JP2016111179A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2016111179A
JP2016111179A JP2014246828A JP2014246828A JP2016111179A JP 2016111179 A JP2016111179 A JP 2016111179A JP 2014246828 A JP2014246828 A JP 2014246828A JP 2014246828 A JP2014246828 A JP 2014246828A JP 2016111179 A JP2016111179 A JP 2016111179A
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light emitting
light
submount
emitting element
substrate
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JP6537259B2 (en
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加藤　達也
Tatsuya Kato
達也 加藤
福田　匡広
Masahiro Fukuda
福田　　匡広
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device, light extraction efficiency of which is enhanced by simply providing a sub-mount, and which is also adaptable to a case where a large number of light-emitting elements are mounted collectively.SOLUTION: In a light-emitting device 1, a light-emitting element 3 is mounted on a sub-mount 4. The sub-mount 4 has a height t set to 0<t≤0.5 mm, and a mounting surface 4a is set so that the surface ratio to a bottom surface 3a of the light-emitting element 3 is 70% or less, and large enough to mount a pad on the bottom surface 3a of the light-emitting element 3. By using this sub-mount 4, light extraction efficiency can be enhanced by reflecting the light from the bottom surface 3a of the light-emitting element 3 widely on the surface of the substrate 2.SELECTED DRAWING: Figure 2

Description

本発明は、光の取り出し効率を向上させた発光装置に関するものであり、特に照明用の発光装置に関するものである。   The present invention relates to a light emitting device with improved light extraction efficiency, and more particularly to a light emitting device for illumination.

従来、発光ダイオード等の発光素子を用いた発光装置では、発光素子を基板上に直接実装していた。このように発光素子を基板上に直接実装すると、発光素子の底面側に向かう光がダイボンド用の接着剤に吸収される等、有効に利用することができず、光の取り出し効率が低下するという問題があった。   Conventionally, in a light emitting device using a light emitting element such as a light emitting diode, the light emitting element is directly mounted on a substrate. When the light-emitting element is directly mounted on the substrate in this way, the light toward the bottom surface side of the light-emitting element cannot be effectively used, such as being absorbed by the adhesive for die bonding, and the light extraction efficiency is reduced. There was a problem.

そこで、発光素子を支持台あるいは凸部上に実装することが提案されていた（例えば、特許文献１又は特許文献２参照）。   Therefore, it has been proposed to mount the light emitting element on a support base or a convex portion (see, for example, Patent Document 1 or Patent Document 2).

特開２００３−１６３３７９号公報JP 2003-163379 A 特開２００７−２８８０６７号公報JP 2007-288067 A

上記特許文献１又は特許文献２の発光装置では、凹所あるいはカップ部の底に支持台あるいは凸部を設け、その上に発光素子を実装することで、発光素子の底面からの光を凹所あるいはカップ部によって反射し、所定の方向へ照射するように構成していた。このように、上記発光装置では、凹所やカップ部の焦点位置に応じて支持台や凸部の高さが設定されると共にその形状が設定されていた。このため、支持台や凸部は、凹所やカップ部と共に形成されなければならず、また、凹所やカップ部を変更する場合にはそれに応じて変更することが必要であった。従って、発光装置毎に支持台、凸部、凹所、カップ部を適合するように変更しなければならなかった。   In the light emitting device described in Patent Document 1 or Patent Document 2, a support base or a convex portion is provided on the bottom of the recess or the cup portion, and the light emitting element is mounted thereon, so that light from the bottom surface of the light emitting element is recessed. Alternatively, the light is reflected by the cup portion and irradiated in a predetermined direction. As described above, in the light emitting device, the height of the support base and the convex portion is set and the shape is set according to the focal position of the recess or the cup portion. For this reason, a support stand and a convex part had to be formed with a concave part and a cup part, and when changing a concave part and a cup part, it was necessary to change according to it. Accordingly, the support base, the convex portion, the concave portion, and the cup portion have to be changed for each light emitting device.

また、凹所やカップ部を形成することができる基板を用いることも必要であり、基板の構造が制限されるという問題もあった。また、複数の発光素子を集合して実装する発光装置では、発光素子毎に凹所あるいはカップ部を形成することが必要となり、基板が大型化するという問題もあった。   In addition, it is necessary to use a substrate on which a recess or a cup portion can be formed, and there is a problem that the structure of the substrate is limited. Further, in a light emitting device in which a plurality of light emitting elements are assembled and mounted, it is necessary to form a recess or a cup portion for each light emitting element, which causes a problem that the substrate becomes large.

本発明が解決しようとする課題は、上記従来技術の問題点を解決し、凹所やカップ部を用いることなく基板表面による反射を有効に利用することができるサブマウントを用いることで、光取り出し効率を高め、多数の発光素子を集合させて実装する場合にも適応する発光装置を提供することにある。   The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art and to use a submount that can effectively utilize reflection from the substrate surface without using a recess or a cup portion, thereby extracting light. It is an object of the present invention to provide a light-emitting device that is highly efficient and adapts even when a large number of light-emitting elements are assembled and mounted.

本発明の発光装置は、基板と、該基板上に取り付けられた柱体からなるサブマウントと、該サブマウント上に実装された発光素子と、前記発光素子を封止する封止樹脂と、を備え、前記サブマウントの高さｔを０＜ｔ≦０．５ｍｍに設定し、前記発光素子を実装する前記サブマウントの実装面を前記発光素子の底面に対する面積比が７０％以下となる面積で且つ前記発光素子の底面にある実装用のパッドが乗る大きさ以上に設定したものである。   A light-emitting device of the present invention includes a substrate, a submount made of a column attached to the substrate, a light-emitting element mounted on the submount, and a sealing resin that seals the light-emitting element. The submount height t is set to 0 <t ≦ 0.5 mm, and the mounting surface of the submount on which the light emitting element is mounted has an area ratio of 70% or less with respect to the bottom surface of the light emitting element. In addition, the size is set to be larger than the size of the mounting pad on the bottom surface of the light emitting element.

この発光装置における前記発光素子のパッドは、前記面積比が少なくとも４０％の場合に前記パッドが前記実装面上に乗るように位置と大きさが設定されている。また、この発光装置における前記サブマウントは直方体をなすものである。また、この発光装置における前記サブマウントは反射率の高い外面を有している。更に、この発光装置における前記サブマウントは透明体からなる。   The pad of the light emitting element in this light emitting device is set in position and size so that the pad rides on the mounting surface when the area ratio is at least 40%. Further, the submount in this light emitting device is a rectangular parallelepiped. Further, the submount in the light emitting device has an outer surface having a high reflectance. Further, the submount in the light emitting device is made of a transparent body.

また、上記発光装置において、前記基板は金属基板と該金属基板上に固着され発光エリアに対応する部分に孔が設けられた樹脂基板とからなり、前記樹脂基板の孔内の前記金属基板上に前記サブマウントが取り付けられ、該サブマウント上に前記発光素子がダイボンドされ、前記樹脂基板の孔の周囲に配線パターンが設けられ、該配線パターンに前記発光素子がワイヤボンドされ、前記孔を囲う枠状樹脂を備え、該枠状樹脂の内側に前記封止樹脂が設けられて前記発光素子、サブマウント及びワイヤを封止するものとなっている。この発光装置における前記サブマウント及び発光素子は前記発光エリア内に複数設けられている。   Further, in the light emitting device, the substrate includes a metal substrate and a resin substrate fixed on the metal substrate and provided with a hole in a portion corresponding to the light emitting area, on the metal substrate in the hole of the resin substrate. The submount is attached, the light emitting element is die-bonded on the submount, a wiring pattern is provided around the hole of the resin substrate, the light emitting element is wirebonded to the wiring pattern, and a frame surrounding the hole The sealing resin is provided inside the frame-shaped resin to seal the light emitting element, the submount, and the wire. A plurality of the submounts and light emitting elements in the light emitting device are provided in the light emitting area.

本発明の発光装置では、最適条件を満たすように形成された柱体のサブマウントを用いることで、発光素子の底面からの光を基板表面で反射して周囲に照射することができ、光の取り出し効率を向上させることができる。特に、照明用の発光装置では、特定の方向のみに光を照射するだけでなく、周囲にも光を照射することで全体を明るく照明することが必要であり、本発明の発光装置は照明用として好ましい特性を得ることができる。   In the light-emitting device of the present invention, by using a columnar submount formed so as to satisfy the optimum condition, light from the bottom surface of the light-emitting element can be reflected by the substrate surface and irradiated to the surroundings. The extraction efficiency can be improved. In particular, in a light emitting device for illumination, it is necessary not only to irradiate light only in a specific direction but also to illuminate the entire area by illuminating the surroundings, and the light emitting device of the present invention is used for illumination. As a result, preferable characteristics can be obtained.

また、本発明におけるサブマウントは、その高さを所定の範囲内に設定すると共に発光素子の底面との面積比により形成されているため、基板の構造に関わらず、予めサブマウントを用意しておくことができる。そして、そのサブマウントを使用するだけで、どのような基板にでも最適条件で適応させることができる。   In addition, since the height of the submount in the present invention is set within a predetermined range and the area ratio to the bottom surface of the light emitting element, the submount is prepared in advance regardless of the structure of the substrate. I can leave. And by using only the submount, it can be adapted to any substrate under optimum conditions.

また、基板上に多数の発光素子を集合させて実装する場合、多数の発光素子が実装されることで利用できなかった基板表面を有効に利用することができるようになり、基板等の構造を変更することなく光の取り出し効率を高めることができる。   In addition, when a large number of light emitting elements are assembled and mounted on a substrate, the surface of the substrate that could not be used due to the mounting of a large number of light emitting elements can be used effectively. The light extraction efficiency can be increased without change.

本発明の一実施形態に係る発光装置を示す斜視図である。It is a perspective view which shows the light-emitting device which concerns on one Embodiment of this invention. 図１に示す発光装置の断面図である。It is sectional drawing of the light-emitting device shown in FIG. 図１に示す基板の斜視図である。It is a perspective view of the board | substrate shown in FIG. 図３に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図３に示す基板にサブマウントを取り付けた状態を示す斜視図である。It is a perspective view which shows the state which attached the submount to the board | substrate shown in FIG. 図５に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図５に示す基板に発光素子をダイボンドした状態を示す斜視図である。FIG. 6 is a perspective view showing a state where a light emitting element is die-bonded to the substrate shown in FIG. 5. 図７に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図７において発光素子と配線パターンをワイヤボンドした状態を示す斜視図である。FIG. 8 is a perspective view showing a state where the light emitting element and the wiring pattern are wire-bonded in FIG. 7. 図９に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図９に示す基板の配線パターン上に枠状樹脂を形成した状態を示す斜視図である。It is a perspective view which shows the state which formed frame-shaped resin on the wiring pattern of the board | substrate shown in FIG. 図１１に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. サブマウントの高さによる光取り出し効率の変化を計測する発光装置の構成を示す断面図である。It is sectional drawing which shows the structure of the light-emitting device which measures the change of the light extraction efficiency by the height of a submount. 図１３に示した発光装置で計測したサブマウントの高さと光取り出し効率との関係を示す図である。It is a figure which shows the relationship between the height of the submount measured with the light-emitting device shown in FIG. 13, and light extraction efficiency. サブマウントの実装面と発光素子の底面の面積比による光取り出し効率の変化を計測する発光素子とサブマウントの構成を示す側面図である。It is a side view which shows the structure of the light emitting element and submount which measure the change of the light extraction efficiency by the area ratio of the mounting surface of a submount, and the bottom face of a light emitting element. 図１５に示した構成で計測した場合のサブマウントの面積比と光取り出し効率との関係を示す図である。FIG. 16 is a diagram showing the relationship between the area ratio of the submount and the light extraction efficiency when measured with the configuration shown in FIG. 15.

図１及び図２に示すように、本発明の一実施形態に係る発光装置１は、基板２の中央の発光エリアＥＡに複数の発光素子３とサブマウント４を設けたものとなっている。基板２は、熱伝導率が高く放熱性に優れた金属、合金からなる金属基板２Ａと、その上に重ねて固着されたガラスエポキシ等の樹脂からなる樹脂基板２Ｂとからなる。金属基板２Ａは矩形状の板からなり、中央に複数の発光素子３とサブマウント４が取り付けられている。また、樹脂基板２Ｂは、金属基板２Ａにおける発光素子３が設けられた発光エリアＥＡに対応する部分に孔２ａを有している。この樹脂基板２Ａには、図３及び図４に示すように、孔２ａの周囲に配線パターン５，６が設けられている。   As shown in FIGS. 1 and 2, a light emitting device 1 according to an embodiment of the present invention is provided with a plurality of light emitting elements 3 and submounts 4 in a light emitting area EA in the center of a substrate 2. The substrate 2 is composed of a metal substrate 2A made of a metal or alloy having high thermal conductivity and excellent heat dissipation, and a resin substrate 2B made of a resin such as glass epoxy that is stacked and fixed thereon. The metal substrate 2A is made of a rectangular plate, and a plurality of light emitting elements 3 and submounts 4 are attached to the center. The resin substrate 2B has a hole 2a in a portion corresponding to the light emitting area EA in which the light emitting element 3 is provided in the metal substrate 2A. As shown in FIGS. 3 and 4, the resin substrate 2A is provided with wiring patterns 5 and 6 around the hole 2a.

サブマウント４は、樹脂、金属、セラミック等からなるもので、直方体、円柱等の柱体をなすものとなっている。本実施形態におけるサブマウント４は、図５及び図６に示すように、金属基板２Ａにおける発光素子３が取り付けられる位置に接着等により取り付けられている。このサブマウント４は、その高さｔが０＜ｔ≦０．５ｍｍに設定されており、発光素子３が実装される実装面４ａ（図中上方の端面）が発光素子３の底面３ａに対する面積比が７０％以下となる面積で且つ発光素子３の底面３ａにあるダイボンド用のパッドが乗る大きさ以上に設定されている。また、サブマウント４は白色の樹脂やセラミックで形成するか又は金属で形成することで、その外面が反射率の高い面で構成される。また、サブマウント４を透明な樹脂等で構成することで透明体とする場合もある。なお、この最適条件については後述する。   The submount 4 is made of resin, metal, ceramic, or the like, and forms a columnar body such as a rectangular parallelepiped or a cylinder. As shown in FIGS. 5 and 6, the submount 4 in the present embodiment is attached to the position where the light emitting element 3 is attached on the metal substrate 2 </ b> A by adhesion or the like. The submount 4 has a height t set to 0 <t ≦ 0.5 mm, and the mounting surface 4a (upper end surface in the drawing) on which the light emitting element 3 is mounted has an area relative to the bottom surface 3a of the light emitting element 3. The area is such that the ratio is 70% or less, and is set to be larger than the size on which the pad for die bonding on the bottom surface 3a of the light emitting element 3 is placed. In addition, the submount 4 is formed of white resin or ceramic, or is formed of metal, so that the outer surface thereof is configured with a surface having high reflectance. In some cases, the submount 4 is made of a transparent resin or the like to form a transparent body. This optimum condition will be described later.

発光素子３は、図７及び図８に示すように、サブマウント４の上にダイボンドされ、図９及び図１０に示すように、幾つかのグループに分かれて配線パターン５，６間に直列にワイヤ７で接続されている。   The light emitting element 3 is die-bonded on the submount 4 as shown in FIGS. 7 and 8, and is divided into several groups in series between the wiring patterns 5 and 6, as shown in FIGS. They are connected by wires 7.

配線パターン５，６の上には、図１１及び図１２に示すように、エポキシ樹脂、シリコン樹脂等からなる枠状樹脂８が設けられている。この枠状樹脂８は、発光エリアＥＡを囲う環状に形成されている。   As shown in FIGS. 11 and 12, a frame-shaped resin 8 made of epoxy resin, silicon resin, or the like is provided on the wiring patterns 5 and 6. This frame-shaped resin 8 is formed in an annular shape surrounding the light emitting area EA.

図１及び図２に示すように、枠状樹脂８の内側には、蛍光体を含有するエポキシ樹脂、シリコン樹脂等の樹脂からなる封止樹脂９が設けられている。この封止樹脂９により発光素子３、ワイヤ７及びサブマウント４は封止されている。   As shown in FIGS. 1 and 2, a sealing resin 9 made of a resin such as an epoxy resin containing a phosphor or a silicon resin is provided inside the frame-shaped resin 8. The light emitting element 3, the wire 7 and the submount 4 are sealed with the sealing resin 9.

上記構成からなる発光装置１では、サブマウント４を設けたことにより、発光素子３を金属基板２Ａの表面から一定の高さに持ち上げている。このときに、サブマウント４の実装面４ａが発光素子３の底面３ａよりも一定の割合で面積が小さくなるように設定しているため、発光素子３の底面からの光がサブマウント周囲の金属基板２Ａの表面で反射され、上方に広がるように照射される。これにより、この発光装置１は、上方の照射方向及び周辺に光を照射することになり、光取り出し効率が向上する。特に、この発光装置１では照射する光が周辺に広がり、光の広がりを必要とする照明として好ましい状態になる。   In the light emitting device 1 having the above-described configuration, the light emitting element 3 is lifted from the surface of the metal substrate 2A to a certain height by providing the submount 4. At this time, since the mounting surface 4a of the submount 4 is set to have a smaller area than the bottom surface 3a of the light emitting element 3, the light from the bottom surface of the light emitting element 3 is reflected by the metal around the submount. It is reflected by the surface of the substrate 2A and irradiated so as to spread upward. Thereby, this light-emitting device 1 will irradiate light to the upper irradiation direction and its periphery, and the light extraction efficiency is improved. In particular, in the light emitting device 1, the irradiated light spreads to the periphery, which is a preferable state for illumination that requires the spread of light.

次に、図１３乃至図１６に基づいて、サブマウント４に関する最適条件を求める実験を説明する。はじめに、サブマウントの高さｔを変化させたときの光取り出し効率の変化を図１３に示す発光装置１１により計測した例を説明する。この発光装置１１は、基板１２上にサブマウント１４を取り付け、その上に発光素子１３をダイボンドし、ワイヤ１７で発光素子１３を基板１２上の配線パターン等に接続して、封止樹脂１９で封止したものである。この発光装置１１におけるサブマウント１４の高さｔを０．１ｍｍから０．１ｍｍ刻みで増加させたときの光束を計測し、サブマウント１４を設けなかった場合（高さｔが０ｍｍ）の光束と比較した。なお、サブマウント１４の実装面１４ａ（上方の端面）は、発光素子１３の底面１３ａ（下方の端面）と同一形状（同じ面積）となるように設定してある。また、発光素子１３の上面から封止樹脂１９の上面までの距離ｄを２５０μで一定に設定してある。更に、この計測では、白色の樹脂で形成したサブマウント１４を使用した。   Next, an experiment for obtaining an optimum condition for the submount 4 will be described with reference to FIGS. First, an example in which a change in light extraction efficiency when the height t of the submount is changed is measured by the light emitting device 11 shown in FIG. In the light emitting device 11, a submount 14 is attached on a substrate 12, a light emitting element 13 is die-bonded thereon, the light emitting element 13 is connected to a wiring pattern or the like on the substrate 12 with a wire 17, and a sealing resin 19 is used. It is sealed. When the height t of the submount 14 in the light emitting device 11 is increased from 0.1 mm in increments of 0.1 mm, the luminous flux is measured, and the luminous flux when the submount 14 is not provided (the height t is 0 mm) Compared. The mounting surface 14a (upper end surface) of the submount 14 is set to have the same shape (the same area) as the bottom surface 13a (lower end surface) of the light emitting element 13. Further, the distance d from the upper surface of the light emitting element 13 to the upper surface of the sealing resin 19 is set constant at 250 μm. Further, in this measurement, a submount 14 formed of a white resin was used.

その結果、サブマウント１４を設けなかったときの光束を１００％とすると、図１４に示すように、高さｔを０．１ｍｍにすると光束が増して光取り出し効率が１％以上向上し、それ以上高くすると封止樹脂１９等の樹脂による光の吸収によって徐々に低下する。このような光取り出し効率の低下は、図１に示す発光装置１では、封止樹脂９だけでなく、枠状樹脂８や樹脂基板２Ｂ等によってより顕著に生じる可能性がある。そして、高さｔが０．６ｍｍを越えると、サブマウント１４を設けなかった場合と同等あるいはそれよりも低下する。上記より、サブマウント１４の高さｔは０．１ｍｍ前後に設定することが好ましく、０＜ｔ≦０．５ｍｍに設定することで、光取り出し効率の向上が可能であることが確認できた。   As a result, assuming that the light flux when the submount 14 is not provided is 100%, as shown in FIG. 14, when the height t is 0.1 mm, the light flux increases and the light extraction efficiency is improved by 1% or more. If it is increased above, it gradually decreases due to light absorption by the resin such as the sealing resin 19. Such a decrease in light extraction efficiency may occur more significantly in the light emitting device 1 shown in FIG. 1 due to not only the sealing resin 9 but also the frame-shaped resin 8 and the resin substrate 2B. When the height t exceeds 0.6 mm, the height t is the same as or lower than when the submount 14 is not provided. From the above, it has been confirmed that the height t of the submount 14 is preferably set to around 0.1 mm, and that the light extraction efficiency can be improved by setting 0 <t ≦ 0.5 mm.

一方、図１５に示すように、サブマウント１４の実装面１４ａと発光素子１３の底面１３ａとの面積比を０〜１００％（０％は発光素子１３が宙に浮いている状態、１００％は実装面１４ａと底面１３ａの面積が同一の状態）まで変化した場合の光取り出し効率を計測した。なお、ここではサブマウント１４の高さを０．１ｍｍで一定に設定した。   On the other hand, as shown in FIG. 15, the area ratio between the mounting surface 14a of the submount 14 and the bottom surface 13a of the light emitting element 13 is 0 to 100% (0% is a state where the light emitting element 13 is floating in the air, 100% is The light extraction efficiency was measured when the mounting surface 14a and the bottom surface 13a had the same area). Here, the height of the submount 14 was set constant at 0.1 mm.

その結果、図１６に示すように、そのグラフから変曲点が面積比７０％の場合と見て取れ、サブマウント１４の実装面１４ａを発光素子１３の底面１３ａの面積比７０％以下に設定することが好ましいことが確認できた。ただし、サブマウント１４の実装面１４ａが小さい程、光取り出し効率の向上が望めるものの、面積比が６０％以下では０％とほとんど変わらず、それ以上小さくする必要がないことが分かった。また、あまりに面積比を小さくすると、発光素子１３のボンディング時の強度が低下することにもなる。そこで、面積比が７０％以下で、発光素子１３の底面１３ａにあるダイボンド用のパッドが乗る大きさを最小限とすることで、ボンディング強度を確保しつつ、光取り出し効率を向上させることが可能となることが確認できた。なお、上記のように、面積比が６０％以下ではほとんど光取り出し効率に変化がないが、面積比が４０％でわずかにピークが認められるので、少なくとも面積比が４０％の場合に発光素子１３のダイボンド用のパッドが実装面１４ａ上に乗るように、パッドの位置と大きさが設定されていることが好ましい。   As a result, as shown in FIG. 16, it can be seen from the graph that the inflection point is an area ratio of 70%, and the mounting surface 14a of the submount 14 is set to an area ratio of 70% or less of the bottom surface 13a of the light emitting element 13. It was confirmed that is preferable. However, although it can be expected that the light extraction efficiency is improved as the mounting surface 14a of the submount 14 is smaller, it has been found that when the area ratio is 60% or less, it is almost the same as 0% and does not need to be further reduced. If the area ratio is too small, the strength of the light emitting element 13 during bonding is also reduced. Therefore, the light extraction efficiency can be improved while securing the bonding strength by minimizing the size of the die bonding pad on the bottom surface 13a of the light emitting element 13 when the area ratio is 70% or less. It was confirmed that As described above, there is almost no change in the light extraction efficiency when the area ratio is 60% or less, but a slight peak is observed when the area ratio is 40%. Therefore, at least when the area ratio is 40%, the light emitting element 13 is used. It is preferable that the position and size of the pad are set so that the die bonding pad is placed on the mounting surface 14a.

上記何れの実験においても、サブマウント１４を反射率の高い白色樹脂で形成しており、白色のセラミック、あるいは反射率の高い金属で形成した場合も同様の結果が得られる。これを、透明樹脂等の透明体で形成した場合、サブマウント１４の高さｔが０．１ｍｍのときに光取り出し効率が２％向上することが確認されている。また、透明体でサブマウント１４を形成した場合、その実装面１４ａと発光素子１３の底面１３ａとの面積比を考慮する必要性が低くなるとも考えられるが、透明体の場合であってもサブマウント１４が樹脂製であると、微細ではあっても光が吸収され、また接着剤等で吸収されることもあるため、面積比も上記と同様に設定することが最も好ましい。   In any of the above experiments, the same result can be obtained when the submount 14 is formed of a white resin having a high reflectance and is formed of a white ceramic or a metal having a high reflectance. When it is formed of a transparent body such as a transparent resin, it has been confirmed that the light extraction efficiency is improved by 2% when the height t of the submount 14 is 0.1 mm. Further, when the submount 14 is formed of a transparent body, it may be less necessary to consider the area ratio between the mounting surface 14a and the bottom surface 13a of the light emitting element 13. If the mount 14 is made of resin, light is absorbed even if it is fine, and may be absorbed by an adhesive or the like. Therefore, the area ratio is most preferably set in the same manner as described above.

また、前述したように、光取り出し効率の低下は、図１に示す発光装置１では、封止樹脂９だけでなく、枠状樹脂８や樹脂基板２Ｂ等による光の吸収によってより顕著に生じる可能性がある。特に、発光装置１のように複数の発光素子３を集合させて実装したものでは、発光素子３が多数実装されることで金属基板２Ａの表面における光を反射する部分が減少していることも影響する。そこで、このような発光装置１にサブマウント４を使用すると、樹脂等により吸収された分を補い、基板表面をより有効に使用して光を反射することができる。従って、発光装置１のような構成の場合、サブマウント４を使用することは、光取り出し効率を高める極めて有効な手段となる。   Further, as described above, in the light emitting device 1 shown in FIG. 1, the light extraction efficiency can be significantly reduced by light absorption not only by the sealing resin 9 but also by the frame-shaped resin 8 and the resin substrate 2B. There is sex. In particular, in the case where a plurality of light emitting elements 3 are assembled and mounted as in the light emitting device 1, the number of light emitting elements 3 mounted on the surface of the metal substrate 2 </ b> A reduces the portion that reflects light. Affect. Therefore, when the submount 4 is used in such a light emitting device 1, the amount absorbed by the resin or the like can be compensated, and light can be reflected using the substrate surface more effectively. Therefore, in the case of a configuration such as the light emitting device 1, using the submount 4 is a very effective means for increasing the light extraction efficiency.

次に、図３乃至図１２に基づいて上記発光装置１の製造方法を説明する。図３及び図４に示すように、この発光装置１における基板２は、中央に発光素子３を実装する発光エリアＥＡが設けられた金属基板２Ａに、発光エリアＥＡに適合する孔２ａと、その縁にそれぞれ半円形状に形成された配線パターン５，６とを有する樹脂基板２Ｂを重ねて固着したものである。はじめに、図５及び図６に示すように、金属基板２Ａ上に柱体をなす複数のサブマウント４を固着する。そして、図７及び図８に示すように、このサブマウント４の上に複数の発光素子３をそれぞれダイボンドすることで実装する。その後、図９及び図１０に示すように、ワイヤ７で発光素子３を配線パターン５，６に接続すると共に隣接する発光素子３を接続する。その後、図１１及び図１２に示すように、ポッティング等により、配線パターン５，６の上に枠状樹脂８を環状に形成する。そして、この枠状樹脂８の内側に蛍光体等を混入した封止樹脂９を充填することで、図１及び図２に示したような発光装置１が完成する。   Next, a method for manufacturing the light emitting device 1 will be described with reference to FIGS. As shown in FIGS. 3 and 4, the substrate 2 in the light emitting device 1 includes a metal substrate 2 </ b> A provided with a light emitting area EA for mounting the light emitting element 3 in the center, a hole 2 a that fits the light emitting area EA, A resin substrate 2B having wiring patterns 5 and 6 each formed in a semicircular shape on each edge is overlapped and fixed. First, as shown in FIGS. 5 and 6, a plurality of submounts 4 forming columnar bodies are fixed onto the metal substrate 2 </ b> A. Then, as shown in FIGS. 7 and 8, the plurality of light emitting elements 3 are mounted on the submount 4 by die bonding. Thereafter, as shown in FIGS. 9 and 10, the light emitting element 3 is connected to the wiring patterns 5 and 6 by the wire 7 and the adjacent light emitting elements 3 are connected. Thereafter, as shown in FIGS. 11 and 12, a frame-shaped resin 8 is formed in an annular shape on the wiring patterns 5 and 6 by potting or the like. Then, the inside of the frame-shaped resin 8 is filled with a sealing resin 9 mixed with a phosphor or the like, whereby the light emitting device 1 as shown in FIGS. 1 and 2 is completed.

上記のように、サブマウント４を用いても、構造の変更等を伴わず、また、製造工程の追加も最小限に抑えつつ光取り出し効率を向上させることができる。   As described above, even if the submount 4 is used, the light extraction efficiency can be improved without changing the structure or the like and minimizing the addition of the manufacturing process.

１，１１ 発光装置
２，１２ 基板
２Ａ 金属基板
２Ｂ 樹脂基板
３，１３ 発光素子
３ａ，１３ａ 底面
４，１４ サブマウント
４ａ，１４ａ 実装面
５，６ 配線パターン
７，１７ ワイヤ
８ 枠状樹脂
９，１９ 封止樹脂
ＥＡ 発光エリア DESCRIPTION OF SYMBOLS 1,11 Light-emitting device 2,12 Board | substrate 2A Metal substrate 2B Resin board | substrate 3,13 Light-emitting element 3a, 13a Bottom face 4,14 Submount 4a, 14a Mounting surface 5,6 Wiring pattern 7,17 Wire 8 Frame-like resin 9,19 Sealing resin EA Light emitting area

Claims (7)

基板と、
該基板上に取り付けられた柱体からなるサブマウントと、
該サブマウント上に実装された発光素子と、
前記発光素子を封止する封止樹脂と、
を備え、
前記サブマウントの高さｔを０＜ｔ≦０．５ｍｍに設定し、前記発光素子を実装する前記サブマウントの実装面を前記発光素子の底面に対する面積比が７０％以下となる面積で且つ前記発光素子の底面にある実装用のパッドが乗る大きさ以上に設定したことを特徴とする発光装置。 A substrate,
A submount consisting of pillars mounted on the substrate;
A light emitting device mounted on the submount;
A sealing resin for sealing the light emitting element;
With
The height t of the submount is set to 0 <t ≦ 0.5 mm, the mounting surface of the submount on which the light emitting element is mounted is an area where the area ratio with respect to the bottom surface of the light emitting element is 70% or less, and A light-emitting device characterized in that it is set to be larger than a mounting pad on the bottom surface of the light-emitting element. 前記発光素子のパッドは、前記面積比が少なくとも４０％の場合に前記パッドが前記実装面上に乗るように位置と大きさが設定されている請求項１に記載の発光装置。   2. The light emitting device according to claim 1, wherein a position and a size of the pad of the light emitting element are set such that the pad is placed on the mounting surface when the area ratio is at least 40%. 前記サブマウントは直方体をなす請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the submount has a rectangular parallelepiped shape. 前記サブマウントは反射率の高い外面を有している請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the submount has an outer surface having a high reflectance. 前記サブマウントは透明体からなる請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the submount is made of a transparent body. 前記基板は金属基板と該金属基板上に固着され発光エリアに対応する部分に孔が設けられた樹脂基板とからなり、
前記樹脂基板の孔内の前記金属基板上に前記サブマウントが取り付けられ、
該サブマウント上に前記発光素子がダイボンドされ、
前記樹脂基板の孔の周囲に配線パターンが設けられ、該配線パターンに前記発光素子がワイヤボンドされ、
前記孔を囲う枠状樹脂を備え、
該枠状樹脂の内側に前記封止樹脂が設けられて前記発光素子、サブマウント及びワイヤを封止する請求項１〜５の一つに記載の発光装置。 The substrate is composed of a metal substrate and a resin substrate fixed on the metal substrate and provided with a hole in a portion corresponding to a light emitting area,
The submount is mounted on the metal substrate in the hole of the resin substrate,
The light emitting element is die-bonded on the submount,
A wiring pattern is provided around the hole of the resin substrate, and the light emitting element is wire-bonded to the wiring pattern,
A frame-shaped resin surrounding the hole;
The light emitting device according to claim 1, wherein the sealing resin is provided inside the frame-shaped resin to seal the light emitting element, the submount, and the wire. 前記サブマウント及び発光素子は前記発光エリア内に複数設けられている請求項６に記載の発光装置。   The light emitting device according to claim 6, wherein a plurality of the submounts and the light emitting elements are provided in the light emitting area.
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