JP2014196521A5 - - Google Patents

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Publication number
JP2014196521A5
JP2014196521A5 JP2014151513A JP2014151513A JP2014196521A5 JP 2014196521 A5 JP2014196521 A5 JP 2014196521A5 JP 2014151513 A JP2014151513 A JP 2014151513A JP 2014151513 A JP2014151513 A JP 2014151513A JP 2014196521 A5 JP2014196521 A5 JP 2014196521A5
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JP
Japan
Prior art keywords
epoxy resin
resin composition
liquid epoxy
inorganic filler
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014151513A
Other languages
English (en)
Japanese (ja)
Other versions
JP5929977B2 (ja
JP2014196521A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014151513A priority Critical patent/JP5929977B2/ja
Priority claimed from JP2014151513A external-priority patent/JP5929977B2/ja
Publication of JP2014196521A publication Critical patent/JP2014196521A/ja
Publication of JP2014196521A5 publication Critical patent/JP2014196521A5/ja
Application granted granted Critical
Publication of JP5929977B2 publication Critical patent/JP5929977B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2014151513A 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置 Expired - Lifetime JP5929977B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014151513A JP5929977B2 (ja) 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014151513A JP5929977B2 (ja) 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013001004A Division JP5708666B2 (ja) 2013-01-08 2013-01-08 液状エポキシ樹脂組成物及び電子部品装置

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2015145160A Division JP2015193851A (ja) 2015-07-22 2015-07-22 液状エポキシ樹脂組成物及び電子部品装置
JP2015145165A Division JP2015180760A (ja) 2015-07-22 2015-07-22 液状エポキシ樹脂組成物及び電子部品装置
JP2015145155A Division JP5924443B2 (ja) 2015-07-22 2015-07-22 液状エポキシ樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JP2014196521A JP2014196521A (ja) 2014-10-16
JP2014196521A5 true JP2014196521A5 (enExample) 2015-03-19
JP5929977B2 JP5929977B2 (ja) 2016-06-08

Family

ID=52357519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014151513A Expired - Lifetime JP5929977B2 (ja) 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置

Country Status (1)

Country Link
JP (1) JP5929977B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7040129B2 (ja) * 2018-03-01 2022-03-23 味の素株式会社 封止用樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3093621B2 (ja) * 1995-01-30 2000-10-03 松下電器産業株式会社 半導体装置の実装方法
JPH09223720A (ja) * 1996-02-15 1997-08-26 Toshiba Corp 半導体パッケージ装置およびその製造方法
JP3729225B2 (ja) * 1996-08-29 2005-12-21 信越化学工業株式会社 半導体装置
JP2967080B1 (ja) * 1998-05-14 1999-10-25 松下電器産業株式会社 半導体装置の実装体の製造方法
JP2001019745A (ja) * 1999-07-07 2001-01-23 Sumitomo Bakelite Co Ltd 半導体装置の製造方法及び半導体装置
JP2001127215A (ja) * 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd 液状樹脂組成物及びそれを用いた半導体装置
JP3723461B2 (ja) * 2000-06-08 2005-12-07 日本電気株式会社 電子部品装置
JP2002284849A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
JP2003238141A (ja) * 2002-02-07 2003-08-27 Mitsubishi Rayon Co Ltd 表面改質球状シリカ及びその製造方法、並びに半導体封止用樹脂組成物

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