and placed individually, which makes the preparation complicated, and the cost is 1.
Not only does it improve, but it is also not suitable for mass production.
, 1.
一方、スクリーン印刷でダム枠を形成した場合は、ダム
フレームの高さを一定にコン１・ロールずるのが困難で
あり、加えてスクリーンを成している繊維の転写により
ダム伜の厚さも不ｊ勺一になり易く、このためダム枠の
高さをたとえば０．３肛程度に設定し、樹脂封止層を薄
くしようとすれば、樹指かダム枠外に流れ出て外観など
を損うと言う問題かある。On the other hand, when the dam frame is formed by screen printing, it is difficult to keep the height of the dam frame constant and the thickness of the dam frame is also unstable due to the transfer of the fibers that make up the screen. Therefore, if the height of the dam frame is set to, for example, 0.3 mm and the resin sealing layer is made thinner, the resin will flow out of the dam frame and spoil the appearance. There's a problem.
［発明のヰ１４成］
（課題を解決するための手段）
本発明は上記１］情に対処してなされたもので、容易に
所望の高さのダム枠を形成し、また樹脂の流出で外観な
どが損われることのないダムフレム用マスクを提供する
ものである。つまり、本発明は、彼封止部に対応する領
域を覆う内枠部と、この内枠部を囲繞して形設したダム
枠に対応ずる切欠部を介して配設された外枠部と、前記
内枠部および外枠部を連接支持する連接支持蔀とを具６
ｉｆｆし、前記連接支持部は切欠部を斜め方向に横切る
ように設けられていることを特徴とする。[14 Achievements of the Invention] (Means for Solving the Problems) The present invention has been made in response to the above-mentioned problem 1), and it is possible to easily form a dam frame of a desired height and prevent resin from flowing out. To provide a mask for dumb flames whose appearance is not impaired. In other words, the present invention includes an inner frame portion that covers a region corresponding to the sealing portion, and an outer frame portion that is disposed through a notch portion corresponding to a dam frame formed to surround this inner frame portion. , and a connecting support lip that connects and supports the inner frame portion and the outer frame portion.
iff, and the connecting support portion is provided so as to diagonally cross the notch.
（作 川）
上記本発明に係るダムフレーム用マスクは所要のダム枠
に対応する９Ｊ矢部を有し、この切欠部への樹脂充拍な
どにより、所定高さのダム枠を確実かつ精度よく形成で
きる。しかも前記形成されたダム枠は、内枠部および外
枠部を連接支持する連接支持部によって斜め方向に横切
る満をイζｊ与されており、この満にて過剰に／４二人
された封ＩＬ用樹脂は吸収され良好な外観を保持する。(Sakukawa) The dam frame mask according to the present invention has a 9J arrow portion corresponding to a required dam frame, and by filling the notch with resin, etc., a dam frame of a predetermined height can be formed reliably and accurately. can. Moreover, the formed dam frame is provided with a diagonally traversing portion by the connecting support portion that connects and supports the inner frame portion and the outer frame portion. The IL resin is absorbed and maintains a good appearance.
（実施例）
以下添附図を参照して本発明の実地例を説明する。第１
図は本発明に係るダムフレーム用マスクを平面的に示し
たもので、］は被゛月市部に対応する領域を覆う内枠部
、２は前記山枠部１を囲繞して形設したダム枠に対応す
る切欠部３を介して配設された外枠部、４は前記内枠部
１および外枠部２を連接支持する連接支持部であり、こ
の連接支持部４はνノ欠部３を斜め方向に横切るように
設けた構成を成している。(Example) Practical examples of the present invention will be described below with reference to the attached drawings. 1st
The figure shows a planar view of the dam frame mask according to the present invention, where ] is an inner frame portion that covers an area corresponding to the target area, and 2 is an inner frame portion formed to surround the mountain frame portion 1. The outer frame portion 4 provided through the notch portion 3 corresponding to the dam frame is a connecting support portion that connects and supports the inner frame portion 1 and the outer frame portion 2, and this connecting support portion 4 has a ν notch. It has a configuration in which it crosses the section 3 in an oblique direction.
しかして、このような本発明に係るダムフレム川マスク
は、たとえば第２図〜拍４図に各王ｆｊｊの状態を断而
的に示ずようにして製遺し？！Ｉる。先ず薄い金属板、
たとえば厚さ ０｛〜０．５ｍｍｔＭ度のステンレス板
５を川意し、このステンレス板５面に所要のマスキング
６を行う（第２囚）。次いで上記マスキング６したステ
ンレス板５にエッチング処理を施して、露出している領
域５ａを選択的にエッチング除去する（第３図）。上記
により所要のエッチング処理を力伍した後、マスキング
層６を除去することにより内枠部１，外枠部２，切欠部
（スリッ１・）３および前記内枠部１と外枠部２とを連
接支持する連接支持４を備えたダムフレーム用マスクが
得られる（第４図）。However, such a Damfrem River mask according to the present invention was produced without definitively showing the state of each king fjj, for example, in Figures 2 to 4. ! I. First, a thin metal plate,
For example, a stainless steel plate 5 having a thickness of 0 to 0.5 mm is used, and a required masking 6 is applied to the surface of the stainless steel plate 5 (second case). Next, the masked stainless steel plate 5 is subjected to an etching process to selectively remove the exposed region 5a (FIG. 3). After completing the required etching process as described above, by removing the masking layer 6, the inner frame part 1, the outer frame part 2, the notch part (slit 1) 3, and the inner frame part 1 and the outer frame part 2 are removed. A mask for a dam frame is obtained, which is equipped with a connecting support 4 that connects and supports the dam frame (FIG. 4).
上記により構成したダムフレーム用マスク、たとえば厚
さ（高さ） ０．３ｍｍのステンレス製ダム枠フレー
ム用マスクを用い、基板面にレジス１・枠を印刷形成し
たところ、一様な高さのダムフレームを構戊し得た。ま
た前記基板にＩＣ素子をボンデイングした後、前記描成
したダムフレーム内領域５
に封止川樹脂を注入し封止したところ、外観など良好な
封止型回路部占−乙を得ることができた。っまり、注入
した封止用樹脂の一部がダム枠外に流出した堝合も、そ
の流出した材脂はダム枠を斜め方向に横切る満部（流路
が比較的長く形成されていることになる）に叶留する形
をなすため、ダム枠外の外観か損われることもなくなる
。When the resist 1 and frame were printed on the substrate surface using the dam frame mask constructed as described above, for example, a stainless steel dam frame mask with a thickness (height) of 0.3 mm, a dam with a uniform height was formed. I was able to configure the frame. Furthermore, after bonding the IC element to the substrate, a sealing resin was injected into the drawn dam frame area 5 to seal it, and it was possible to obtain a sealed circuit part with good appearance. Ta. In other words, even if some of the injected sealing resin leaks out of the dam frame, the leaked resin will diagonally cross the dam frame (because the flow path is relatively long). Since it is shaped like a dam, the appearance outside the dam frame will not be damaged.
なお、上記では切欠部３を方形に形成しかつ、各辺を斜
め方向に横切るように連接支持部（溝部に対応する領域
）４を設けたが、第５図に平面的に示すように、前記連
接支持部（満部に対応する領域）４を角部に設け、その
外側に補助的なダム枠３ａを形成し得るようにしてもよ
い。さらに前記｛；ＩＪ欠部３を円形に形成してもよい
が、いずれの場合も内枠部１と外枠部２との連接支持部
（溝部に対応する領域）４は、なるべく狭く （細く）
また長目に形成しておくことか望ましい。In the above, the notch 3 is formed into a rectangular shape, and the connecting support part (region corresponding to the groove part) 4 is provided diagonally across each side, but as shown in plan in FIG. The connecting support portion (region corresponding to the full portion) 4 may be provided at a corner, and an auxiliary dam frame 3a may be formed on the outside thereof. Further, the IJ notch 3 may be formed into a circular shape, but in either case, the connecting support portion (region corresponding to the groove) 4 between the inner frame portion 1 and the outer frame portion 2 is made as narrow as possible (thin). )
It is also desirable to form it for a long time.
［発明の効果コ
上記の如く本発明に係るダムフレーム用マスクによれば
、容易にかっ、高さや形状など｛前った所６
要の樹脂封止用のダム枠を形成し得る。しかも形成され
たダム枠は、封ＩＪＩ用樹脂の過剰注入分など適宜収容
，保持し得る領域を備えているため、封１１一用樹脂の
流出による外観損陽なともＩｕノ＋ｌ： Ｌ、（１［１
頼性の高い樹脂封止型電子部品の提供に大きく寄与する
。[Effects of the Invention] As described above, according to the dam frame mask according to the present invention, it is possible to easily form a dam frame for resin sealing with various heights, shapes, etc. Moreover, since the formed dam frame has an area that can appropriately accommodate and hold excess injection of the sealing resin, there is no risk of damage to the appearance due to leakage of the sealing resin. 1[1
This will greatly contribute to the provision of highly reliable resin-sealed electronic components.
禎１図は本発明に係るダムフレーム用マスクの措成例を
示す平面図、拓２図〜拍４区は本発明に係るダムフレー
ム用マスクの製込王程における態様を摸式的に示す断面
図、ｊ３５図は本発明に係るダムフレーム用マスクの他
のＨ１成例を示す平面図である。
１・・・内枠部
２・・・外枠部
３・・・切欠部（スリッ１・）
４・・・切欠部を横切り内枠部および外枠部を連接支持
する連接支持部
７Figure 1 is a plan view showing an example of the construction of a mask for a dam frame according to the present invention, and Figures 2 to 4 schematically show aspects of the manufacturing process of a mask for a dam frame according to the present invention. The cross-sectional view, FIG. 35, is a plan view showing another H1 example of the dam frame mask according to the present invention. 1... Inner frame part 2... Outer frame part 3... Notch part (slit 1) 4... Connecting support part 7 which crosses the notch part and supports the inner frame part and the outer frame part in a connected manner
Claims (1)
囲繞して形設したダム枠に対応する切欠部を介して配設
された外枠部と、前記内枠部および外枠部を連接支持す
る連接支持部とを具備し、前記連接支持部は切欠部を斜
め方向に横切るように設けられていることを特徴とする
ダムフレーム用マスク。an inner frame portion that covers a region corresponding to the sealed portion; an outer frame portion disposed through a notch portion corresponding to a dam frame formed surrounding the inner frame portion; and the inner frame portion and the outer frame portion. 1. A mask for a dam frame, comprising a connecting support part that connects and supports an outer frame part, and the connecting support part is provided so as to diagonally cross the cutout part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16215489A JPH0327556A (en) | 1989-06-23 | 1989-06-23 | Mask for dam frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16215489A JPH0327556A (en) | 1989-06-23 | 1989-06-23 | Mask for dam frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327556A true JPH0327556A (en) | 1991-02-05 |
Family
ID=15749063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16215489A Pending JPH0327556A (en) | 1989-06-23 | 1989-06-23 | Mask for dam frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327556A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216604A (en) * | 2013-04-30 | 2014-11-17 | シャープ株式会社 | Manufacturing method of resin sealing object |
-
1989
- 1989-06-23 JP JP16215489A patent/JPH0327556A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216604A (en) * | 2013-04-30 | 2014-11-17 | シャープ株式会社 | Manufacturing method of resin sealing object |
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