JP2014130853A5 - - Google Patents

Download PDF

Info

Publication number
JP2014130853A5
JP2014130853A5 JP2012286366A JP2012286366A JP2014130853A5 JP 2014130853 A5 JP2014130853 A5 JP 2014130853A5 JP 2012286366 A JP2012286366 A JP 2012286366A JP 2012286366 A JP2012286366 A JP 2012286366A JP 2014130853 A5 JP2014130853 A5 JP 2014130853A5
Authority
JP
Japan
Prior art keywords
semiconductor device
processed
substrate
manufacturing
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012286366A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014130853A (ja
JP6170672B2 (ja
Filing date
Publication date
Priority claimed from JP2012286366A external-priority patent/JP6170672B2/ja
Priority to JP2012286366A priority Critical patent/JP6170672B2/ja
Application filed filed Critical
Priority to PCT/JP2013/084442 priority patent/WO2014103996A1/ja
Priority to KR1020157016999A priority patent/KR101793583B1/ko
Priority to TW102148337A priority patent/TWI643925B/zh
Publication of JP2014130853A publication Critical patent/JP2014130853A/ja
Publication of JP2014130853A5 publication Critical patent/JP2014130853A5/ja
Priority to US14/743,619 priority patent/US20150284603A1/en
Priority to US14/953,697 priority patent/US20160075922A1/en
Publication of JP6170672B2 publication Critical patent/JP6170672B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012286366A 2012-12-27 2012-12-27 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 Expired - Fee Related JP6170672B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012286366A JP6170672B2 (ja) 2012-12-27 2012-12-27 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
PCT/JP2013/084442 WO2014103996A1 (ja) 2012-12-27 2013-12-24 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
KR1020157016999A KR101793583B1 (ko) 2012-12-27 2013-12-24 반도체 장치 제조용 가접착제, 그것을 사용한 접착성 지지체, 및 반도체 장치의 제조방법
TW102148337A TWI643925B (zh) 2012-12-27 2013-12-26 Temporary adhesive for semiconductor device manufacturing, adhesive support using the same, and method for manufacturing semiconductor device
US14/743,619 US20150284603A1 (en) 2012-12-27 2015-06-18 Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same
US14/953,697 US20160075922A1 (en) 2012-12-27 2015-11-30 Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012286366A JP6170672B2 (ja) 2012-12-27 2012-12-27 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2014130853A JP2014130853A (ja) 2014-07-10
JP2014130853A5 true JP2014130853A5 (OSRAM) 2015-05-28
JP6170672B2 JP6170672B2 (ja) 2017-07-26

Family

ID=51021078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012286366A Expired - Fee Related JP6170672B2 (ja) 2012-12-27 2012-12-27 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法

Country Status (5)

Country Link
US (2) US20150284603A1 (OSRAM)
JP (1) JP6170672B2 (OSRAM)
KR (1) KR101793583B1 (OSRAM)
TW (1) TWI643925B (OSRAM)
WO (1) WO2014103996A1 (OSRAM)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9865490B2 (en) 2014-01-07 2018-01-09 Brewer Science Inc. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
US9496164B2 (en) * 2014-01-07 2016-11-15 Brewer Science Inc. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
JP6379191B2 (ja) * 2014-05-30 2018-08-22 富士フイルム株式会社 仮接着膜、積層体、仮接着用組成物、デバイスの製造方法およびキット
JP6384234B2 (ja) * 2014-09-25 2018-09-05 デクセリアルズ株式会社 ラジカル重合型接着剤組成物、及び電気接続体の製造方法
CN107428890B (zh) 2015-04-22 2020-12-22 电化株式会社 组合物
KR20170046468A (ko) 2015-10-21 2017-05-02 에스프린팅솔루션 주식회사 감광층 상에 형성된 보호층을 포함하는 감광체
GB2544335A (en) 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
DE102016106351A1 (de) * 2016-04-07 2017-10-12 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zum Bonden zweier Substrate
WO2018003981A1 (ja) * 2016-07-01 2018-01-04 デンカ株式会社 組成物
TWI732005B (zh) * 2016-07-29 2021-07-01 日商富士軟片股份有限公司 套組、洗淨劑組成物及半導體元件的製造方法
JP7043173B2 (ja) * 2017-02-07 2022-03-29 東京応化工業株式会社 ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法
DE102017103095A1 (de) * 2017-02-15 2018-08-16 Infineon Technologies Ag Handhaben eines dünnen Wafers während der Chipherstellung
JP7064857B2 (ja) * 2017-12-14 2022-05-11 三星エスディアイ株式会社 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム
KR102541924B1 (ko) * 2018-01-08 2023-06-13 한국전자통신연구원 접착 필름 및 이를 이용한 반도체 패키지의 제조 방법
US20190211231A1 (en) * 2018-01-08 2019-07-11 Electronics And Telecommunications Research Institute Adhesive film for electric device and method of fabricating semiconductor package using the same
KR102588785B1 (ko) * 2019-02-25 2023-10-12 미쓰비시덴키 가부시키가이샤 반도체 소자의 제조 방법
US11682600B2 (en) * 2019-08-07 2023-06-20 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Protection layer for panel handling systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177098A (ja) * 1992-12-10 1994-06-24 Mitsui Toatsu Chem Inc ウエハ裏面研削用テープおよびその使用方法
EP1041624A1 (en) * 1999-04-02 2000-10-04 Interuniversitair Microelektronica Centrum Vzw Method of transferring ultra-thin substrates and application of the method to the manufacture of a multilayer thin film device
JP4474854B2 (ja) * 2003-07-02 2010-06-09 Ｊｓｒ株式会社 感放射線性接着剤組成物およびこれを用いたウェハーの加工方法
DE112009000140B4 (de) * 2008-01-24 2022-06-15 Brewer Science, Inc. Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand
WO2009117729A2 (en) * 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
JP2011052142A (ja) * 2009-09-03 2011-03-17 Jsr Corp 接着剤組成物、それを用いた基材の加工または移動方法および半導体素子
JP5010668B2 (ja) * 2009-12-03 2012-08-29 信越化学工業株式会社 積層型半導体集積装置の製造方法
JP2011236261A (ja) * 2010-05-06 2011-11-24 Furukawa Electric Co Ltd:The 半導体用接着フィルム及び半導体装置の製造方法
US20130220533A1 (en) * 2010-09-16 2013-08-29 Toru Tonegawa Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method
US9029269B2 (en) * 2011-02-28 2015-05-12 Dow Corning Corporation Wafer bonding system and method for bonding and debonding thereof

Similar Documents

Publication Publication Date Title
JP2014130853A5 (OSRAM)
JP2014080570A5 (OSRAM)
JP2014129431A5 (OSRAM)
JP2014070191A5 (OSRAM)
JP2015501356A5 (OSRAM)
TWI517978B (zh) 層合體、及分離方法
CN102592964B (zh) 一种石墨烯薄膜的衬底转移方法
JP2019123884A5 (OSRAM)
JP2016033215A5 (OSRAM)
JP2010034535A5 (OSRAM)
JP2016516657A5 (OSRAM)
JP2013522393A5 (OSRAM)
JP2016507449A5 (OSRAM)
JP2009010353A5 (OSRAM)
JP2013542455A5 (OSRAM)
JP2006080314A5 (OSRAM)
JP2013502050A5 (OSRAM)
JP2010245412A5 (OSRAM)
JP2013256610A5 (OSRAM)
KR20140052894A (ko) 접착성 조성물 및 그 접착 방법, 및 접착 후의 박리 방법
EP2629326A3 (en) Substrate transport method and substrate transport apparatus
JP2015518270A5 (OSRAM)
TW201802989A (zh) 結合兩基材之方法與裝置
JP2010534346A5 (OSRAM)
JP2011100985A5 (OSRAM)