JP2014132698A - Substrate support jig and substrate support method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate support jig which causes no damage even when interfering with a component that have been mounted when a mounting substrate is placed, easily removes unnecessary support parts, and achieves high followability for model changes.SOLUTION: A substrate support jig includes: a rectangular plate part having a planar surface; and multiple support pins disposed so as to protrude from the planar surface of the plate part. Each support pin is made of a material having elasticity, and a diameter of a tip is smaller than a diameter of a base part in the support pin. Further, the support pin inclines from the tip toward the base part and a top part has a conical shape having a spherical surface.

Description

  The present invention relates to a substrate support jig that supports and holds a substrate on which electronic components and the like are mounted, and a substrate support method using the substrate support jig.

  In general, surface mounting for mounting electronic components on a substrate is performed by, for example, transporting a mounting board one by one to a solder printer by a substrate supply device before the process by this apparatus for performing surface mounting. The solder is printed on the land of the mounting board. Then, after inspection with a solder printing state inspection machine that inspects the printing state of solder as necessary, it is carried into a mounting machine (generally, a high-speed mounting machine and a general-purpose machine) as this apparatus.

  The mounting board carried into the mounting machine is positioned by the positioning pins that enter the positioning holes of the board in a state where both ends of the board are sandwiched on the mounting stage (XY table or the like) in the mounting machine. Positioned. After that, the block where pins etc. to correct the bending and warping of the board are arranged rises from the lower side of the board, and the board is supported from the lower side by the pins so as to keep the plane so that there is no bending or warping. To do. In this state, electronic components are mounted on the upper surface of the substrate from above, and when a predetermined mounting sequence is completed, the substrate is carried out toward the next mounting machine or the like.

  And the board | substrate which finished the mounting | wearing by a predetermined mounting machine is carried in to a reflow furnace after that, and when soldering of the electronic component there is completed, it will be transferred to an inspection machine and will be inspected. The inspection machine determines the position shift, missing item, standing, etc. of the parts by image processing using a camera, laser, etc., classifies the non-defective product and the defective product, displays the defective part, and then carries it out. This completes the surface mounting. In addition, when applying an adhesive, it is only different from the case where solder is applied in that a coating machine is used instead of the above-mentioned printing machine and a curing furnace is used instead of a reflow furnace, and printing is otherwise performed. This is substantially the same as the case of.

  The height after mounting the electronic component to be mounted on the board is determined in advance by the thickness of the electronic component to be mounted, the height of the component pickup section, etc., and the height of the board surface is set to the full height If it is located, it will be installed correctly. However, if the board is warped downward during mounting, the electronic component does not reach the surface to which the solder (or adhesive) is applied, so that it may be as if the component to be mounted has been released into the air. . For this reason, there exists a problem that the precision of a mounting position cannot be ensured as predetermined.

In addition, when inspecting a board on which electronic components are mounted using an inspection machine, if the board bends downward, the focus height of the camera of the inspection machine changes, so the image data is not accurately captured and an erroneous determination is made. There is a risk of bringing about.
Therefore, (a) when solder or adhesive is applied to the mounting substrate, (b) when electronic components are mounted on the mounting substrate coated with solder or adhesive, or (c) electronic When inspecting a substrate on which a component is mounted by an inspection machine, it is necessary to support the substrate so as to keep a flat state from below.

  As a first conventional example of supporting a substrate, a plate a having a large number of holes b arranged in a lattice shape as shown in FIG. 2 (A) is prepared, and each hole b is shown in FIG. 2 (B). Some support pins c made of metal or resin as shown are inserted, and the substrate is supported from below by these many support pins c. In some cases, a pin having a compression spring in the vertical direction with a compression spring inside is used.

  As a second conventional example, as shown in FIG. 3A, the plate d is made of a magnetic material, or the magnetic material is built in the plate d, and as shown in FIG. There is a support pin f in which e is embedded, the support pin f is held upward on the plate d by magnetic force, and the substrate is supported by the support pin f.

  As a third conventional example, as shown in FIG. 4, a block g made of a metal such as aluminum or a resin having irregularities formed on the upper surface in accordance with the shape of the lower surface of the mounting substrate is used. There is one in which the substrate is supported by the surface on which the unevenness is formed.

  As a fourth conventional example, as shown in FIG. 5, a block-shaped foam mat having electrical conductivity is prepared, and one surface thereof is cut into a lattice shape to a certain depth to form a plurality of protrusions h, for example, a staggered pattern. There is a plate i that is disposed on the substrate and supports the substrate by the plurality of protrusions h.

  Patent Document 1 describes a printed circuit board support device that can reduce the labor and cost of replacing a backup pin. Further, Patent Document 2 proposes a backup plate that prevents the electronic component and the printed circuit board from being damaged in the automatic mounting for the printed circuit board, the mounting of the electronic component of the inspection apparatus, or the measurement operation.

JP-A-8-148899 JP-A-8-204398

  By the way, the conventional substrate support jigs described above have drawbacks. And the seriousness of the shortcomings is becoming impossible to ignore. This is because the progress of surface mounting technology is not known to stop, and the mounting density, heightening, and precision of mounting are progressing, and the mounting substrate tends to become thinner, This is because warping and distortion are likely to occur due to heat during the curing process. Accordingly, the importance of high flatness and stability of the mounting surface of the electronic component on the substrate during solder cream or adhesive application, electronic component mounting, and inspection is increasing.

  Therefore, the drawbacks of the conventional example will be specifically described. In the first conventional example, when the mounting component is arranged on the lower surface of the substrate (particularly, the preceding mounting surface of the double-sided mounting substrate), the arrangement of the mounting component is arranged. The position and component height vary depending on the model and specifications and vary. For this reason, each support pin c is subject to the restriction of the attachment position that it can be attached only to the holes b arranged in a lattice shape. Due to the restriction of the mounting position, there arises a problem that the support pin c may not be arranged at a support position necessary for good support of the substrate.

  Further, since the supporting pin c is hard and does not have elasticity, there is a possibility that the mounting component may be damaged or missing when it interferes with the mounting component depending on its arrangement position. In addition, when setting the position at the time of setup change, it is necessary to move the support pin c in accordance with the substrate each time the setup is changed, and this movement takes time that cannot be ignored. It is a major factor that hinders the shortening of time, and is also unsuitable for multi-product production.

  In the second conventional example, since the supporting pin f is held on the plate d by magnetic force, the degree of freedom in setting the position is higher than that in the first conventional example. However, depending on the arrangement position of the support pin f, the pin f and the mounting component may interfere with each other, which may cause problems such as breakage and missing. In addition, it is necessary to move the support pin f in accordance with the problem at the time of position setting at the time of setup change, that is, every time the setup is changed. This is the same as in the first conventional example.

  In the third conventional example, it takes time and cost to manufacture the block g for supporting the substrate, and the versatility and the model change followability are low, and when manufactured, there is a tendency to use a dedicated jig for the model. Become stronger. Therefore, there is a drawback that it is unsuitable for the production of a small quantity and a large variety of products that will increase more and more.

  The fourth conventional example is an improvement of the drawbacks of each of the conventional examples described above. By cutting one surface of the block-shaped foam mat according to the model of the substrate to be supported, the support portion is optimal for that model. It is easy to dispose, and even if it is disposable, it costs little. It can be said that it is excellent in that respect. However, there is a drawback in that cut waste and dust are generated at the time of cutting, the cut waste and dust remain, and when the substrate is supported, the cut waste and dust may adhere to the substrate. Further, since a plate having elasticity is used, there is a problem that the shape is difficult to stabilize and the yield is reduced.

  The present invention has been made to solve such problems, and when the mounting substrate is placed, there is no damage even if it interferes with a mounted component, and unnecessary support portions can be easily removed. An object of the present invention is to provide a substrate support jig having high followability to model changes, and a mounting substrate support method using the substrate support jig.

  The substrate support jig of the present invention includes a rectangular plate portion having a flat surface and a plurality of support pins arranged so as to protrude from the flat surface of the plate portion. The plurality of supporting pins are made of a material having elasticity, the diameter of the tip is smaller than the diameter of the base, and the tip is inclined from the tip to the base, and the top is in a spherical conical shape. Is formed.

  In particular, preferably, the plurality of support pins have conductivity and are formed at the same height. Further, the plane of the plate portion includes a peripheral region formed along the end of the plane and a central region surrounded by the peripheral region, and the number of supporting pins arranged in the central region is The number of supporting pins arranged in the peripheral area is smaller than the number of supporting pins.

In addition, the substrate support method of the present invention includes a step of supporting the substrate so that one surface of the substrate on which the electronic component is mounted on one surface is supported by the support member from below and kept flat. The support member used in the step of supporting the substrate is made of an elastic material arranged so as to protrude from one surface of the rectangular plate, and the diameter of the tip is smaller than the diameter of the base. And a plurality of supporting pins whose top portions are spherical conical shapes.
If this supporting pin and the electronic component mounted on the board interfere with each other, the supporting pin at the location that interferes with the electronic component mounted on one surface is elastically deformed to flatten the board from the lower side. To support. Further, when the interference between the support pin and the electronic component is too strong, the support pin at the location that interferes with the electronic component is removed, and the remaining support pins are elastically deformed to support the substrate flatly from below. Like that.

According to the present invention, since the tip of the support pin of the substrate support jig is made thinner than the base, the tip of the support pin is easily bent according to the unevenness of the electronic component mounted on the substrate, Flexible. Therefore, even when the electronic component comes into contact with the support pin, the tip portion thereof can be in close contact with the electronic component to support the electronic component, so that the substrate can be supported in a flat state.
In addition, since the diameter of the base portion is larger than that of the tip portion, the strength of the supporting pins can be maintained and the substrate can be reliably supported.

(A)-(F) shows the 1st Example of the board | substrate support jig | tool relevant to the embodiment of this invention, (A) is a top view, (B) is a rear view, (C) is (D) is a left side view, (E) is a right side view, and (F) is a bottom view. (A), (B) shows a first conventional example, (A) is a perspective view of a substrate support jig, (B) is a perspective view showing a support pin. (A), (B) shows the 2nd prior art example, (A) is a perspective view of a substrate support jig, and (B) is a perspective view of a support pin. It is a perspective view which shows a 3rd prior art example. It is a perspective view which shows a 4th prior art example.

  The substrate support jig of the present invention is basically formed by integrally forming a plate portion made of a foamed elastic material and a plurality of support pins having the same height and projecting integrally on one main surface of the plate portion. Being done. As the foamed elastic material, a material having a hardness that allows the supporting pin to be easily cut off may be used. For example, when the interference of the support pins for the electronic components generated when the double-sided mounting board is supported on the preceding production surface is too strong, the support pins should be appropriately cut to avoid the interference. Because you can. An example of a foamed elastic material suitable for satisfying such conditions is urethane foam. This is because urethane foam is inexpensive and has good processability.

  Moreover, it is good to use what has electroconductivity as a foaming elastic material. This is because charging occurs due to friction or the like when solder or adhesive is applied to the substrate or electronic components are mounted, and the electronic components may be destroyed when the charging is discharged. If it is a foaming elastic material which has electroconductivity, it can prevent the electric charge which causes destruction. The elastic modulus and compressibility of foamed elastic materials such as urethane foam can be changed according to the degree of foaming. Therefore, the substrate support with the appropriate elastic modulus and compressibility depends on the type and state of the substrate to be supported. A jig may be provided. In practice, it is possible to change the elastic modulus and compression rate of the support pins of the substrate support jig in lot units.

  Here, the tip of the supporting pin is preferably formed in a spherical shape. This is because when the support pins are in contact with the lower surface of the substrate, damage to the lower surface can be further reduced.

<Embodiment example of the present invention>
Hereinafter, an exemplary embodiment of the present invention (hereinafter also referred to as “this example”) will be described in detail with reference to the drawings. 1A to 1F show a first example of a substrate support jig related to an embodiment of the present invention. FIG. 1A is a plan view, FIG. 1B is a rear view, and FIG. ) Is a front view, (D) is a left side view, (E) is a right side view, and (F) is a bottom view. In the drawing, the plate portion 1 has a certain thickness (for example, 5 mm), and the planar shape is a rectangle (for example, 42 mm in length, 126 mm in width, for example).

  The supporting pin 2 is integrally formed on one main surface of the plate portion 1 and has a conical shape in which the diameter at the tip portion is slightly smaller than the diameter at the base portion (for example, 6 mm). Further, the top of the support pin 2 is formed in a spherical shape (dome shape), and the height from the surface of the plate portion 1 is, for example, 15 mm. The reason why the top portion of the support pin 2 is spherical is to reduce damage when it hits the lower surface of the substrate.

  A large number (for example, 39) of supporting pins 2 are provided on one main surface of the plate portion 1, and the substrate can be supported on the lower surface by the supporting pins 2, 2,. it can. A substrate support jig in which a large number of support pins 2, 2,... Are integrally formed on the surface of the plate portion 1 is formed by molding with foamed urethane having conductivity.

  Such a substrate support jig can easily join the lower surface (the surface opposite to the main surface on which the support pins 2 of the plate part 1 are formed) to other plates and plates with an adhesive or the like. Can be easily adjusted to fit the equipment. In addition, by bonding the side surface of one plate portion 1 to the side surface of the plate portion 1 of another substrate support jig, a plurality of substrate support jigs can be integrated to enlarge the substrate support jig. The size of the support jig can be appropriately set according to the substrate to be supported.

  And since the board | substrate support jig | tool of this example consists of a foaming urethane integral molded product, a processing waste, a garbage, etc. do not generate | occur | produce. Therefore, there is no possibility that the supporting substrate is contaminated with processing waste or dust.

  In addition, since each of the supporting pins 2 has a spherical tip surface, an electronic component is already mounted on the lower surface of the supporting substrate (the substrate is a double-sided mounting type, and the electronic component is already mounted on one surface, If the substrate is to be supported by the electronic component mounted surface with the surface down), even if interference occurs with the electronic component, there is little risk of damage to the electronic component. Moreover, even if the interference is slightly strong, each support pin 2 is made of urethane foam and has elasticity, so that the substrate can be supported without damaging the electronic components by compressing and deforming due to the elasticity. The substrate can be pushed up in the state.

  In addition, when the interference is too strong, for example, when the height of the electronic component mounted on the lower surface of the substrate is high, the supporting pins 2 related to the interference may be removed, and the removal is performed by supporting the substrate. Since the jig is made of urethane foam, it can be done easily. Therefore, there is no need to restrict the placement of the support pins 2 when designing the mounting board. For example, even if there is a placement error with respect to the support pins 2, the electronic component may be damaged or troublesome repair work may be required. do not do. A foamed elastic material such as foamed urethane is extremely inexpensive, and can be used at low cost by preparing and standardizing the number of arrangements and arrangement patterns of a large number of support pins 2.

  The softness of the substrate support jig that supports the substrate against the substrate and the ease of removing the support pins 2 are largely determined by the elastic modulus and compression rate of the substrate support jig. The degree of foaming can be adjusted. Therefore, it is possible to change the elastic modulus and the compression rate, for example, in units of lots so as to suit the type and state of the substrate to be supported. Further, the surface treatment can be performed at the time of foaming, and the durability can be enhanced by the surface treatment.

  In addition, since the urethane foam is made conductive by including, for example, a conductive powder material, it is possible to prevent charging due to friction between the substrate and the electronic component mounted thereon and the substrate support jig. Therefore, it is possible to eliminate the possibility that the electronic component is destroyed by the discharge caused by charging.

  In order to correct the warp of the substrate to be supported by the substrate support jig, the shape of the support pins or the shape or material of the tip thereof may be changed according to the substrate to be supported. For example, the support pin is made into a quadrangular pyramid shape, the curvature of the curved surface of the tip end surface is changed, the degree of foaming is partially changed, the color is partially changed, display, mark, division, etc. For example, it can be formed.

  1 ... plate part, 2 ... support pin

Claims (5)

A rectangular plate portion having a plane;
In a substrate support jig for supporting a substrate provided with a plurality of support pins arranged so as to protrude from the plane of the plate portion,
The support pin is made of a material having elasticity, the diameter of the tip is smaller than the diameter of the base, is inclined from the tip to the base, and the top is a spherical conical shape.
Substrate support jig. The plurality of support pins are formed at the same height,
The substrate support jig according to claim 1. The plane of the plate portion includes a peripheral region formed along an end of the flat surface, and a central region surrounded by the peripheral region,
The substrate support jig according to claim 1, wherein the number of support pins arranged in the central region is smaller than the number of support pins arranged in the peripheral region. The support pin is made of a conductive material.
The board | substrate support jig in any one of Claims 1-3. In the substrate support method including the step of supporting the substrate so that the one surface of the substrate on which the electronic component is mounted on one surface is supported by a support member from the lower side and kept flat,
The step of supporting the substrate includes
It is made of an elastic material, which is arranged so as to protrude from the plane of the rectangular plate, the diameter of the tip part is smaller than the diameter of the base part, and the tip part is inclined toward the base part, and the top part is spherical. With a plurality of support pins that are conical,
When the support pin and the electronic component mounted on the substrate interfere with each other, the support pin at the location where the electronic component mounted on the one surface interferes is elastically deformed to lower the substrate. If the interference between the support pin and the electronic component is too strong, the support pin at the location where it interferes with the electronic component is removed, and the remaining support pins are elastically deformed. A substrate supporting method comprising: supporting the substrate flatly from below.

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