JP2014214307A - 低熱膨張率および高耐熱性を有するプリント基板用絶縁樹脂組成物、これを用いたプリプレグ、銅張積層板およびプリント基板 - Google Patents

低熱膨張率および高耐熱性を有するプリント基板用絶縁樹脂組成物、これを用いたプリプレグ、銅張積層板およびプリント基板 Download PDF

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Publication number
JP2014214307A
JP2014214307A JP2013144544A JP2013144544A JP2014214307A JP 2014214307 A JP2014214307 A JP 2014214307A JP 2013144544 A JP2013144544 A JP 2013144544A JP 2013144544 A JP2013144544 A JP 2013144544A JP 2014214307 A JP2014214307 A JP 2014214307A
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JP
Japan
Prior art keywords
epoxy resin
resin composition
printed circuit
insulating resin
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013144544A
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English (en)
Japanese (ja)
Inventor
ヨン リ，グン
Gun Yong Lee
ヨン リ，グン
ジュン リ，ヒョン
Hyun Jun Lee
ジュン リ，ヒョン
ソク ムン，ジン
Jin Seok Moon
ソク ムン，ジン
ヒョン ユ，ソン
Seong Hyun Yoo
ヒョン ユ，ソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2014214307A publication Critical patent/JP2014214307A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2013144544A 2013-04-24 2013-07-10 低熱膨張率および高耐熱性を有するプリント基板用絶縁樹脂組成物、これを用いたプリプレグ、銅張積層板およびプリント基板 Pending JP2014214307A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130045540A KR20140127039A (ko) 2013-04-24 2013-04-24 저열팽창율 및 고내열성을 갖는 인쇄회로기판용 절연수지 조성물, 이를 이용한 프리프레그, 동박적층판, 및 인쇄회로기판
KR10-2013-0045540 2013-04-24

Publications (1)

Publication Number Publication Date
JP2014214307A true JP2014214307A (ja) 2014-11-17

Family

ID=51765293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013144544A Pending JP2014214307A (ja) 2013-04-24 2013-07-10 低熱膨張率および高耐熱性を有するプリント基板用絶縁樹脂組成物、これを用いたプリプレグ、銅張積層板およびプリント基板

Country Status (4)

Country Link
JP (1) JP2014214307A (zh)
KR (1) KR20140127039A (zh)
CN (1) CN104119643A (zh)
TW (1) TW201441298A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016104788A1 (ja) * 2014-12-26 2016-06-30 日立化成株式会社 エポキシ樹脂成形材料、成形物、成形硬化物及び成形物の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101943698B1 (ko) * 2016-01-29 2019-01-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
CN105932005A (zh) * 2016-04-01 2016-09-07 无锡麟力科技有限公司 一种基于通用esop8引线框架的多芯片封装结构
CN105870096A (zh) * 2016-04-01 2016-08-17 无锡麟力科技有限公司 一种基于单基岛sot23引线框架的多芯片封装结构
KR101982049B1 (ko) 2016-11-23 2019-05-24 삼성전기주식회사 팬-아웃 반도체 패키지
US20190345325A1 (en) * 2018-05-11 2019-11-14 Samsung Electronics Co., Ltd. Resin composition for printed circuit board and integrated circuit package, and product using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016104788A1 (ja) * 2014-12-26 2016-06-30 日立化成株式会社 エポキシ樹脂成形材料、成形物、成形硬化物及び成形物の製造方法
JPWO2016104788A1 (ja) * 2014-12-26 2017-10-05 日立化成株式会社 エポキシ樹脂成形材料、成形物、成形硬化物及び成形物の製造方法
JP2021046552A (ja) * 2014-12-26 2021-03-25 昭和電工マテリアルズ株式会社 エポキシ樹脂成形材料、成形物、成形硬化物及び成形物の製造方法
JP7160080B2 (ja) 2014-12-26 2022-10-25 昭和電工マテリアルズ株式会社 エポキシ樹脂成形材料、成形物、成形硬化物及び成形物の製造方法

Also Published As

Publication number Publication date
TW201441298A (zh) 2014-11-01
KR20140127039A (ko) 2014-11-03
CN104119643A (zh) 2014-10-29

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