JP2014154580A5 - - Google Patents
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- Publication number
- JP2014154580A5 JP2014154580A5 JP2013020319A JP2013020319A JP2014154580A5 JP 2014154580 A5 JP2014154580 A5 JP 2014154580A5 JP 2013020319 A JP2013020319 A JP 2013020319A JP 2013020319 A JP2013020319 A JP 2013020319A JP 2014154580 A5 JP2014154580 A5 JP 2014154580A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern opening
- conductor
- pattern
- virtual line
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive Effects 0.000 claims 1
Claims (1)
前記剥離基材の上に、接着層を介して設けられた導体層と、を備え、
前記導体層は、導体部と複数の独立したパターン開口部とを備えており、
一つの前記パターン開口部、および前記一つのパターン開口部の外縁から前記一つのパターン開口部に最近接する他のパターン開口部の外縁であって前記一つのパターン開口部と隣接する側の外縁までの導体部を含む局所領域において、前記局所領域を通過する帯状の仮想線として、前記仮想線の面内における前記導体部の比率が最大となるよう位置取りされた第一仮想線または前記仮想線の面内における前記導体部の比率が最小となるよう位置取りされた第二仮想線を仮定したとき、
前記第一仮想線の伸長方向または前記第二仮想線の伸長方向と前記複数のパターン開口部の中心位置の並び方向とが非平行となるよう前記パターン開口部が設けられていることを特徴とするプリント配線板用導体シート。
A release substrate;
A conductor layer provided on the release substrate via an adhesive layer,
The conductor layer includes a conductor portion and a plurality of independent pattern openings,
One pattern opening and an outer edge of the other pattern opening closest to the one pattern opening from the outer edge of the one pattern opening to the outer edge on the side adjacent to the one pattern opening In the local region including the conductor portion, as the band-like virtual line passing through the local region, the first virtual line or the virtual line positioned so that the ratio of the conductor portion in the plane of the virtual line is maximized Assuming a second imaginary line positioned so that the ratio of the conductor part in the plane is minimized,
The pattern opening is provided so that the extending direction of the first imaginary line or the extending direction of the second imaginary line is not parallel to the arrangement direction of the center positions of the plurality of pattern openings. Conductor sheet for printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013020319A JP6097088B2 (en) | 2013-02-05 | 2013-02-05 | Printed wiring board and conductor sheet for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013020319A JP6097088B2 (en) | 2013-02-05 | 2013-02-05 | Printed wiring board and conductor sheet for printed wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014154580A JP2014154580A (en) | 2014-08-25 |
| JP2014154580A5 true JP2014154580A5 (en) | 2016-01-07 |
| JP6097088B2 JP6097088B2 (en) | 2017-03-15 |
Family
ID=51576191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013020319A Active JP6097088B2 (en) | 2013-02-05 | 2013-02-05 | Printed wiring board and conductor sheet for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6097088B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11769777B2 (en) * | 2018-03-23 | 2023-09-26 | Sony Semiconductor Solutions Corporation | Circuit board, semiconductor device, and electronic apparatus |
| JP6987700B2 (en) * | 2018-05-29 | 2022-01-05 | 京セラ株式会社 | Printed wiring board |
| CN113411946B (en) * | 2020-03-16 | 2022-07-26 | 浙江宇视科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN111450961B (en) * | 2020-04-23 | 2021-11-05 | 中电浩普(江苏)科技有限公司 | Garbage crushing and power generation integrated system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0119414Y2 (en) * | 1980-07-02 | 1989-06-05 | ||
| CN101207968B (en) * | 2006-12-22 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| JP2010135692A (en) * | 2008-12-08 | 2010-06-17 | Lintec Corp | Transferring wiring circuit board, and wiring circuit member |
| JP2010226026A (en) * | 2009-03-25 | 2010-10-07 | Sony Corp | Multilayer wiring board |
| JP2012094646A (en) * | 2010-10-26 | 2012-05-17 | Daisho Denshi Co Ltd | Printed wiring board corresponding to characteristic impedance control |
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2013
- 2013-02-05 JP JP2013020319A patent/JP6097088B2/en active Active
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