KR20080089041A - Led package comprising lead frame being without outer lead and method for fabricating the same - Google Patents

Abstract

An LED package including a lead frame without having an outer lead and a method for manufacturing the same are provided to prevent the protrusion of an added lead frame toward the outside of the LED package by cutting a part of the added lead frame in an inner side of an LED package body. Plate-type lead frame substances(24,25,26) having outer frames and a plurality of lead frames connected to the outer frames through a multiplicity of bridges(264) are prepared. A package body supports the lead frame substances. The bridges are cut to remove the surplus portions of the lead frame substances. First and second bridges out of the bridges are cut at an outer side of the package body and a third bridge is cut at an inner side of an outer surface of the package body. A notch(265) for cutting the third bridge is formed in advance during the process for preparing the lead frame substances.

Description

LED package having lead frame without external lead and manufacturing method thereof {LED PACKAGE COMPRISING LEAD FRAME BEING WITHOUT OUTER LEAD AND METHOD FOR FABRICATING THE SAME}

1 is a perspective view showing a lead frame material used for manufacturing an LED package according to an embodiment of the present invention.

2 is a view showing a state in which a package body is formed in the lead frame member shown in FIG.

3 illustrates an LED package according to an embodiment of the present invention.

<Code Description of Main Parts of Drawing>

2, 4: LED chip 10: package body

24, 25, 26: leadframe 242, 252, 262, internal lead

244, 254: external lead (or bridge portion) 264: bridge portion

265: notch

The present invention relates to an LED package having a plurality of lead frames, and more particularly, to an LED package in which at least one lead frame of the plurality of lead frames is present without an external lead.

In general, an LED package includes a pair of lead frames that apply current to the LED chip, and a package body that supports the pair of lead frames and defines a mounting space of the LED chip. Each of the pair of lead frames includes an inner lead located inside the package body, that is, in a mounting space of the LED chip, and an outer lead connected to an external electrode outside the package body.

An LED package including a pair of leadframes has two inner leads, and only one inner lead of the two inner leads serves as a pad on which the LED chip is mounted. Therefore, in the structure of the LED package as described above, it is practically impossible to mount two or more LED chips to the LED package by electrically connecting them in series. On the other hand, in addition to a pair of lead frames including both an inner lead and an outer lead, an LED package having additionally provided a dummy lead frame having only an inner lead without an outer lead has been developed in the past.

In the conventional LED package as described above, one LED chip is mounted on a lead frame of a pair of existing lead frames, and another LED chip is mounted on a newly added dummy lead frame to bond the LED chips to each other. It was possible to connect in series by means of these. In order to manufacture the conventional light emitting diode package as described above, a lead frame material having a pair of lead frames and a dummy lead frame is prepared, and a package body surrounding a part of the lead frame material is formed by, for example, a resin molding process. After forming, a process of cutting and bending the lead frame member into a desired shape is performed.

At this time, the portion extending to the outside of the package body forming part of the pair of lead frames may be used as an external lead. In addition, a portion extending out of the package body while forming a portion of the dummy leadframe is cut outside the package body. However, a part of the dummy leadframe which cannot be used as an external lead while extending out of the package body may protrude out of the package body even if it is cut. This unnecessary protrusion prohibits the smooth formation of the package body, and may further cause many problems such as interference with external components.

In particular, the above problem is more serious in the case of side view type LED package, in the case of side view type LED package, the protrusion of part of the dummy leadframe faces the printed circuit board on which the LED package is mounted. Because it is made through the side of the package body, there is a high possibility of causing interference with a portion on the printed circuit board.

Accordingly, the present invention is to solve the problems of the prior art, in addition to the lead frame having an inner lead and an outer lead, adding a lead frame having only an inner lead without an outer lead, a part of the added lead frame The technical problem is to provide an LED package and a method of manufacturing the same by cutting inside the outer surface of the package body, so that a part thereof does not protrude out of the package body.

In addition, another technical problem of the present invention, in addition to the lead frame having an inner lead and an outer lead, adding a lead frame having only an inner lead without an outer lead, the newly added lead frame in the inside of the outer surface of the package body Provided is a method of manufacturing an LED package using a method of forming a notch that facilitates cutting.

According to an aspect of the present invention, there is prepared a plate-shaped lead frame material having a frame and a plurality of lead frames connected by the frame and a plurality of bridge parts, and to form a package body for supporting the lead frame material, The plurality of bridge parts are cut to remove excess portions of the leadframe material, wherein the first and second bridge parts of the plurality of bridge parts are cut from the outside of the package body, and the third bridge part is formed from the inside of the outer surface of the package body. Provided is a method of cutting to manufacture an LED package. At this time, in the preparing of the lead frame member, a notch for cutting the third bridge portion is formed in advance.

According to an embodiment of the present invention, the plurality of leadframes may include first and second internal leads connected to the first and second bridge parts, and third internal leads connected to the third bridge parts. The first and second bridge parts may be bent outside the package body and used as first and second external leads connected to external electrodes. In this case, the third inner lead is preferably located between the first inner lead and the second inner lead. In addition, the first and second bridge parts are used as the first and second external leads in a state of being bent on the side of the package body, whereby the LED package has a side view type structure. In addition, a first LED chip and a second LED chip are mounted on any one of the first internal lead and the second internal lead and the third internal lead, respectively, and the first LED chip and the second LED chip are bonded wires. Connected in series.

Other objects and advantages of the invention will be more clearly understood from the following description of the examples.

Example

1 is a partial perspective view showing a lead frame member according to an embodiment of the present invention, Figure 2 is a plan view showing a state in which the package body is formed on the lead frame member shown in Figure 1, Figure 3 is FIG. FIG. 4 is a view illustrating a side view type LED package manufactured by cutting and bending a part of a lead frame material shown in FIG.

Referring to FIG. 3, the LED package 1 according to the embodiment of the present invention includes a plurality of lead frames 24, 25, and 26 for applying current to the LED chips 2 and 4, and the plurality of leads. A package body 10 supporting the frames 24, 25, 26. The package body 10 is formed using a ceramic or a resin, preferably, a molding molding process using a resin. The package body 10 includes an opening 12 exposing the inner leads 242, 252, and 262 of the lead frames 24, 25, and 26. The opening 12 may be filled with a light-transmissive sealing member for protecting the LED chip. In the present specification, the surface of the package body 10 in which the opening 12 is formed is a front surface, and a surface adjacent to the front surface of the package body 10 is defined as a side surface 10a of the package body 10.

The plurality of lead frames 24, 25, and 26 may include a first lead frame 24 and a second inner lead 252, in which a first inner lead 242 and a first outer lead 244 are connected. And a second lead frame 25 having a second external lead 254 connected thereto, and a third lead frame 26 including only the third internal lead 262 without an external lead. In this case, each of the first and second inner leads 242 and 252 is connected to each of the first and second outer leads 244 and 254 into and out of the package body 10. In addition, a third inner lead 262 is positioned between the first inner lead 242 and the second inner lead 252.

The third lead frame 26 may include a third bridge portion 264 (see FIGS. 1 and 2) of the lead frame member 20, which will be described in detail below, and is cut inside the outer surface of the package body 10. It consists only of the inner lead 262, whereby no part of the third leadframe 26 protrudes outward of the outer surface of the package body 10. In the figure, a dummy lead frame without an external lead, that is, a third lead frame 26 is shown as one, but a plurality of lead frames such as the third lead frame 26 without an external lead are provided in plural numbers. You can also arrange.

According to the exemplary embodiment of the present invention, one end of the first bonding wire W1 is connected to the first inner lead 242, and the first LED chip 2 to which the other end of the first bonding wire W1 is connected is formed. The third internal lead 262 is mounted. The first LED chip 2 is connected to one end of the second bonding wire W2, and the other end of the second bonding wire W2 is connected to the third internal lead 262. One end of the third bonding wire W3 is connected to the third internal lead 262, and the second LED chip 4 connected to the other end of the third bonding wire W3 is connected to the second internal lead 252. It is mounted. The second LED chip 4 and the second internal lead 252 are connected by a fourth bonding wire W4. As described above, according to the embodiment of the present invention, at least two or more internal leads in which a plurality of LED chips connected in series may be provided.

Hereinafter, a method of manufacturing the LED package described above with reference to FIGS. 1 to 3 will be described.

Figure 1 shows a lead frame material 20 of a metal material used in the manufacture of the LED package according to the present invention. Referring to FIG. 1, the lead frame member 20 is connected to the outer frame 21 by the outer frame 21 and the first, second, and third bridge parts 244, 254, and 264. And first, second, and third leadframes 24, 25, and 26. The first bridge parts 244 and 254 are used as first and second external leads which are partially removed after the bridge part cutting process described below and connected to the external electrodes. In this specification, the first and second bridges are used. The part and the first and second external leads are supposed to use the same member numbers, 244 and 254, respectively. On the other hand, the cut notch 265 is formed in the third bridge portion 264. In addition, the notch 265 is provided at a position close to the third internal lead 262. In FIG. 1, a lead frame member 20 having leadframes connected to one outer frame 21 is illustrated, but in reality, a plurality of lead frame members having a plurality of outer frame 21 as shown in FIG. 1 are connected. Used to manufacture LED packages.

2 is a view illustrating a state in which the package body 10 is formed on the lead frame material 20. Referring to FIG. 2, the first, second and third internal leads 242, 252, and 262 are positioned inside the package body 10, that is, inside the opening 12 of the package body 10. In addition, a third internal lead 262 is positioned between the first internal lead 242 and the second internal lead 252. The first and second bridge parts 244 and 254, which will be external leads later, are located outside the package body 10.

The third bridge portion 264 connected to the third inner lead 262 also extends to the outside of the package body 10. In particular, the notch 265 formed in the third bridge portion 264 may be a package body. It is located inside the outer surface of (10). Since the third bridge portion 264 is cut by the notch 265, the third bridge portion 264 does not protrude outside the outer surface of the package body 10. In addition, the first and second bridge portions 244 and 254 are cut at the cutting lines C1 and C2 outside the package body shown in FIG. 2, and are end portions thereof on the side surface 10a of the package body 10. Are continuously bent so as to be positioned to be external electrodes connected to the electrodes of the external printed circuit board.

Through the process of cutting off the excess portion of the lead frame member 20 and bending the first and second bridge portions, the first, second and third lead frames 24, 25, and 26 as shown in FIG. LED package can be manufactured. As shown in FIG. 3, the first and second leadframes 24, 25 include an inner lead 242, 252 and an outer lead 244, 254, the outer leads 244, 254. May be mounted on a printed circuit board (not shown) that extends to the side surface 10a of the package body 10 and faces the side surface. In addition, the third lead frame 26 includes only the inner lead 262. The enlarged view of FIG. 3 shows the cut surface 26a of the third leadframe 26, and from the enlarged view of FIG. 3, the third leadframe 26 is located inside the outer surface of the package body 10. It can be clearly seen that it is not cut and protrudes outward.

While the invention has been described above with reference to specific embodiments, various modifications, changes or modifications may be made in the art within the spirit and scope of the appended claims, and thus, the foregoing description and drawings It should be construed as illustrating the present invention rather than limiting the technical spirit of the present invention.

According to embodiments of the present invention, in addition to the lead frame consisting of the outer lead and the inner lead in addition to provide a lead frame having only the inner lead, a portion of the lead frame caused when providing a lead frame having only the inner lead By preventing external protrusions, it is possible to fabricate a smoothly shaped LED package and to prevent interference with external components that may be caused by the protruding portions.

Claims (7)

Preparing a plate-like lead frame member having an outer frame and a plurality of lead frames connected by the outer frame and the plurality of bridge portions; Forming a package body for supporting the lead frame material; By cutting the plurality of bridge parts to remove the excess portion of the lead frame material, The first and the second bridge portion of the plurality of bridge portion of the LED package manufacturing method, characterized in that the cut outside the package body, the third bridge portion is cut inside the outer surface of the package body. The method of claim 1, wherein in the preparing of the lead frame material, a notch for cutting the third bridge part is formed in advance. The method according to claim 1 or 2, wherein the plurality of leadframes include a first and second internal lead connected to the first and second bridge portion, and a third internal lead connected to the third bridge portion, The first and the second bridge portion is bent outside the package body, the LED package manufacturing method, characterized in that used as the first and second external leads connected to the external electrode. The method of claim 3, wherein the third inner lead is located between the first inner lead and the second inner lead. The method of claim 3, wherein the first and second bridge portions are bent onto the side of the package body. The method according to claim 3, Mounting first and second LED chips on one of the first internal lead and the second internal lead and the third internal lead, respectively; Connecting the first LED chip and the second LED chip in series by bonding wires; LED package manufacturing method characterized in that it further comprises. A package body having an opening for mounting the LED chip; Including a plurality of lead frames supported by the package body; The plurality of lead frames, LED package, characterized in that at least one lead frame is formed by cutting the inside portion of the package body connected to the inner lead.

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