JP5929977B2 - 液状エポキシ樹脂組成物及び電子部品装置 - Google Patents

液状エポキシ樹脂組成物及び電子部品装置 Download PDF

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Publication number
JP5929977B2
JP5929977B2 JP2014151513A JP2014151513A JP5929977B2 JP 5929977 B2 JP5929977 B2 JP 5929977B2 JP 2014151513 A JP2014151513 A JP 2014151513A JP 2014151513 A JP2014151513 A JP 2014151513A JP 5929977 B2 JP5929977 B2 JP 5929977B2
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JP
Japan
Prior art keywords
epoxy resin
resin composition
filler
liquid epoxy
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2014151513A
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English (en)
Japanese (ja)
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JP2014196521A5 (enExample
JP2014196521A (ja
Inventor
悟 土田
悟 土田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2014151513A priority Critical patent/JP5929977B2/ja
Publication of JP2014196521A publication Critical patent/JP2014196521A/ja
Publication of JP2014196521A5 publication Critical patent/JP2014196521A5/ja
Application granted granted Critical
Publication of JP5929977B2 publication Critical patent/JP5929977B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2014151513A 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置 Expired - Lifetime JP5929977B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014151513A JP5929977B2 (ja) 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014151513A JP5929977B2 (ja) 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置

Related Parent Applications (1)

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JP2013001004A Division JP5708666B2 (ja) 2013-01-08 2013-01-08 液状エポキシ樹脂組成物及び電子部品装置

Related Child Applications (3)

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JP2015145160A Division JP2015193851A (ja) 2015-07-22 2015-07-22 液状エポキシ樹脂組成物及び電子部品装置
JP2015145165A Division JP2015180760A (ja) 2015-07-22 2015-07-22 液状エポキシ樹脂組成物及び電子部品装置
JP2015145155A Division JP5924443B2 (ja) 2015-07-22 2015-07-22 液状エポキシ樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JP2014196521A JP2014196521A (ja) 2014-10-16
JP2014196521A5 JP2014196521A5 (enExample) 2015-03-19
JP5929977B2 true JP5929977B2 (ja) 2016-06-08

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JP2014151513A Expired - Lifetime JP5929977B2 (ja) 2014-07-25 2014-07-25 液状エポキシ樹脂組成物及び電子部品装置

Country Status (1)

Country Link
JP (1) JP5929977B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7040129B2 (ja) * 2018-03-01 2022-03-23 味の素株式会社 封止用樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3093621B2 (ja) * 1995-01-30 2000-10-03 松下電器産業株式会社 半導体装置の実装方法
JPH09223720A (ja) * 1996-02-15 1997-08-26 Toshiba Corp 半導体パッケージ装置およびその製造方法
JP3729225B2 (ja) * 1996-08-29 2005-12-21 信越化学工業株式会社 半導体装置
JP2967080B1 (ja) * 1998-05-14 1999-10-25 松下電器産業株式会社 半導体装置の実装体の製造方法
JP2001019745A (ja) * 1999-07-07 2001-01-23 Sumitomo Bakelite Co Ltd 半導体装置の製造方法及び半導体装置
JP2001127215A (ja) * 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd 液状樹脂組成物及びそれを用いた半導体装置
JP3723461B2 (ja) * 2000-06-08 2005-12-07 日本電気株式会社 電子部品装置
JP2002284849A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
JP2003238141A (ja) * 2002-02-07 2003-08-27 Mitsubishi Rayon Co Ltd 表面改質球状シリカ及びその製造方法、並びに半導体封止用樹脂組成物

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