JP2014129477A5 - - Google Patents
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- Publication number
- JP2014129477A5 JP2014129477A5 JP2012288120A JP2012288120A JP2014129477A5 JP 2014129477 A5 JP2014129477 A5 JP 2014129477A5 JP 2012288120 A JP2012288120 A JP 2012288120A JP 2012288120 A JP2012288120 A JP 2012288120A JP 2014129477 A5 JP2014129477 A5 JP 2014129477A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- molecular chain
- bonded
- silicon atom
- dimethylvinylsiloxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- -1 trimethylsiloxy Chemical group 0.000 description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 6
- 150000003961 organosilicon compounds Chemical class 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NNBKRIKVBOICMG-UHFFFAOYSA-N anthracen-1-yl-[anthracen-1-yl(methyl)silyl]oxy-methylsilane Chemical compound C1(=CC=CC2=CC3=CC=CC=C3C=C12)[SiH](O[SiH](C)C1=CC=CC2=CC3=CC=CC=C3C=C12)C NNBKRIKVBOICMG-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- RMZSTOAGUSEJFY-UHFFFAOYSA-N methyl-[methyl(phenyl)silyl]oxy-phenylsilane Chemical compound C=1C=CC=CC=1[SiH](C)O[SiH](C)C1=CC=CC=C1 RMZSTOAGUSEJFY-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012288120A JP6059010B2 (ja) | 2012-12-28 | 2012-12-28 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| PCT/JP2013/085315 WO2014104390A2 (en) | 2012-12-28 | 2013-12-24 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| US14/655,536 US20150344636A1 (en) | 2012-12-28 | 2013-12-24 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device |
| KR1020157020575A KR20150100930A (ko) | 2012-12-28 | 2013-12-24 | 경화성 실리콘 조성물, 이의 경화물 및 광반도체 장치 |
| TW102148881A TW201428060A (zh) | 2012-12-28 | 2013-12-27 | 可硬化性聚矽氧組合物、其硬化製品及光半導體裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012288120A JP6059010B2 (ja) | 2012-12-28 | 2012-12-28 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014129477A JP2014129477A (ja) | 2014-07-10 |
| JP2014129477A5 true JP2014129477A5 (https=) | 2016-02-04 |
| JP6059010B2 JP6059010B2 (ja) | 2017-01-11 |
Family
ID=49998635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012288120A Expired - Fee Related JP6059010B2 (ja) | 2012-12-28 | 2012-12-28 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150344636A1 (https=) |
| JP (1) | JP6059010B2 (https=) |
| KR (1) | KR20150100930A (https=) |
| TW (1) | TW201428060A (https=) |
| WO (1) | WO2014104390A2 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5985981B2 (ja) | 2012-12-28 | 2016-09-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| WO2017208748A1 (ja) * | 2016-05-30 | 2017-12-07 | 日産化学工業株式会社 | 重合性シラン化合物 |
| US10899891B2 (en) * | 2016-05-30 | 2021-01-26 | Nissan Chemical Corporation | Reactive polysiloxane and polymerizable composition comprising same |
| CN106831849A (zh) * | 2017-01-24 | 2017-06-13 | 广东信翼科技有限公司 | 一种含烯丙基聚硅氧烷的制备方法 |
| CN112135861A (zh) | 2018-05-17 | 2020-12-25 | 赢创运营有限公司 | Aba结构类型的线性聚二甲基硅氧烷-聚氧化烯嵌段共聚物 |
| EP3611217B1 (de) * | 2018-08-15 | 2024-07-24 | Evonik Operations GmbH | Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba |
| EP3794060A1 (de) | 2018-05-17 | 2021-03-24 | Evonik Operations GmbH | Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba |
| EP3611216A1 (de) * | 2018-08-15 | 2020-02-19 | Evonik Operations GmbH | Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba |
| EP3611215A1 (de) | 2018-08-15 | 2020-02-19 | Evonik Operations GmbH | Verfahren zur herstellung acetoxygruppen-tragender siloxane |
| EP3611214A1 (de) | 2018-08-15 | 2020-02-19 | Evonik Operations GmbH | Sioc-verknüpfte, lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere |
| JP7220686B2 (ja) * | 2020-05-15 | 2023-02-10 | 信越化学工業株式会社 | 有機ケイ素化合物 |
| DE102020118247A1 (de) | 2020-07-10 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Precursor zur Herstellung eines Polysiloxans, Polysiloxan, Polysiloxanharz, Verfahren zur Herstellung eines Polysiloxans, Verfahren zur Herstellung eines Polysiloxanharzes und optoelektronisches Bauelement |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101152869B1 (ko) * | 2010-01-25 | 2012-06-12 | 주식회사 엘지화학 | 경화성 조성물 |
| JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
| JP2012097225A (ja) * | 2010-11-04 | 2012-05-24 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
| JP2012111875A (ja) * | 2010-11-25 | 2012-06-14 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
| JP5652387B2 (ja) * | 2011-12-22 | 2015-01-14 | 信越化学工業株式会社 | 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置 |
| KR101560042B1 (ko) * | 2012-07-27 | 2015-10-15 | 주식회사 엘지화학 | 경화성 조성물 |
-
2012
- 2012-12-28 JP JP2012288120A patent/JP6059010B2/ja not_active Expired - Fee Related
-
2013
- 2013-12-24 WO PCT/JP2013/085315 patent/WO2014104390A2/en not_active Ceased
- 2013-12-24 KR KR1020157020575A patent/KR20150100930A/ko not_active Withdrawn
- 2013-12-24 US US14/655,536 patent/US20150344636A1/en not_active Abandoned
- 2013-12-27 TW TW102148881A patent/TW201428060A/zh unknown
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