JP2014091190A - 研磨パッドの寿命検知方法 - Google Patents

研磨パッドの寿命検知方法 Download PDF

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Publication number
JP2014091190A
JP2014091190A JP2012242367A JP2012242367A JP2014091190A JP 2014091190 A JP2014091190 A JP 2014091190A JP 2012242367 A JP2012242367 A JP 2012242367A JP 2012242367 A JP2012242367 A JP 2012242367A JP 2014091190 A JP2014091190 A JP 2014091190A
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Japan
Prior art keywords
polishing pad
polishing
life
abrasive pad
pad
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JP2012242367A
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Japanese (ja)
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JP2014091190A5 (enExample
Inventor
Tatsutoshi Suzuki
辰俊 鈴木
Eisuke Suzuki
英資 鈴木
Daisuke Suzuki
大介 鈴木
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Toho Engineering Co Ltd
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Toho Engineering Co Ltd
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Priority to JP2012242367A priority Critical patent/JP2014091190A/ja
Publication of JP2014091190A publication Critical patent/JP2014091190A/ja
Publication of JP2014091190A5 publication Critical patent/JP2014091190A5/ja
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012242367A 2012-11-02 2012-11-02 研磨パッドの寿命検知方法 Pending JP2014091190A (ja)

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JP2012242367A JP2014091190A (ja) 2012-11-02 2012-11-02 研磨パッドの寿命検知方法

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JP2012242367A JP2014091190A (ja) 2012-11-02 2012-11-02 研磨パッドの寿命検知方法

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JP2014091190A true JP2014091190A (ja) 2014-05-19
JP2014091190A5 JP2014091190A5 (enExample) 2015-12-17

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017072583A (ja) * 2015-08-26 2017-04-13 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ 表面測定装置及びその方法
US9835449B2 (en) 2015-08-26 2017-12-05 Industrial Technology Research Institute Surface measuring device and method thereof
US9970754B2 (en) 2015-08-26 2018-05-15 Industrial Technology Research Institute Surface measurement device and method thereof
JP2019081238A (ja) * 2017-10-31 2019-05-30 富士通株式会社 研削装置及び研削方法
WO2023127601A1 (ja) 2021-12-27 2023-07-06 株式会社レゾナック うねり予測装置、うねり予測方法、被研磨物の加工方法及びプログラム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277405A (ja) * 1998-03-31 1999-10-12 Nkk Corp Ｃｍｐ装置の研磨パッド調整装置
JP2003053658A (ja) * 2001-08-20 2003-02-26 Promos Technologies Inc 使用状態が監視される研磨パッドおよびその研磨パッドを利用した交換方法
JP2010214579A (ja) * 2009-03-16 2010-09-30 Toho Engineering Kk 再使用および再生可能な補助板付き研磨パッド
JP2011161522A (ja) * 2010-02-04 2011-08-25 Toho Engineering Kk 研磨パッド用補助板およびそれを用いた研磨パッドの再生方法
JP2012007961A (ja) * 2010-06-24 2012-01-12 Panasonic Corp 形状測定装置および形状測定方法
US20120270474A1 (en) * 2011-04-20 2012-10-25 Nanya Technology Corporation Polishing pad wear detecting apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277405A (ja) * 1998-03-31 1999-10-12 Nkk Corp Ｃｍｐ装置の研磨パッド調整装置
JP2003053658A (ja) * 2001-08-20 2003-02-26 Promos Technologies Inc 使用状態が監視される研磨パッドおよびその研磨パッドを利用した交換方法
JP2010214579A (ja) * 2009-03-16 2010-09-30 Toho Engineering Kk 再使用および再生可能な補助板付き研磨パッド
JP2011161522A (ja) * 2010-02-04 2011-08-25 Toho Engineering Kk 研磨パッド用補助板およびそれを用いた研磨パッドの再生方法
JP2012007961A (ja) * 2010-06-24 2012-01-12 Panasonic Corp 形状測定装置および形状測定方法
US20120270474A1 (en) * 2011-04-20 2012-10-25 Nanya Technology Corporation Polishing pad wear detecting apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017072583A (ja) * 2015-08-26 2017-04-13 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ 表面測定装置及びその方法
US9835449B2 (en) 2015-08-26 2017-12-05 Industrial Technology Research Institute Surface measuring device and method thereof
US9970754B2 (en) 2015-08-26 2018-05-15 Industrial Technology Research Institute Surface measurement device and method thereof
JP2019081238A (ja) * 2017-10-31 2019-05-30 富士通株式会社 研削装置及び研削方法
JP7052292B2 (ja) 2017-10-31 2022-04-12 富士通株式会社 研削装置及び研削方法
WO2023127601A1 (ja) 2021-12-27 2023-07-06 株式会社レゾナック うねり予測装置、うねり予測方法、被研磨物の加工方法及びプログラム
KR20240126440A (ko) 2021-12-27 2024-08-20 가부시끼가이샤 레조낙 굴곡 예측 장치, 굴곡 예측 방법, 연마 대상물 가공 방법 및 프로그램

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