JP2014201060A5 - - Google Patents

Download PDF

Info

Publication number
JP2014201060A5
JP2014201060A5 JP2013088810A JP2013088810A JP2014201060A5 JP 2014201060 A5 JP2014201060 A5 JP 2014201060A5 JP 2013088810 A JP2013088810 A JP 2013088810A JP 2013088810 A JP2013088810 A JP 2013088810A JP 2014201060 A5 JP2014201060 A5 JP 2014201060A5
Authority
JP
Japan
Prior art keywords
layer
carrier
copper foil
copper
ultrathin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013088810A
Other languages
English (en)
Japanese (ja)
Other versions
JP6254357B2 (ja
JP2014201060A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013088810A priority Critical patent/JP6254357B2/ja
Priority claimed from JP2013088810A external-priority patent/JP6254357B2/ja
Publication of JP2014201060A publication Critical patent/JP2014201060A/ja
Publication of JP2014201060A5 publication Critical patent/JP2014201060A5/ja
Application granted granted Critical
Publication of JP6254357B2 publication Critical patent/JP6254357B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013088810A 2013-04-03 2013-04-03 キャリア付銅箔 Expired - Fee Related JP6254357B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013088810A JP6254357B2 (ja) 2013-04-03 2013-04-03 キャリア付銅箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013088810A JP6254357B2 (ja) 2013-04-03 2013-04-03 キャリア付銅箔

Publications (3)

Publication Number Publication Date
JP2014201060A JP2014201060A (ja) 2014-10-27
JP2014201060A5 true JP2014201060A5 (OSRAM) 2016-05-26
JP6254357B2 JP6254357B2 (ja) 2017-12-27

Family

ID=52351927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013088810A Expired - Fee Related JP6254357B2 (ja) 2013-04-03 2013-04-03 キャリア付銅箔

Country Status (1)

Country Link
JP (1) JP6254357B2 (OSRAM)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236003A (ja) * 1994-11-30 1996-09-13 Hitachi Chem Co Ltd チップ型電流保護素子およびその製造法
JPH08236002A (ja) * 1994-11-30 1996-09-13 Hitachi Chem Co Ltd チップ型電流保護素子およびその製造法
JPH08236001A (ja) * 1994-11-30 1996-09-13 Hitachi Chem Co Ltd チップ型電流保護素子およびその製造法
JPH08235999A (ja) * 1994-12-01 1996-09-13 Hitachi Chem Co Ltd チップ型電流保護素子およびその製造法
EP2752505B1 (en) * 2011-08-31 2016-03-23 JX Nippon Mining & Metals Corporation Copper foil with carrier
JP5175992B1 (ja) * 2012-07-06 2013-04-03 Ｊｘ日鉱日石金属株式会社 極薄銅箔及びその製造方法、並びに極薄銅層
JP5156873B1 (ja) * 2012-07-25 2013-03-06 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP5347074B1 (ja) * 2013-01-17 2013-11-20 Ｊｘ日鉱日石金属株式会社 極薄銅箔及びその製造方法、極薄銅層、並びにプリント配線板

Similar Documents

Publication Publication Date Title
JP2015042785A5 (OSRAM)
CN103430642B (zh) 多层印刷线路板的制造方法
JP2017203219A5 (OSRAM)
JP2009272589A5 (OSRAM)
MY177723A (en) Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board
MY165091A (en) Copper foil for printed circuit
WO2008146448A1 (ja) ピーラブル性を有する積層体およびその製造方法
MY182166A (en) Copper foil, copper foil with carrier foil, and copper-clad laminate
MY177771A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
JP6687765B2 (ja) キャリア付金属箔
MY167064A (en) Multilayer printed wiring board manufacturing method
JP2015010275A5 (ja) キャリア付銅箔、その製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
MY178787A (en) Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices
MY173569A (en) Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
MY194478A (en) Copper foil, printed wiring board using same, method for fabricating electronic device, and method for fabricating printed wiring board
JP2014201829A5 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
MY157604A (en) Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board
BR112012026002A2 (pt) folha de decoração metálica, método de fazer a mesma, e produto moldado de resina
MY154122A (en) Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
JP2014201828A5 (ja) キャリア付銅箔、銅張積層板の製造方法及びプリント配線板の製造方法
JP2014123630A5 (OSRAM)
JP2015010273A5 (ja) キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
MY180430A (en) Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
JP2015026654A5 (ja) キャリア付銅箔、銅張積層板の製造方法及びプリント配線板の製造方法
JP2014194067A5 (ja) キャリア付銅箔、銅張積層板の製造方法、及び、プリント配線板の製造方法