JP2014154580A5 - - Google Patents
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- Publication number
- JP2014154580A5 JP2014154580A5 JP2013020319A JP2013020319A JP2014154580A5 JP 2014154580 A5 JP2014154580 A5 JP 2014154580A5 JP 2013020319 A JP2013020319 A JP 2013020319A JP 2013020319 A JP2013020319 A JP 2013020319A JP 2014154580 A5 JP2014154580 A5 JP 2014154580A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern opening
- conductor
- pattern
- virtual line
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013020319A JP6097088B2 (ja) | 2013-02-05 | 2013-02-05 | プリント配線板およびプリント配線板用導体シート |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013020319A JP6097088B2 (ja) | 2013-02-05 | 2013-02-05 | プリント配線板およびプリント配線板用導体シート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014154580A JP2014154580A (ja) | 2014-08-25 |
| JP2014154580A5 true JP2014154580A5 (OSRAM) | 2016-01-07 |
| JP6097088B2 JP6097088B2 (ja) | 2017-03-15 |
Family
ID=51576191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013020319A Active JP6097088B2 (ja) | 2013-02-05 | 2013-02-05 | プリント配線板およびプリント配線板用導体シート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6097088B2 (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11769777B2 (en) * | 2018-03-23 | 2023-09-26 | Sony Semiconductor Solutions Corporation | Circuit board, semiconductor device, and electronic apparatus |
| JP6987700B2 (ja) * | 2018-05-29 | 2022-01-05 | 京セラ株式会社 | 印刷配線板 |
| CN113411946B (zh) * | 2020-03-16 | 2022-07-26 | 浙江宇视科技有限公司 | 一种印刷电路板以及制作方法 |
| CN111450961B (zh) * | 2020-04-23 | 2021-11-05 | 中电浩普(江苏)科技有限公司 | 一种垃圾破碎发电一体化系统 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0119414Y2 (OSRAM) * | 1980-07-02 | 1989-06-05 | ||
| CN101207968B (zh) * | 2006-12-22 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
| JP2010135692A (ja) * | 2008-12-08 | 2010-06-17 | Lintec Corp | 転写用配線回路板及び配線回路部材 |
| JP2010226026A (ja) * | 2009-03-25 | 2010-10-07 | Sony Corp | 多層配線基板 |
| JP2012094646A (ja) * | 2010-10-26 | 2012-05-17 | Daisho Denshi Co Ltd | 特性インピーダンスコントロール対応プリント配線基板 |
-
2013
- 2013-02-05 JP JP2013020319A patent/JP6097088B2/ja active Active
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