JPS59112636A - Resin-sealed semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve the quality of a resin-sealed semiconductor device by coating by a spraying method fluorine polymer in the prescribed frame shape on the surface of a substrate to be associated of an IC element and completely preventing the flowout of the sealing resin. CONSTITUTION:Fluorine polymer which is diluted with organic solvent is injected from a nozzle 10 through a metal mask 11 on a substrate 1, on which the prescribed circuit pattern is formed to form a frame of hollow rectangular shape. Solvent is evaporated at ambient temperature. The polymer density is 2% or less, the thickness of the frame is 1mum or less, and the flowout of the sealing resin 5 and the collapse of the shape can yet be prevented by utilizing the surface tension effect of the fluorine. Then, an IC element 2 is secured with adhesive 7, and wired via wirings 4. The substrate 1 is maintained at approx. 200 deg.C on a hot plate, and epoxy resin is placed on the wirings of the element. Then, the resin is liquefied to spread to become almost thicknessless in shape, stopped at the inner edge of the polymer 9, and not flowed out, thereby reducing the manufacturing cost.

Description

Detailed Description of the Invention (Technical Field) The present invention relates to a resin-sealed semiconductor device that is sealed using a pellet or liquid resin that does not require transfer molding, and a method for manufacturing the same. This invention relates to means for preventing resin from flowing out.

(Prior art) In recent years, as IC elements have become highly integrated and used in a wide range of fields, IC element assembly and package shapes have become diverse, and assembly on synthetic resin substrates has become particularly popular. However, this is still a hybrid I as a market need.
This is thought to be due to the increasing demand for C elements, watch toys, etc., and for this reason, there is a deep-rooted desire to reduce the cost of assembling semiconductor devices such as IC elements.

Conventionally, there has been a semiconductor device of this type as shown in FIG. In other words, in order to prevent the resin from flowing out when sealing with resin on the assembly board of IC elements such as COB (chip on board), a rectangular frame is provided and used as a dam to prevent the resin from flowing out. There was something configured like this. As shown in FIG. 1(a), reference numeral 1 denotes a synthetic resin substrate 1 made of glass, epoxy, etc.
In order to be able to assemble the C element 3, the circuit wiring 2 is patterned with Au plating or the like using a plating technique.

FIG. 1(I)) shows a semiconductor device assembled based on the circuit wiring 2 patterned on the substrate 1 shown in FIG. 1(a) above, taken along line X-X in FIG. 1(a). This is a side sectional assembly view, in which 3 is an IC element, 4 is a gold or aluminum wire connecting the substrate 1 and the IC element 2, and 5 is the substrate 1.
A sealing resin part 6 for sealing the IC element 2 at a predetermined position on the top is a hollow rectangular frame serving as a dam for preventing the sealing resin part 5 from flowing out, and is made of a material such as paper phenol. Reference numeral 7 indicates an adhesive for bonding the IC element 2 to the substrate 1, and reference numeral 8 indicates an adhesive for bonding the frame 7 to the substrate 1.

In a device having the above configuration, an IC element 2 is mounted on a substrate 1.
A rectangular frame 6 is made of a material such as paper phenol in order to prevent the sealing resin part 5 from protruding over a specified area before and after the step of wire bonding or after the step of wire bonding. is pasted on the substrate 1 with adhesive 8, and after drying is molded with sealing resin, this frame 6
A dam was used to prevent the resin portion 5 from flowing out. After this, it was cured, stamped, and tested for electrical characteristics before being made into a product.

In addition to the use of the hollow rectangular frame 6 as described above, the conventional device and its manufacturing method have the following drawbacks.

(1) Since the frame 6 is manufactured by punching out, for example, a paper phenol board with a press, the material and processing costs associated with the frame 6 are correspondingly higher.

(2) When adhering the frame 6 to the substrate 1, the adhesive 8 is applied to several places on the frame 6 and then dried to harden it, so the processing cost related to the adhesive 8 became relatively expensive.

(3) Even if the adhesive 8 is applied to the frame 6, there will inevitably be gaps between the substrate 1 and the frame 6, and the entire surface will not be properly bonded, so even if a pellet or liquid resin is poured, it will leak outside the frame 6. There was a risk that this would not only cause poor appearance, but also reach other wiring patterns and cause poor contact.

(4) Due to its shape, which is difficult to automate, it is necessary to have a mechanism for applying adhesive and for attaching a frame, and the head must be replaced and readjusted when changing the model, which increases equipment costs. That it became something.

Since the above-mentioned defects affect the yield, they are a major drawback in that they cause overall cost increase and quality deterioration.

(Object of the invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and is
By spraying fluorine-based polymer onto the surface of the C-element assembly board in a predetermined frame shape, it is possible to completely prevent the sealing resin from flowing out and improve quality, while also making it possible to improve the manufacturing method easily. It is an object of the present invention to provide a resin-sealed semiconductor device and a method for manufacturing the same, which can significantly reduce manufacturing costs.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 2 shows a resin-sealed semiconductor device according to an embodiment of the present invention. FIG. 2 is a diagram corresponding to FIG. Otherwise, a corresponding portion will be shown and detailed explanation thereof will be omitted.

In the figure, reference numeral 9 denotes a rectangular frame-shaped coated part of a fluorocarbon polymer which functions to prevent the awn sealing resin part 5 formed on the substrate 1 from flowing out, and the coated thickness thereof is about 1 μm or less.

In one embodiment of the present invention having the above configuration, the rectangular frame-shaped coating portion 9 of the fluorinated polymer can be coated in a very small amount, and the surface tension effect of the fluorinated polymer can be further utilized.
It is possible to completely prevent the sealing resin part 5 from flowing out or deforming, and the resin part ψC element 3 can be completely bonded and sealed.

Next, a method for manufacturing the semiconductor device according to an embodiment of the present invention will be described.

FIG. 3 shows a method for coating a fluorine-based polymer with a fluorine-based polymer diluted solution according to an embodiment of the present invention.
The spray nozzle 11 for spraying is a metal mask for spraying, which has a hollow rectangular frame and is set at a predetermined position vertically midway between the application section 9 and the nozzle 10 on the substrate 1.

In the device having the above configuration, a metal mask 11 for spraying is applied to a substrate l on which a predetermined circuit pattern has been formed.
A fluorine-based polymer (for example, F'C-721 Fluorado under the trade name) is diluted with an organic solvent (FC-77 Fluorinert under the trade name) from the spray nozzle 10 through the spray nozzle 10, and this is sprayed to apply it in a hollow rectangular shape. do. Since this organic solvent evaporates at room temperature, no particular drying is required. or,
Since the concentration of the fluorine-based polymer is 2% or less, the applied thickness is also 1 μm or less, which is sufficient to prevent the sealing resin portion 5 from flowing. After coating, the IC element 2 dice are bonded to a predetermined position on the substrate 1 using the conductive paste or insulating resin that is the adhesive 7 before bonding, and then dried for the purpose of curing. . Next, a gold wire or aluminum wire 4 is stretched with a wire bonder, and a sealing process begins. In the sealing process, the reed substrate 1 is heated to nearly 200°C on a hot plate, and a pellet made of sealing material epoxy resin iB stage (which the applicant calls an iE pellet) is placed on the element wiring. After a few seconds, it melts, turns into a liquid, spreads out, and finally reaches the correct size at the inner edge of the fluorine-based polymer 9, which has been applied in a shape with almost no thickness, as shown in FIG. This is because fluorine-based polymers have wastewater properties that repel resins. The thus sealed substrate 1 is dried for the purpose of completely curing the sealing resin portion 5, stamped, and tested for electrical characteristics to become a completed product.

In the above example, a fluorine-based polymer was used as a coating material using a spray force method, but the applicant investigated many resins such as silicone, solder, and resist before arriving at this fluorine-based polymer material. As a result, they were unable to stop the "flowing out" and were eventually able to achieve their goal using this fluorine-based polymer.

As described above, according to the method of manufacturing a semiconductor device according to an embodiment of the present invention, the following excellent practical effects and significant economic effects can be obtained.

(1) Material costs can be reduced.

Since the 2X fluorine polymer solution is further diluted to about 2 to 7 times, it is inexpensive. Applicant's calculations show that the material source (dfi alone) is 115% compared to the phenolic frame.
~1/10 the cost.

・(2) Processing costs can be reduced.

In the conventional method, it is necessary to apply adhesive to several places on the leakage prevention tip, but in this embodiment, it is applied instantly by spraying, so there is no need for this.

(3) Since the diluted fluorine polymer solution is applied in a hollow rectangular shape, there is no flow out to the outside of the sealing resin part 5, and the quality and retention are extremely high.

(4) Since the resin is effective only by spraying and has a thickness of 1 μm, it is extremely easy to automate.

(5) Since the solvent used evaporates even at room temperature, there is no need for drying. Therefore, during this curing and drying process, the substrate is warped.
Especially excellent effects can be given to products that produce .

In the above embodiment, a COB (chip on board) with a single IC element was described, but the effects obtained by the present invention are particularly effective for a circuit board having a plurality of IC elements mounted thereon. That is, as the number of IC chips increases from one to two to three, the number of man-hours required for framing increases, and it is difficult to automate the process. However, according to the present invention, it can be sprayed and applied in one go with one mask, making it easy to automate.Also, when increasing the mounting sensitivity, the shape of the mask can be changed to seal in a hollow round shape or a hollow triangular shape. It is also possible to design a configuration that does not interfere with adjacent circuits or components. Other LEDs that require resin seals, such as Cyrisk, transistors, and diodes,
Since it can be immediately applied to electronic components such as hybrid integrated circuits, its uses are extremely wide.

(Effects of the Invention) As explained above, according to the present invention, the flow-out of the sealing resin is completely prevented by applying the monofluorinated polymer in a predetermined frame shape to the surface of the IC' element assembly board by spraying. This has practical effects in that it is possible to improve quality by preventing problems, and to significantly reduce manufacturing costs by simply improving the manufacturing method.

[Brief explanation of drawings]

Fig. 1(a) is a plan view of a conventional resin-sealed semiconductor device in which each circuit wiring is patterned on a substrate, and Fig. 1(b) shows the conventional device after assembly.
- An X-ray side sectional view, FIG. 2 is a view corresponding to FIG. 1(b) showing a resin-sealed semiconductor device according to an embodiment of the present invention, and FIG. 3 is a manufacturing of the above-mentioned semiconductor device according to an embodiment of the present invention. It is a process explanatory diagram showing a method. DESCRIPTION OF SYMBOLS 1... Synthetic resin substrate, 3... IC element, 4... Gold or aluminum wire, 5... Resin part for sealing, 7... Adhesive for die bonding, 9... Hollow rectangle 10... Spray nozzle, 11... Spray metal mask. Procedural amendment written in December 1980? , 5th, Kazuo Wakasugi, Commissioner of the Patent Office, 1, Indication of the case, 1981 - Patent Application No. 222104, 2,
Name of the invention: Resin-sealed semiconductor device and its manufacturing method 3; Relationship with the case of the person making the amendment Patent Applicant (029) Oki Electric Industry Co., Ltd. 4゜Representative 5; Date of amendment order Showa year, month, day (voluntary) ) 6. Column 7 for detailed explanation of the invention in the specification to be amended, Contents of the amendment as shown in attached sheet 7, Contents of the amendment 1) Specification, page 3, line 13, page 3, lines 14 and 15, page 18, line 1) , page 4, lines 1 and 2, and page 8, line 2, each corrected to read ``rIC element 2'' and ``rIC element 3''. 2) On page 7, lines 6 and 7, "Nozzle" is corrected to "Mask J." 3) On page 8, line 15, "Wastewater"? Corrected to "drainage". IC

Claims (2)

[Claims] (1) Synthetic resin substrate and ■ assembled on the above substrate
In a resin-sealed semiconductor device having a C element and a pellet-shaped or liquid resin part for sealing the IC element to the substrate, the resin of the resin part is sprayed onto the substrate in a predetermined shape by spraying a fluorine-based polymer. A resin-sealed semiconductor device characterized by forming a flow-out prevention means. (2) In a method for manufacturing a resin-sealed semiconductor device that uses pellet-like or liquid resin for sealing, a fluorine-based polymer is mixed and dissolved in an organic solvent, and this is sprayed through a metal mask having a predetermined pattern frame. , or by printing or stamping. After applying the above pattern on the substrate in the form of a frame, pour a pellet-like resin or liquid resin as a sealant, and seal the resin at the frame-like attachment part of the fluorine-based polymer. A method for manufacturing a resin-sealed semiconductor device, characterized by performing the following steps.