JP2014150227A - 基板搬送装置 - Google Patents
基板搬送装置 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
【解決手段】前記基板保持具が載置される載置部と、前記基板の下面を支持する支持体、及び前記支持体を進退させる進退機構を備え、前記基板保持具に対して基板の受け渡しを行うための基板搬送機構と、前記支持体を前記基板保持具に対して相対的に昇降させる昇降機構と、前記基板保持具に保持された基板と支持体との接触により発生する接触音を増幅させるための音増幅部と、前記基板保持具を伝播する固体伝播音を感知して感知信号を出力する振動センサからの前記感知信号に基づいて前記基板と支持体との擦れを検出するための検出部と、を備えるように基板搬送装置を構成する。
【選択図】図5
Description
前記基板の下面を支持する支持体、及び前記支持体を進退させる進退機構を備え、前記載置部に載置された基板保持具に対して基板の受け渡しを行うための基板搬送機構と、
前記支持体を前記基板保持具に対して相対的に昇降させる昇降機構と、
前記基板保持具に保持された基板と前記支持体との接触により発生する接触音を増幅させるための音増幅部と、
前記基板保持具を伝播する固体伝播音を感知して感知信号を出力する振動センサからの前記感知信号に基づいて、前記基板と前記支持体との擦れを検出するための検出部と、
を備えることを特徴とする。
また、制御部2は、上記のように取得された区間R1、R2の電圧の最大振幅の差が異常になったときは、各区間R1、R2から求める周波数スペクトルに基づいて、前記擦れの有無を判定している。この点からも、上記の誤検出が起きることを防ぐことができる。
スロット503にウエハWを受け渡すにあたりウエハWを保持した状態で前進したときのフォーク48の高さ位置をスロット503進入高さ位置とすると、このスロット503進入高さ位置から予め設定された高さ分、下方にずれた高さ位置にフォーク48が位置する。その後、所定の量フォーク48が前進して、その先端がスロット502、503のウエハWの間に位置する(図22)。
評価試験1
本発明に関連して行われた評価試験について説明する。評価試験1では、上記の搬送ロボット44を用い、フォーク48をウエハWが格納された容器本体5に対して進入、下降及び後退動作を順に繰り返し行い、その間に上記のようにステージ32に設けた振動センサ11から出力される電圧を測定した。前記進入、下降及び後退動作を複数回繰り返し行うと、進入時の高さ及び後退時の高さを変更して、再度進入、下降及び後退動作を繰り返し行った。前記フォーク48の裏面には、上記の実施形態と同様に、金属のワッシャであるピン49が設けられている。
フォーク48の進退による容器本体5へのウエハWの格納動作を行い、その間に振動センサ11から出力される電圧を測定した。この評価試験2ではフォーク48にピン49を設けていない。この格納動作が行われているときに、ウエハWの擦れが起きるようにフォーク48の高さが設定されている。
塗布、現像装置1の周囲のノイズが大きい場合には、フォーク48に音増幅部(突起)を有している場合であっても、ウエハWとフォーク48との接触音がノイズ成分に埋もれてしまう事がある。そこで、上記の評価試験1−3において取得された電圧データについて、所定の区間R1、R2を設定し、実施の形態で説明した各区間R1、R2における前半側周波数スペクトル、後半側周波数スペクトルを夫々求めた。図32はこれら前半側スペクトル、後半側スペクトルを夫々示している。これら周波数スペクトルを比較すると、500Hz〜10000Hzにおける振幅が特に変化していることが分かる。
上記の評価試験1−1、1−3、1−4において取得された電圧データから、実施の形態で説明した前半側PSD、後半側PSDを夫々算出した。これらPSDは、実施の形態と同様に500〜10000Hzの周波数について算出している。また、後半側PSD−前半側PSDを演算した。図33のグラフは評価試験1−1、1−3、1−4の前半側PSD及び後半側PSDを示し、図34のグラフは、これら各評価試験の後半側PSD−前半側PSDを示している。図34のグラフより評価試験1−3、1−4における後半側PSD−前半側PSDは、評価試験1−1における後半側PSD−前半側PSDよりも大きい値を示していることが分かる。これら評価試験3−1、3−2の結果から、周波数スペクトルを用いて、擦れの有無の判定を行えることが分かる。
C キャリア
W ウエハ
1 塗布、現像装置
11 振動センサ
2 制御部
3 ロードポート
38 支持ピン
44 搬送ロボット
48 フォーク
49 ピン
5 容器本体
81 凹凸部
Claims (9)
- 複数の基板を棚状に保持するための基板保持具が載置される載置部と、
前記基板の下面を支持する支持体、及び前記支持体を進退させる進退機構を備え、前記載置部に載置された基板保持具に対して基板の受け渡しを行うための基板搬送機構と、
前記支持体を前記基板保持具に対して相対的に昇降させる昇降機構と、
前記基板保持具に保持された基板と前記支持体との接触により発生する接触音を増幅させるための音増幅部と、
前記基板保持具を伝播する固体伝播音を感知して感知信号を出力する振動センサからの前記感知信号に基づいて、前記基板と前記支持体との擦れを検出するための検出部と、
を備えることを特徴とする基板搬送装置。 - 前記音増幅部は、前記支持体に設けられることを特徴とする請求項1記載の基板搬送装置。
- 前記検出部は、前記振動センサからの感知信号に基づいて得られる周波数スペクトルに基づいて、前記基板と前記支持体との擦れを検出することを特徴とする請求項1または2記載の基板搬送装置。
- 前記音増幅部は、基板と支持体との間の空気層による前記接触音の低下を防ぐための突部により構成されることを特徴とする請求項1ないし3のいずれか一つに記載の基板搬送装置。
- 前記音増幅部は、基板の端部との接触による接触音を増幅させるための凹凸部により構成されることを特徴とする請求項1ないし3のいずれか一つに記載の基板搬送装置。
- 前記振動センサを前記載置部に備えることを特徴とする請求項1ないし5のいずれか一つに記載の基板搬送装置。
- 前記基板保持具と基板搬送機構との間で基板を受け渡すための搬送口が形成された隔壁が設けられ、
当該隔壁に前記振動センサを備えることを特徴とする請求項1ないし5のいずれか一つに記載の基板搬送装置。 - 前記振動センサを前記載置部に載置された基板保持具に向けて付勢する付勢部が、前記隔壁に設けられることを特徴とする請求項7記載の基板搬送装置。
- 前記検出部により前記基板と支持体との擦れが検出されたときに、前記検出部は後に基板保持具に対して基板の受け渡しを行うときの前記支持体の高さが補正されるように、前記昇降機構の動作を制御することを特徴とする請求項1ないし8のいずれか一つに記載の基板搬送装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2013019580A JP6044373B2 (ja) | 2013-02-04 | 2013-02-04 | 基板搬送装置 |
TW103103252A TWI567858B (zh) | 2013-02-04 | 2014-01-28 | 基板運送裝置 |
CN201480007436.1A CN104969339B (zh) | 2013-02-04 | 2014-01-31 | 基板输送装置 |
US14/759,824 US9953853B2 (en) | 2013-02-04 | 2014-01-31 | Substrate transport apparatus |
KR1020157018890A KR102077363B1 (ko) | 2013-02-04 | 2014-01-31 | 기판 반송 장치 |
PCT/JP2014/052305 WO2014119740A1 (ja) | 2013-02-04 | 2014-01-31 | 基板搬送装置 |
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JP2013019580A JP6044373B2 (ja) | 2013-02-04 | 2013-02-04 | 基板搬送装置 |
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JP2014150227A true JP2014150227A (ja) | 2014-08-21 |
JP6044373B2 JP6044373B2 (ja) | 2016-12-14 |
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US (1) | US9953853B2 (ja) |
JP (1) | JP6044373B2 (ja) |
KR (1) | KR102077363B1 (ja) |
CN (1) | CN104969339B (ja) |
TW (1) | TWI567858B (ja) |
WO (1) | WO2014119740A1 (ja) |
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JP2021064712A (ja) * | 2019-10-15 | 2021-04-22 | 株式会社アルバック | 基板搬送装置、および、基板搬送方法 |
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US9791849B2 (en) * | 2015-05-26 | 2017-10-17 | GlobalFoundries, Inc. | Defect detection process in a semiconductor manufacturing environment |
US9978631B2 (en) * | 2015-12-31 | 2018-05-22 | Beijing Naura Microelectronics Equipment Co., Ltd. | Wafer pick-and-place method and system |
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JP6545396B2 (ja) * | 2016-09-29 | 2019-07-17 | 株式会社Kokusai Electric | 基板処理装置、振動検出システム及びプログラム |
US10872793B2 (en) | 2017-11-10 | 2020-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for monitoring operation conditions of semiconductor manufacturing apparatus |
US10879095B2 (en) * | 2018-02-26 | 2020-12-29 | Samsung Electronics Co., Ltd. | Jig for evaluating semiconductor processing chamber |
CN110504186B (zh) * | 2018-05-16 | 2022-01-18 | 台湾积体电路制造股份有限公司 | 半导体制造机台的状况监控方法及半导体制造系统 |
US10533852B1 (en) * | 2018-09-27 | 2020-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Leveling sensor, load port including the same, and method of leveling a load port |
JP7256360B2 (ja) * | 2018-12-14 | 2023-04-12 | シンフォニアテクノロジー株式会社 | 搬送異常検知システム |
CN113899446B (zh) * | 2021-12-09 | 2022-03-22 | 北京京仪自动化装备技术股份有限公司 | 晶圆传送系统检测方法及晶圆传送系统 |
CN114295199A (zh) * | 2021-12-09 | 2022-04-08 | 北京京仪自动化装备技术股份有限公司 | 一种晶圆传送系统检测方法及晶圆传送系统 |
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US20150340258A1 (en) | 2015-11-26 |
TW201444012A (zh) | 2014-11-16 |
CN104969339B (zh) | 2017-06-06 |
KR20150115734A (ko) | 2015-10-14 |
KR102077363B1 (ko) | 2020-02-13 |
TWI567858B (zh) | 2017-01-21 |
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