JP2014154823A5 - - Google Patents
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- Publication number
- JP2014154823A5 JP2014154823A5 JP2013025660A JP2013025660A JP2014154823A5 JP 2014154823 A5 JP2014154823 A5 JP 2014154823A5 JP 2013025660 A JP2013025660 A JP 2013025660A JP 2013025660 A JP2013025660 A JP 2013025660A JP 2014154823 A5 JP2014154823 A5 JP 2014154823A5
- Authority
- JP
- Japan
- Prior art keywords
- header
- submount
- electrode pad
- light receiving
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013025660A JP6127561B2 (ja) | 2013-02-13 | 2013-02-13 | 半導体受光装置 |
| US14/065,477 US9329077B2 (en) | 2013-02-13 | 2013-10-29 | Semiconductor photodetector device |
| CN201310614577.7A CN103985768B (zh) | 2013-02-13 | 2013-11-28 | 半导体光接收装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013025660A JP6127561B2 (ja) | 2013-02-13 | 2013-02-13 | 半導体受光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014154823A JP2014154823A (ja) | 2014-08-25 |
| JP2014154823A5 true JP2014154823A5 (enExample) | 2016-01-21 |
| JP6127561B2 JP6127561B2 (ja) | 2017-05-17 |
Family
ID=51277667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013025660A Active JP6127561B2 (ja) | 2013-02-13 | 2013-02-13 | 半導体受光装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9329077B2 (enExample) |
| JP (1) | JP6127561B2 (enExample) |
| CN (1) | CN103985768B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017126949A (ja) * | 2016-01-15 | 2017-07-20 | 国立研究開発法人情報通信研究機構 | 光電変換器 |
| CN106024649A (zh) * | 2016-07-12 | 2016-10-12 | 希睿（厦门）科技有限公司 | 一种超薄环境光与接近传感器的晶圆级封装及其封装方法 |
| JP1624076S (enExample) * | 2018-04-16 | 2019-02-12 | ||
| CN111146296A (zh) * | 2018-11-05 | 2020-05-12 | 上海集耀电子有限公司 | 一种改进的光敏接收管 |
| CN111952705B (zh) * | 2020-08-28 | 2025-09-09 | 中国电子科技集团公司第九研究所 | 一种通讯用小型化隔离器的封装外壳及其制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054534U (ja) | 1991-02-18 | 1993-01-22 | 三菱電機株式会社 | レーザダイオードチツプキヤリア |
| JP2002289956A (ja) * | 2001-03-22 | 2002-10-04 | Kyocera Corp | 半導体レーザ装置 |
| JP2003134051A (ja) | 2001-10-25 | 2003-05-09 | Opnext Japan Inc | 光受信モジュール、光受信器及び光ファイバ通信機器 |
| KR100575950B1 (ko) * | 2003-06-20 | 2006-05-02 | 삼성전자주식회사 | 티오 캔 구조의 광수신 모듈 |
| JP2006114635A (ja) * | 2004-10-13 | 2006-04-27 | Sharp Corp | 半導体装置 |
| JP2006253676A (ja) | 2005-03-08 | 2006-09-21 | Sumitomo Electric Ind Ltd | 光アセンブリ |
| MY157744A (en) * | 2006-02-17 | 2016-07-15 | Finisar Corp | Discrete bootstrapping in an optical receiver to prevent signal feedback |
| CN100592585C (zh) * | 2006-03-28 | 2010-02-24 | 三菱电机株式会社 | 光学元件用组件及使用该组件的光学半导体器件 |
| JP4970924B2 (ja) * | 2006-03-28 | 2012-07-11 | 三菱電機株式会社 | 光素子用パッケージとこれを用いた光半導体装置 |
| JP2010251570A (ja) * | 2009-04-16 | 2010-11-04 | Mitsubishi Electric Corp | 光受信モジュール |
-
2013
- 2013-02-13 JP JP2013025660A patent/JP6127561B2/ja active Active
- 2013-10-29 US US14/065,477 patent/US9329077B2/en active Active
- 2013-11-28 CN CN201310614577.7A patent/CN103985768B/zh active Active
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