JP2014123622A5 - - Google Patents
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- Publication number
- JP2014123622A5 JP2014123622A5 JP2012278247A JP2012278247A JP2014123622A5 JP 2014123622 A5 JP2014123622 A5 JP 2014123622A5 JP 2012278247 A JP2012278247 A JP 2012278247A JP 2012278247 A JP2012278247 A JP 2012278247A JP 2014123622 A5 JP2014123622 A5 JP 2014123622A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- electronic component
- insulating layer
- support substrate
- surface side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 10
- 239000004020 conductor Substances 0.000 claims 5
- 238000009413 insulation Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012278247A JP6290534B2 (ja) | 2012-12-20 | 2012-12-20 | 半導体パッケージ及び半導体パッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012278247A JP6290534B2 (ja) | 2012-12-20 | 2012-12-20 | 半導体パッケージ及び半導体パッケージの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014123622A JP2014123622A (ja) | 2014-07-03 |
| JP2014123622A5 true JP2014123622A5 (https=) | 2016-01-07 |
| JP6290534B2 JP6290534B2 (ja) | 2018-03-07 |
Family
ID=51403904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012278247A Active JP6290534B2 (ja) | 2012-12-20 | 2012-12-20 | 半導体パッケージ及び半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6290534B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7223525B2 (ja) * | 2018-08-09 | 2023-02-16 | 新光電気工業株式会社 | インダクタ及びインダクタの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144203A (ja) * | 1999-11-16 | 2001-05-25 | Mitsubishi Electric Corp | キャビティダウン型ｂｇａパッケージ |
| JP2003243604A (ja) * | 2002-02-13 | 2003-08-29 | Sony Corp | 電子部品及び電子部品の製造方法 |
| JP4865197B2 (ja) * | 2004-06-30 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP5068133B2 (ja) * | 2007-10-17 | 2012-11-07 | 新光電気工業株式会社 | 半導体チップ積層構造体及び半導体装置 |
| JP2009135221A (ja) * | 2007-11-29 | 2009-06-18 | Shinko Electric Ind Co Ltd | 多層配線基板及びその製造方法ならびに半導体装置 |
| JP2009224617A (ja) * | 2008-03-17 | 2009-10-01 | Shinko Electric Ind Co Ltd | 配線基板 |
| JP5262552B2 (ja) * | 2008-10-14 | 2013-08-14 | 富士電機株式会社 | 半導体装置の製造方法及び半導体装置 |
| JP2012169440A (ja) * | 2011-02-14 | 2012-09-06 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
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2012
- 2012-12-20 JP JP2012278247A patent/JP6290534B2/ja active Active