JP2014091190A5 - - Google Patents

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Publication number
JP2014091190A5
JP2014091190A5 JP2012242367A JP2012242367A JP2014091190A5 JP 2014091190 A5 JP2014091190 A5 JP 2014091190A5 JP 2012242367 A JP2012242367 A JP 2012242367A JP 2012242367 A JP2012242367 A JP 2012242367A JP 2014091190 A5 JP2014091190 A5 JP 2014091190A5
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JP
Japan
Prior art keywords
auxiliary plate
function
adhesive tape
plate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012242367A
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English (en)
Japanese (ja)
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JP2014091190A (ja
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Publication date
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Priority to JP2012242367A priority Critical patent/JP2014091190A/ja
Priority claimed from JP2012242367A external-priority patent/JP2014091190A/ja
Publication of JP2014091190A publication Critical patent/JP2014091190A/ja
Publication of JP2014091190A5 publication Critical patent/JP2014091190A5/ja
Pending legal-status Critical Current

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JP2012242367A 2012-11-02 2012-11-02 研磨パッドの寿命検知方法 Pending JP2014091190A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012242367A JP2014091190A (ja) 2012-11-02 2012-11-02 研磨パッドの寿命検知方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012242367A JP2014091190A (ja) 2012-11-02 2012-11-02 研磨パッドの寿命検知方法

Publications (2)

Publication Number Publication Date
JP2014091190A JP2014091190A (ja) 2014-05-19
JP2014091190A5 true JP2014091190A5 (enExample) 2015-12-17

Family

ID=50935652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012242367A Pending JP2014091190A (ja) 2012-11-02 2012-11-02 研磨パッドの寿命検知方法

Country Status (1)

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JP (1) JP2014091190A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9835449B2 (en) 2015-08-26 2017-12-05 Industrial Technology Research Institute Surface measuring device and method thereof
JP2017072583A (ja) * 2015-08-26 2017-04-13 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ 表面測定装置及びその方法
US9970754B2 (en) 2015-08-26 2018-05-15 Industrial Technology Research Institute Surface measurement device and method thereof
JP7052292B2 (ja) * 2017-10-31 2022-04-12 富士通株式会社 研削装置及び研削方法
JP7420328B2 (ja) 2021-12-27 2024-01-23 株式会社レゾナック うねり予測装置、うねり予測方法、被研磨物の加工方法及びプログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277405A (ja) * 1998-03-31 1999-10-12 Nkk Corp Ｃｍｐ装置の研磨パッド調整装置
JP2003053658A (ja) * 2001-08-20 2003-02-26 Promos Technologies Inc 使用状態が監視される研磨パッドおよびその研磨パッドを利用した交換方法
JP2010214579A (ja) * 2009-03-16 2010-09-30 Toho Engineering Kk 再使用および再生可能な補助板付き研磨パッド
JP4680314B1 (ja) * 2010-02-04 2011-05-11 東邦エンジニアリング株式会社 研磨パッド用補助板およびそれを用いた研磨パッドの再生方法
JP2012007961A (ja) * 2010-06-24 2012-01-12 Panasonic Corp 形状測定装置および形状測定方法
US20120270474A1 (en) * 2011-04-20 2012-10-25 Nanya Technology Corporation Polishing pad wear detecting apparatus

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