JP2014165179A - パターン化有機薄膜の堆積 - Google Patents
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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Abstract
【解決手段】少なくとも1つの入口ビアと、それぞれが少なくとも1つの入口ビアと流体連通し、それぞれが開口部の幅aを有する複数のノズルと、それぞれが複数のノズルの内の関連するノズルと整列され、オリフィス幅sを有する第1の複数のスキマーであって、オリフィスが、関連するノズルの外縁部から距離Dの位置に配置されている第1の複数のスキマーと、それぞれがノズルの少なくとも1つと流体連通している複数の排気キャビティとを有する装置である。
【選択図】図3
Description
a 5〜50μm
D 100〜800μm
s 5〜100μm
θ 0〜60°、又はより好ましくは30〜50°
dg 10〜1500μm
関連するパラメータは以下のものである。
Claims (15)
- 少なくとも1つの入口ビアと、
それぞれが少なくとも1つの入口ビアと流体連通し、それぞれが開口部の幅aを有する複数のノズルと、
それぞれが前記複数のノズルの内の関連するノズルと整列され、オリフィス幅s及び出口幅wを有する第1の複数のスキマーであって、前記オリフィスが前記関連するノズルの外縁部から距離Dの位置に配置されている第1の複数のスキマーと、
それぞれが前記複数のノズルの少なくとも1つと流体連通しており、それぞれが前記複数のノズルの1つと前記複数のスキマーの1つとの間に配置されている複数の排気キャビティと、を含む、
ことを特徴とする装置。 - 複数のノズルと複数のスキマーとが第1のノズルダイの内部においてモノリシックに一体形成されている請求項1に記載の装置。
- 第1のノズルダイが、互いに拡散接合されて前記第1のノズルダイを形成する2つの部分を含む請求項2に記載の装置。
- 第1のダイが装置の交換可能な部分である請求項2から3のいずれかに記載の装置。
- 第2の複数のスキマーが更に含まれていて、
前記第2の複数のスキマーが第1の複数のスキマーの1つの下方に配置され、前記第1の複数のスキマーの1つと整列されるとともに前記第1の複数のスキマーの1つに関連するノズルと整列されている請求項1から4のいずれかに記載の装置。 - aが5〜50μmの範囲であるか、Dが100〜800μmの範囲であるか、sが5〜100μmの範囲であるか、スキマーが0〜60°の範囲のスイープ角θを有するか、又はこれらの任意の組み合わせである請求項1から5のいずれかに記載の装置。
- スキマーが一様でないスイープ角を有する請求項1に記載の装置。
- スキマーの出口から距離dgだけ下方に配置された基板支持体を更に含み、dgが10〜1500μmの範囲である請求項1に記載の装置。
- 複数のスキマーの下方に配置された基板ホルダーに対してほぼ平行な方向に装置を動かすように構成されたラスター機構を更に含む請求項1から8のいずれかに記載の装置。
- 第1のキャリアガス及び第1の有機材料を第1のノズルダイに供給することと、
前記第1のキャリアガス及び前記第1の有機材料を、前記第1のノズルダイから、第1の複数のスキマーの少なくとも1つの下方に配置された基板に向けて射出することと、を含み、
前記第1のノズルダイは、
少なくとも1つの入口ビアと、
それぞれが前記少なくとも1つの入口ビアの少なくとも1つと流体連通し、開口部の幅aを有する複数のノズルと、
それぞれが前記複数のノズルの内の関連するノズルと整列され、オリフィス幅s及び出口幅wを有する第1の複数のスキマーであって、前記オリフィスが前記関連するノズルの外縁部から距離Dの位置に配置されている第1の複数のスキマーと、
それぞれが前記複数のノズルの少なくとも1つと流体連通しており、それぞれが前記複数のノズルの1つと前記複数のスキマーの1つとの間に配置されている複数の排気キャビティと、を含む、
ことを特徴とする方法。 - 第1のキャリアガス及び第1の有機材料を射出する工程において、基板を出口から距離gの位置に維持する工程を更に含む請求項10に記載の方法。
- 第1のノズルダイによって堆積しようとする最小の形成要素のサイズに基づいて距離gを選択することを更に含む請求項11に記載の方法。
- gが、堆積しようとする形成要素の最小の寸法よりも大きい請求項12に記載の方法。
- gが10〜1500μmの範囲であるか、aが5〜50μmの範囲であるか、sが5〜100μmの範囲であるか、又はこれらの任意の組み合わせである請求項10から13のいずれか1項に記載の装置。
- キャリアガス及び有機材料を複数のノズルダイのそれぞれに供給することを更に含み、
それぞれの前記ノズルダイが、
少なくとも1つの入口ビアと、
それぞれが前記少なくとも1つの入口ビアの少なくとも1つと流体連通し、開口部の幅aを有する複数のノズルと、
それぞれが前記複数のノズルの内の関連するノズルと整列され、オリフィス幅s及び出口幅wを有する第1の複数のスキマーであって、前記オリフィスが前記関連するノズルの外縁部から距離Dの位置に配置されている第1の複数のスキマーと、
それぞれが前記複数のノズルの少なくとも1つと流体連通しており、それぞれが前記複数のノズルの1つと前記複数のスキマーの1つとの間に配置されている複数の排気キャビティと、を含む、
請求項10から14のいずれか1項に記載の方法。
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US201361767467P | 2013-02-21 | 2013-02-21 | |
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US13/896,744 | 2013-05-17 | ||
US13/896,744 US9178184B2 (en) | 2013-02-21 | 2013-05-17 | Deposition of patterned organic thin films |
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US11267012B2 (en) * | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
US10130972B2 (en) * | 2015-09-09 | 2018-11-20 | Illinois Tool Works Inc. | High speed intermittent barrier nozzle |
US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
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US11108027B2 (en) | 2018-01-11 | 2021-08-31 | Universal Display Corporation | Printed metal gasket |
US10654272B2 (en) | 2018-01-12 | 2020-05-19 | Universal Display Corporation | Valved micronozzle array for high temperature MEMS application |
US11033924B2 (en) * | 2018-01-31 | 2021-06-15 | Universal Display Corporation | Organic vapor jet print head with orthogonal delivery and exhaust channels |
US20190386256A1 (en) * | 2018-06-18 | 2019-12-19 | Universal Display Corporation | Sequential material sources for thermally challenged OLED materials |
US11683973B2 (en) * | 2019-01-31 | 2023-06-20 | Universal Display Corporation | Use of thin film metal with stable native oxide for solder wetting control |
DE102019129176A1 (de) * | 2019-10-29 | 2021-04-29 | Apeva Se | Verfahren und Vorrichtung zum Abscheiden organischer Schichten |
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