JP2014111708A - 熱硬化性樹脂組成物、光反射性異方性導電接着剤及び発光装置 - Google Patents
熱硬化性樹脂組成物、光反射性異方性導電接着剤及び発光装置 Download PDFInfo
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Images
Classifications
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Abstract
【解決手段】熱硬化性樹脂組成物は、エポキシ基含有シロキサン化合物より、具体的にはテトラキス(ジグリシジルイソシアヌリル変性シロキシ)シランと、エポキシ樹脂用硬化剤とを含有する。
【選択図】図3
Description
前述したとおり、本発明の熱硬化性樹脂組成物は、式(1)で表されるエポキシ基含有シロキサン化合物と、エポキシ樹脂用硬化剤とを含有する。式(1)で表されるエポキシ基含有シロキサン化合物を含有することにより、熱や光により異方性導電接着剤が変色してしまうことを防止でき、しかも実用上十分なダイシェア強度を実現することができる。
式(1)中、Rは独立的にアルキル基又はフェニル基である。変色し難さの点からアルキル基が好ましい。アルキル基としては、基材への接着性の点から炭素数1〜6のアルキル基、例えば、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、へプチル基、イソへプチル基、ヘキシル基が好ましく、中でも、炭素数1〜3の低級アルキル基、例えば、メチル基、エチル基、プロピル基、イソプロピル基が好ましい。特に、熱光耐黄変性の点からメチル基が好ましい。
Aは、独立的に2価の炭化水素基、例えば、炭素数2以上のアルキレン基、アリーレン基、アラルキレン基であるが、変色し難さの点から炭素数2以上のアルキレン基が好ましい。
置換基R1、R2は、独立的にエポキシ基含有有機基、アルキル基又はアリール基であるが、R1及びR2の少なくとも一方、好ましくは双方がエポキシ基含有有機基である。
本発明の光反射性異方性導電接着剤が含有する光反射性絶縁粒子は、異方性導電接着剤に入射した光を外部に反射するためのものである。
本発明の光反射性異方性導電接着剤を構成する導電粒子としては、異方性導電接続用の従来の導電粒子において用いられている金属の粒子を利用することができる。例えば、金、ニッケル、銅、銀、半田、パラジウム、アルミニウム、それらの合金、それらの多層化物(例えば、ニッケルメッキ/金フラッシュメッキ物)等を挙げることができる。中でも、金、ニッケル、銅は、導電粒子を茶色としてしまうことから、本発明の効果を他の金属材料よりも享受することができる。
本発明の光反射性異方性導電接着剤は、以上説明した光反射性絶縁粒子と導電粒子と熱硬化性樹脂組成物とを、常法に従って均一に混合することにより製造することができる。また、光反射性異方性導電フィルムとする場合には、それらをトルエン等の溶媒とともに分散混合し、剥離処理したPETフィルムに所期の厚さとなるように塗布し、約80℃程度の温度で乾燥すればよい。
本発明の光反射性異方性導電接着剤の反射特性は、発光素子の発光効率を向上させるために、光反射性異方性導電接着剤の硬化物の波長450nmの光に対する反射率(JIS K7105)が、少なくとも30%であること望ましい。このような反射率とするためには、使用する光反射性導電粒子の反射特性や配合量、熱硬化性樹脂組成物の配合組成などを適宜調整すればよい。通常、反射特性の良好な光反射性導電粒子の配合量を増量すれば、反射率も増大する傾向がある。
次に、本発明の発光装置について図2を参照しながら説明する。発光装置200は、基板21上の接続端子22と、発光素子としてLED素子23のn電極24とp電極25とのそれぞれに形成された接続用のバンプ26との間に、前述の本発明の光反射性異方性導電接着剤を塗布し、基板21とLED素子23とがフリップチップ実装されている発光装置である。ここで、光反射性異方性導電接着剤の硬化物100は、光反射性絶縁粒子10が熱硬化性樹脂組成物の硬化物11中に分散してなるものである。なお、必要に応じて、LED素子23の全体を覆うように透明モールド樹脂で封止してもよい。また、LED素子23に従来と同様に光反射層を設けてもよい。
窒素気流中、還流冷却管と磁気撹拌子とを備えた100ml三口フラスコに、28.37g(100.88mmol)の1−アリル−3,5−ジグリシジルイソシアヌレート(MADGIC、四国化成工業(株))と、6.63g(20.17mmol)のテトラキス(ハイドロジェンジメチルシロキシ)シラン(SIT7278.0、Gelest Inc.)]とを投入し、混合物を80℃で均一に溶融するまで撹拌した。続いて、この溶融混合物に2%Karstedt触媒溶液(キシレン溶液)30.2μLを添加し、撹拌しながら140℃になるまで加熱し、溶融混合物の温度が140℃に到達してから、その温度を9時間保持して、1−アリル−3,5−ジグリシジルイソシアヌレートとテトラキス(ハイドロジェンジメチルシロキシ)シランとを反応させた。
ヒドロシリル化反応の進行具合を確認するために、以下に説明するようにFT−IR測定と1HNMR測定とを行った。
ヒドロシリル化反応物の減圧蒸留残渣、並びに原料の1−アリル−3,5−ジグリシジルイソシアヌレート(MADGIC)とテトラキス(ハイドロジェンジメチルシロキシ)シラン(SIT7278.0)について、それぞれFT−IR測定(測定装置:フーリエ変換赤外分光光度計 FT−IR−460PLUS、日本分光(株)製)を行い、得られた結果を図3に示した。原料のテトラキス(ハイドロジェンジメチルシロキシ)シラン(SIT7278.0)については、Si−H基特有のスペクトルとして、2140cm−1付近の伸縮ピーク、900cm−1付近の変角振動ピークが検出された。また、1690cm−1及び1460cm−1付近には、イソシアヌレート由来のシャープなカルボニル基伸縮ピークが検出された。反応物の減圧蒸留残渣については、Si−H基に特有な2140cm−1付近と900cm−1付近のピークは検出されず、一方、イソシアヌレートに由来する1690cm−1及び1460cm−1付近のピークが検出された。
ヒドロシリル化反応物の減圧蒸留残渣について、1H-NMR測定(測定装置:MERCURY300、VARIAN製)を行い、得られた結果を図4に示した。ケミカルシフトが0ppm付近には、シリコーン由来のSi−Me基に対応するシグナルが観測された。また、ケミカルシフトが4.12〜2.66ppmには、グリシジルイソシアヌレート由来のシグナルが多数確認された。他方、アリル基のα,β位炭素隣接プロトンにみられる特有のシグナルとSi−H基のシグナル(両者とも、ケミカルシフト6.00〜5.00ppm)とは、共に確認されなかった。
得られたエポキシ基含有シロキサン化合物を用い、表1に示す配合組成の成分を均一に混合することにより絶縁性接着剤として本発明の熱硬化性樹脂組成物を調製した。なお、実施例1においては、エポキシ基/酸無水物の官能基数の比が1/1.1となるように、エポキシ化合物と酸無水物系硬化剤とを配合した。
また、比較例1の絶縁性接着剤としての熱硬化性樹脂組成物は、エポキシ化合物として、式(1a)のエポキシ基含有シロキサン化合物に代えて1,3,5−トリグリシジルイソシアネートを使用した例であり、比較例2の絶縁性接着剤としての熱硬化性樹脂組成物は、2液硬化型ジメチルシリコーン樹脂(IVS4742、モメンティブマテリアル社)であり、比較例3の絶縁性接着剤としての熱硬化性樹脂組成物は、2液硬化型フェニルシリコーン樹脂(SCR−1012、信越化学工業(株))である。
得られた絶縁性接着剤としての熱硬化性樹脂組成物について、ダイシェア強度試験、耐熱試験と耐熱光試験とを行った。得られた結果を表2に示す。
金バンプ(高10μm、径80μm、ピッチ190μm)が形成された10μm厚の銀ベタ電極を有するLED用ガラスエポキシ基板(特注品、関西電子工業(株)))に、径が4mmとなるように絶縁性接着剤を塗布し、そこへ0.3mm角のフリップチップ型LED素子(GM35R460G、昭和電工(株))を載せ、フリップチップ型LED素子が表側となるようにガラスエポキシ基板を80℃に保持されたホットプレートに置き、2分間加熱してLED素子をLED用ガラスエポキシ基板に仮固定した。このLED素子が仮固定されたLED用ガラスエポキシ基板を熱圧着装置に適用し、LED素子に80gf/chipの圧力を印加しながら230℃で15秒間熱圧着処理を行うことにより、LED用ガラスエポキシ基板にLED素子が実装されたLED装置を作成した。実施例1又は比較例1の絶縁性接着剤を使用して作成したLED装置の場合、熱圧着処理後に更に260℃、20秒のリフロー処理を行った。
1mm高さのスペーサが四隅に配置された2枚のアルミニウム平板(長100mm×幅50.0mm×厚0.50mm)で絶縁性接着剤を挟み、実施例1及び比較例1の絶縁性接着剤については、まず120℃で30分加熱し、続いて140℃で1時間加熱することにより硬化樹脂シートサンプルを作成した。また、比較例2及び3の絶縁性接着剤については、まず80℃で1時間加熱し、続いて150℃で2時間加熱することにより硬化樹脂シートサンプルを作成した。
耐熱試験に供した硬化樹脂シートサンプルと同様の硬化樹脂シートサンプルを作成し、それを、温度120℃で光強度16mW/cm2に設定された熱光試験機(スーパーウインミニ、ダイプラウィンテス(株);メタルハライドランプ使用)内に1000時間放置し、得られた硬化樹脂シートを、150℃に設定されたオーブン内に1000時間放置し、放置前後の分光特性(L*、a*、b*)を、分光測色計(CM−3600d、コニカミノルタオプティクス(株))を用いて測定し、得られた測定値から色差(ΔE)を算出した。実用上、ΔEは20以下であることが望まれる。
絶縁性接着剤として実施例1の熱硬化性樹脂組成物100質量部に対し、光反射性絶縁粒子(平均粒径0.5μmの二酸化チタン酸粉末(KR−380、チタン工業(株))24.0質量部と、導電粒子(平均粒径5μmの金被覆樹脂導電粒子(平均粒径4.6μmの球状アクリル樹脂粒子に0.2μm厚の無電解金メッキを施した粒子(ライト20GNB4、日本化学工業(株))5.00質量部とを均一に混合することにより実施例2の光反射性異方性導電接着剤を調製した。
光反射性絶縁粒子を使用しない以外は、実施例4と同様の操作を繰り返すことにより異方性導電接着剤を調製した。
得られた光反射性異方性導電接着剤の光反射率評価試験、LED実装サンプルにおける全光束量評価試験を以下に説明するように測定した。
得られた実施例2及び比較例4の異方性導電接着剤を、セラミック製の白色板に乾燥厚で100μmとなるように塗布し、200℃で1分間加熱し、硬化させた。この硬化物について、分光光度計(U3300、日立製作所(株))を用いて、波長450nmの光に対する反射率(JIS K7150)を測定した。反射率は、実用上30%以上であるところ、実施例2の光反射性異方性導電接着剤は30%を超える反射率を示したのに対し、比較例4の異方性導電接着剤は30%を超える反射率を示さなかった。
100μmピッチの銅配線にNi/Au(5.0μm厚/0.3μm厚)メッキ処理した配線を有するガラスエポキシ基板に、バンプボンダー(FB700、カイジョー(株))を用いて15μm高の金バンプを形成した。この金バンプ付きエポキシ基板に、実施例2の光反射性異方性導電接着剤又は比較例4の異方性導電接着剤を用いて、青色LED(Vf=3.2(If=20mA))を200℃、60秒、1Kg/チップという条件でフィリップチップ実装し、テスト用LEDモジュールを得た。
2 無機粒子
3 光反射層
4 熱可塑性樹脂
10、20 光反射性導電粒子
11 熱硬化性樹脂組成物の硬化物
21 基板
22 接続端子
23 LED素子
24 n電極
25 p電極
26 バンプ
100 光反射性異方性導電接着剤の硬化物
200 発光装置
Claims (16)
- 置換基Rが炭素数1〜3の低級アルキル基であり、連結基Aが炭素数2〜6のアルキレン基であり、置換基R1、R2が共にエポキシ基含有有機基である請求項1記載の熱硬化性樹脂組成物。
- 置換基Rがメチル基であり、連結基Aがトリメチレン基であり、置換基R1、R2が共にグリシジル基である請求項2記載の熱硬化性樹脂組成物。
- 式(1)のエポキシ基含有シロキサン化合物100質量部に対し、エポキシ樹脂用硬化剤を50〜120質量部含有する請求項1〜3のいずれかに記載の熱硬化性樹脂組成物。
- エポキシ樹脂用硬化剤が、酸無水物系硬化剤である請求項1〜4のいずれかに記載の熱硬化性樹脂組成物。
- 更にイミダゾール系硬化促進剤を含有する請求項5記載の熱硬化性樹脂組成物。
- 酸無水物系硬化剤100質量部に対し、イミダゾール系硬化促進剤を0.20〜2.00質量部含有する請求項6記載の熱硬化性樹脂組成物。
- 発光素子を配線板に異方性導電接続するために使用する光反射性異方性導電接着剤であって、請求項1〜7のいずれかに記載の熱硬化性樹脂組成物、導電粒子及び光反射性絶縁粒子を含有することを特徴とする光反射性異方性導電接着剤。
- 光反射性絶縁粒子が、酸化チタン、窒化ホウ素、酸化亜鉛及び酸化アルミニウムからなる群より選択される少なくとも一種の無機粒子である請求項8記載の光反射性異方性導電接着剤。
- 光反射性絶縁粒子の屈折率(JIS K7142)が、熱硬化性樹脂組成物の硬化物の屈折率(JIS K7142)よりも大きい請求項8又は9記載の光反射性異方性導電接着剤。
- 光反射性絶縁粒子が、鱗片状又は球状銀粒子の表面を絶縁性樹脂で被覆した樹脂被覆金属粒子である請求項8〜10のいずれかに記載の光反射性異方性導電接着剤。
- 光反射性異方性導電接着剤が、光反射性絶縁粒子を1〜50体積%で含有している請求項8〜11のいずれかに記載の光反射性異方性導電接着剤。
- 導電粒子が、金属材料で被覆されているコア粒子と、その表面に酸化チタン粒子、窒化ホウ素粒子、酸化亜鉛粒子又は酸化アルミニウム粒子から選択された少なくとも一種の無機粒子から形成された光反射層とからなる光反射性導電粒子である請求項8〜12のいずれかに記載の光反射性異方性導電接着剤。
- 熱硬化性樹脂組成物100質量部に対する光反射性導電粒子の配合量が、1〜100質量部である請求項13記載の光反射性異方性導電接着剤。
- 請求項1〜14のいずれかに記載の光反射性異方性導電接着剤を介して、発光素子をフリップチップ方式で配線板に実装されている発光装置。
- 発光素子が、発光ダイオードである請求項15記載の発光装置。
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JP6003763B2 (ja) | 2016-10-05 |
TW201430067A (zh) | 2014-08-01 |
KR20150081247A (ko) | 2015-07-13 |
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