JP2014067892A - Wiring board and electronic apparatus - Google Patents

Wiring board and electronic apparatus Download PDF

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JP2014067892A
JP2014067892A JP2012212560A JP2012212560A JP2014067892A JP 2014067892 A JP2014067892 A JP 2014067892A JP 2012212560 A JP2012212560 A JP 2012212560A JP 2012212560 A JP2012212560 A JP 2012212560A JP 2014067892 A JP2014067892 A JP 2014067892A
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layer
main conductor
conductor layer
wiring board
conductor
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JP5970317B2 (en
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Hiroshi Kamase
祐志 釡瀬
Kiminari Todo
公成 藤堂
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Kyocera Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which achieves high mounting reliability and an electronic apparatus.SOLUTION: A wiring board 1 of this invention includes: an insulation substrate 2; a conductor electrode 3 provided on the insulation substrate 2; a main conductor layer 4 which is provided on the conductor electrode 3; a coating metal layer 5; and a corrosion prevention layer 6. The coating metal layer 5 is provided on the main conductor layer 4 so as to cover the main conductor layer 4. The main conductor layer 4 has an exposed part 4a exposed from the coating metal layer 5. The corrosion prevention layer 6 is formed at the exposed part 4a.

Description

本発明は、例えば電子部品が搭載される配線基板および電子装置に関するものである。   The present invention relates to a wiring board and an electronic device on which electronic components are mounted, for example.

従来から、半導体素子，撮像素子，発光素子，コンデンサ，コイル，抵抗および振動子等の電子部品を搭載するための配線基板としては、絶縁基板、および導体パターンを含む導体電極を有するものが知られている。このような構成の配線基板は、例えば特許文献１に開示されている。   Conventionally, wiring boards for mounting electronic components such as semiconductor elements, imaging elements, light emitting elements, capacitors, coils, resistors, and vibrators have been known to have an insulating substrate and a conductor electrode including a conductor pattern. ing. A wiring board having such a configuration is disclosed in Patent Document 1, for example.

例えば、絶縁基板に導体電極を所定パターンに被着させるとともに、導体電極の上面に、銅、ニッケル等からなる主導体層を被着させ、さらに金から成る被覆金属層を被着させた構造のものが知られている。   For example, a conductor electrode is deposited on an insulating substrate in a predetermined pattern, a main conductor layer made of copper, nickel, etc. is deposited on the upper surface of the conductor electrode, and a coated metal layer made of gold is further deposited. Things are known.

特開平8−102580号公報JP-A-8-102580

上述の配線基板において、例えば主導体層の外縁において被覆金属層の被着が充分でなく、主導体層の外縁が露出する場合がある。このように主導体層の外縁が露出していると、主導体層を構成する元素が主導体層の露出している箇所で大気中の水分等と接触し、主導体層が腐食されて溶出して、被覆金属層上に主導体層の構成成分が付着することがある。このように被覆金属層上に主導体層の構成成分が付着すると、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等が低下してしまい、導体電極に対する電子部品の電気的および機械的な接続の信頼性の低下、電子部品の搭載時における歩留まりの低下等を招くという問題を有することがあった。   In the above-described wiring board, for example, the coating metal layer may not be sufficiently deposited at the outer edge of the main conductor layer, and the outer edge of the main conductor layer may be exposed. When the outer edge of the main conductor layer is exposed in this way, the elements constituting the main conductor layer come into contact with moisture in the atmosphere at the exposed portion of the main conductor layer, and the main conductor layer is corroded and eluted. As a result, the constituent components of the main conductor layer may adhere to the coated metal layer. When the constituent components of the main conductor layer adhere to the coated metal layer in this way, flip chip mounting property, wire bonding mounting property, solder wettability, etc. are lowered, and the electrical and mechanical properties of the electronic component with respect to the conductor electrode are reduced. There have been problems that the reliability of connection is lowered and the yield is lowered when electronic components are mounted.

本発明の一つの態様による配線基板は、絶縁基板と、絶縁基板上に設けられた導体電極と、導体電極上に設けられた主導体層と、被覆金属層と、腐食防止層とを備えている。被覆金属層は、主導体層を覆うように主導体層上に設けられている。主導体層は、被覆金属層から露出された露出部を有している。腐食防止層は、露出部に形成されている。   A wiring board according to an aspect of the present invention includes an insulating substrate, a conductor electrode provided on the insulating substrate, a main conductor layer provided on the conductor electrode, a covering metal layer, and a corrosion prevention layer. Yes. The covering metal layer is provided on the main conductor layer so as to cover the main conductor layer. The main conductor layer has an exposed portion exposed from the coating metal layer. The corrosion prevention layer is formed on the exposed portion.

本発明の他の態様によれば、電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを備えている。   According to another aspect of the present invention, an electronic device includes the wiring board having the above-described configuration and an electronic component mounted on the wiring board.

本発明の一つの態様による配線基板は、絶縁基板と、絶縁基板上に設けられた導体電極と、導体電極上に設けられた主導体層と、被覆金属層と、腐食防止層とを備えている。被覆金属層は、主導体層を覆うように主導体層上に設けられている。主導体層は、被覆金属層から露出された露出部を有している。腐食防止層は、露出部に形成されている。これらによって、被覆金属層が主導体層を覆うように主導体層上に設けられて、主導体層が被覆金属層から露出された露出部を有していても、主導体層の露出部に腐食防止層が形成されているため、主導体層の露出部が大気中の水分等と接触し難いものとなり、主導体層が腐食されにくくなり、被覆金属層上に主導体層の構成成分が付着しにくいものとなって、導体電極に対する電子部品の電気的および機械的な接続の信頼性が向上された配線基板を得
ることが可能となるものである。 A wiring board according to an aspect of the present invention includes an insulating substrate, a conductor electrode provided on the insulating substrate, a main conductor layer provided on the conductor electrode, a covering metal layer, and a corrosion prevention layer. Yes. The covering metal layer is provided on the main conductor layer so as to cover the main conductor layer. The main conductor layer has an exposed portion exposed from the coating metal layer. The corrosion prevention layer is formed on the exposed portion. Thus, even if the covering metal layer is provided on the main conductor layer so as to cover the main conductor layer and the main conductor layer has an exposed portion exposed from the covering metal layer, the exposed portion of the main conductor layer Since the corrosion prevention layer is formed, the exposed portion of the main conductor layer is difficult to come into contact with moisture in the atmosphere, the main conductor layer is not easily corroded, and the constituent components of the main conductor layer are formed on the coated metal layer. It becomes difficult to adhere, and it is possible to obtain a wiring board with improved reliability of electrical and mechanical connection of the electronic component to the conductor electrode.

本発明の他の態様によれば、電子装置は、上記構成の配線基板を備えていることによって、電子部品の実装信頼性に関して向上されている。   According to another aspect of the present invention, the electronic device includes the wiring board having the above-described configuration, thereby improving the mounting reliability of the electronic component.

（ａ）は本発明の実施形態における配線基板を示す縦断面図であり、（ｂ）は図１（ａ）に示された配線基板のＡ部を拡大して示す縦断面図である。(A) is a longitudinal cross-sectional view which shows the wiring board in embodiment of this invention, (b) is a longitudinal cross-sectional view which expands and shows the A section of the wiring board shown by Fig.1 (a). 本発明の実施形態における配線基板の変形例の要部を拡大して示す縦断面図である。It is a longitudinal cross-sectional view which expands and shows the principal part of the modification of the wiring board in embodiment of this invention.

以下、本発明の例示的な実施形態について図面を参照して説明する。   Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

図１、図２を参照して本発明の実施形態における配線基板について説明する。本実施形態における配線基板１は、絶縁基板２と、絶縁基板２上に設けられた導体電極３と、導体電極３上に設けられた主導体層４と、被覆金属層５と、腐食防止層６とを備えている。   A wiring board according to an embodiment of the present invention will be described with reference to FIGS. The wiring board 1 in this embodiment includes an insulating substrate 2, a conductor electrode 3 provided on the insulating substrate 2, a main conductor layer 4 provided on the conductor electrode 3, a covering metal layer 5, and a corrosion prevention layer. 6 is provided.

絶縁基板２は、例えば半導体素子，撮像素子，発光素子，センサ素子，容量素子，コイル，抵抗および振動子等の電子部品が上面に搭載され、例えば、酸化アルミニウム質焼結体，ムライト質焼結体，炭化珪素質焼結体，窒化アルミニウム質焼結体，窒化珪素質焼結体，ガラスセラミックス焼結体等の電気絶縁性セラミックス、エポキシ樹脂，ポリイミド樹脂，アクリル樹脂，フェノール樹脂，ポリエステル樹脂、および四フッ化エチレン樹脂を始めとするフッ素系樹脂等の樹脂（プラスティックス）から成る略四角形の絶縁層を複数上下に積層して形成されている。なお、絶縁基板２は単層にて形成されていてもよい。   The insulating substrate 2 is mounted with electronic parts such as a semiconductor element, an imaging element, a light emitting element, a sensor element, a capacitor element, a coil, a resistor and a vibrator on the upper surface, for example, an aluminum oxide sintered body, a mullite sintered body Body, silicon carbide sintered body, aluminum nitride sintered body, silicon nitride sintered body, glass ceramic sintered body and other electrically insulating ceramics, epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin, In addition, a plurality of substantially rectangular insulating layers made of a resin (plastics) such as a fluororesin such as tetrafluoroethylene resin are stacked in a vertical direction. The insulating substrate 2 may be formed of a single layer.

絶縁基板２は、例えば酸化アルミニウム質焼結体から成る場合であれば、アルミナ（Ａｌ２Ｏ３），シリカ（ＳｉＯ２），カルシア（ＣａＯ）およびマグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤および溶媒を添加混合して泥漿状となすとともに、これを従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを得て、次に、セラミックグリーンシートに適当な打ち抜きまたはレーザー加工を施すとともに必要に応じて複数枚積層し、高温（約１５００〜１８００℃）で焼成することによって製作される。 If the insulating substrate 2 is made of, for example, an aluminum oxide sintered body, an organic material suitable for raw material powders such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), and magnesia (MgO) is used. A ceramic green sheet is obtained by adding a solvent and a solvent to form a slurry, and forming this into a sheet by employing a conventionally known doctor blade method or calendar roll method. The sheet is manufactured by performing appropriate punching or laser processing, laminating a plurality of sheets as necessary, and firing at a high temperature (about 1500 to 1800 ° C.).

また、絶縁基板２が、例えば樹脂から成る場合は、所定の形状に成形できるような金型を用いて、トランスファーモールド法またはインジェクションモールド法等によって成形することによって形成することができる。また、例えばガラスエポキシ樹脂のように、ガラス繊維から成る基材に樹脂を含浸させたものであってもよい。この場合は、ガラス繊維から成る基材にエポキシ樹脂の前駆体を含浸させ、このエポキシ樹脂前駆体を所定の温度で熱硬化させることによって形成することができる。   Further, when the insulating substrate 2 is made of, for example, a resin, it can be formed by molding by a transfer molding method or an injection molding method using a mold that can be molded into a predetermined shape. Moreover, what impregnated resin to the base material which consists of glass fiber like glass epoxy resin, for example may be used. In this case, it can be formed by impregnating a substrate made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

この絶縁基板２において、上面または下面に導体パターンを含む導体電極３が設けられており、また電子部品が搭載される上面から下面の導体電極３にかけてビアホール導体、スルーホール導体等の貫通導体を含む配線導体が被着形成されている。導体電極３および配線導体は、絶縁基板２がセラミックスから成る場合は、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ），銅（Ｃｕ）等の金属粉末メタライズから成り、絶縁基板２用のセラミックグリーンシートに導体電極３および配線導体用の導体ペーストをスクリーン印刷法等によって所定形状で印刷して、セラミックグリーンシートと同時に焼成することによって、絶縁基板２の所定位置に形成される。内部導体のうち、セラミックグリーンシートを厚み方向に貫通する貫通導体は、導体ペーストを印刷することに
よってセラミックグリーンシートに形成した貫通孔を充填しておけばよい。このような導体ペーストは、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ），銅（Ｃｕ）等の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基板２との接合強度を高めるために、ガラス、セラミックスを含んでいても構わない。 The insulating substrate 2 is provided with a conductor electrode 3 including a conductor pattern on the upper surface or the lower surface, and includes a through-hole conductor such as a via-hole conductor or a through-hole conductor from the upper surface on which the electronic component is mounted to the lower conductor electrode 3. A wiring conductor is deposited. When the insulating substrate 2 is made of ceramic, the conductor electrode 3 and the wiring conductor are made of metal powder metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), The conductor electrode 3 and the conductor paste for the wiring conductor are printed in a predetermined shape on the ceramic green sheet for the insulating substrate 2 by screen printing or the like, and then fired at the same time as the ceramic green sheet to form the insulating substrate 2 at a predetermined position. Is done. Of the internal conductors, the through conductor that penetrates the ceramic green sheet in the thickness direction may be filled with a through hole formed in the ceramic green sheet by printing a conductor paste. Such a conductor paste can be appropriately obtained by adding an appropriate solvent and a binder to a metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), and kneading them. It is produced by adjusting to a proper viscosity. In order to increase the bonding strength with the insulating substrate 2, glass or ceramics may be included.

また、導体電極３および配線導体は、絶縁基板２が樹脂から成る場合には、銅（Ｃｕ），金（Ａｕ），アルミニウム（Ａｌ），ニッケル（Ｎｉ），クロム（Ｃｒ），モリブデン（Ｍｏ），チタン（Ｔｉ）およびそれらの合金等の金属材料から成る。例えば、ガラスエポキシ樹脂から成る樹脂シート上に配線導体の形状に加工した銅箔を転写し、銅箔が転写された樹脂シートを積層して接着剤で接着することによって形成する。樹脂シートを厚み方向に貫通する貫通導体は、導体ペーストの印刷、めっき法によって樹脂シートに形成した貫通孔の内面に被着形成するか、貫通孔を充填して形成すればよい。また、金属箔、金属柱を樹脂から成る絶縁基板２に一体化させたり、絶縁基板２にスパッタリング法，蒸着法等，めっき法等を用いて被着させたりして形成される。   The conductor electrode 3 and the wiring conductor are copper (Cu), gold (Au), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo) when the insulating substrate 2 is made of resin. , Titanium (Ti) and alloys thereof. For example, the copper foil processed into the shape of the wiring conductor is transferred onto a resin sheet made of glass epoxy resin, and the resin sheet on which the copper foil is transferred is laminated and bonded with an adhesive. The through conductor penetrating through the resin sheet in the thickness direction may be formed on the inner surface of the through hole formed in the resin sheet by conductor paste printing or plating, or may be formed by filling the through hole. Further, the metal foil and the metal pillar are formed integrally with the insulating substrate 2 made of resin, or are deposited on the insulating substrate 2 by using a sputtering method, a vapor deposition method, a plating method, or the like.

この絶縁基板２の上面または下面に設けられた導体電極３上に主導体層４が設けられている。主導体層４は、導体電極３と後述する被覆金属層５との双方に対する密着性に優れたものが好ましく、例えば銅（Ｃｕ），ニッケル（Ｎｉ），鉄（Ｆｅ）等の金属材料のうち少なくとも１つから成る。主導体層４を設ける手法としては、例えば電解めっき法や無電解めっき法などのめっき法等を用いて銅（Ｃｕ），ニッケル（Ｎｉ）等が被着され、スパッタリング法，蒸着法等を用いて銅（Ｃｕ），ニッケル（Ｎｉ），鉄（Ｆｅ）等が被着される。   A main conductor layer 4 is provided on the conductor electrode 3 provided on the upper surface or the lower surface of the insulating substrate 2. The main conductor layer 4 is preferably one having excellent adhesion to both the conductor electrode 3 and a coated metal layer 5 described later, for example, among metal materials such as copper (Cu), nickel (Ni), iron (Fe), etc. Consists of at least one. As a method of providing the main conductor layer 4, for example, copper (Cu), nickel (Ni), etc. are deposited by using a plating method such as an electrolytic plating method or an electroless plating method, and a sputtering method, a vapor deposition method, or the like is used. Copper (Cu), nickel (Ni), iron (Fe), etc. are deposited.

主導体層４上には主導体層４を覆うように被覆金属層５が設けられている。被覆金属層５は、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等の特性を高めるとともに、主導体層４の酸化腐食を抑制するものが好ましく、例えば金（Ａｕ）等の金属材料から成る。被覆金属層５を設ける手法としては、例えば、電解めっき法や無電解めっき法などのめっき法等を用いて被着させる。   A covering metal layer 5 is provided on the main conductor layer 4 so as to cover the main conductor layer 4. The covering metal layer 5 is preferably one that enhances characteristics such as flip chip mounting property, wire bonding mounting property, solder wettability and the like, and suppresses oxidative corrosion of the main conductor layer 4, and is made of a metal material such as gold (Au). Become. As a method for providing the covering metal layer 5, for example, the coating is performed by using a plating method such as an electrolytic plating method or an electroless plating method.

主導体層４は、被覆金属層５から露出された露出部４ａを有しており、露出部４ａが主導体層４の側部に位置すると後述する腐食防止層６の形成時に用いるシアン溶液が露出部４ａに接触しやすく、主導体層４の露出部４ａに腐食防止層６が形成しやすいものとなり、好ましい。   The main conductor layer 4 has an exposed portion 4a exposed from the coating metal layer 5, and when the exposed portion 4a is located on the side of the main conductor layer 4, a cyan solution used when forming a corrosion prevention layer 6 described later is formed. It is easy to contact the exposed portion 4a, and the corrosion preventing layer 6 is easily formed on the exposed portion 4a of the main conductor layer 4, which is preferable.

露出部４ａには腐食防止層６が形成されている。これらによって、被覆金属層５が主導体層４を覆うように主導体層４上に設けられて、主導体層４が被覆金属層５から露出された露出部４ａを有していても、主導体層４の露出部４ａに腐食防止層６が形成されているため、主導体層４の露出部４ａが大気中の水分等と接触し難いものとなり、主導体層４が腐食されにくくなり、被覆金属層５上に主導体層４の構成成分が付着しにくいものとなって、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等が阻害されず、導体電極３に対する電子部品の電気的および機械的な接続の信頼性が向上された配線基板１を得ることが可能となるものである。   A corrosion prevention layer 6 is formed on the exposed portion 4a. Thus, even if the covering metal layer 5 is provided on the main conductor layer 4 so as to cover the main conductor layer 4 and the main conductor layer 4 has the exposed portion 4 a exposed from the covering metal layer 5, Since the corrosion prevention layer 6 is formed on the exposed portion 4a of the body layer 4, the exposed portion 4a of the main conductor layer 4 is less likely to come into contact with moisture in the atmosphere, and the main conductor layer 4 is less likely to be corroded. The constituent components of the main conductor layer 4 are less likely to adhere to the covering metal layer 5, and the flip chip mounting property, wire bonding mounting property, solder wettability, etc. are not hindered, and the electrical components of the electronic component with respect to the conductor electrode 3 In addition, it is possible to obtain the wiring board 1 with improved mechanical connection reliability.

腐食防止層６が錯体からなると、錯体は結合力が強く、主導体層４を構成する元素のシアン化物を主成分とする錯体が主導体層４の露出部４ａに被着され、主導体層４の露出部４ａが大気中の水分等と接触するのを防止することができ、主導体層４が腐食され、溶出されにくくなり、被覆金属層５上に主導体層４の構成成分がより付着しにくいものとなって、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等がより阻害されず、導体電極３に対する電子部品の電気的および機械的な接続の信頼性がより向上された
配線基板１を得ることが可能となるものであり、好ましい。 When the corrosion prevention layer 6 is made of a complex, the complex has a strong binding force, and a complex mainly composed of cyanide of an element constituting the main conductor layer 4 is deposited on the exposed portion 4a of the main conductor layer 4, and the main conductor layer 4 can be prevented from coming into contact with moisture in the atmosphere, the main conductor layer 4 is corroded and hardly eluted, and the constituent components of the main conductor layer 4 are more formed on the coated metal layer 5. Flip chip mounting property, wire bonding mounting property, solder wettability and the like are not hindered, and the reliability of electrical and mechanical connection of the electronic component to the conductor electrode 3 is further improved. It is possible to obtain the wiring board 1 and is preferable.

また、上述の錯体が主導体層４を構成する元素のシアン化物を主成分とするものからなると、主導体層４を構成する元素のシアン化物を主成分とする錯体は結合力がより強く、主導体層４を構成する元素のシアン化物を主成分とする錯体が主導体層４の露出部４ａに強固に被着され、主導体層４の露出部４ａが大気中の水分等と接触するのを効果的に防止することができ、主導体層４がより腐食され、溶出されにくくなり、被覆金属層５上に主導体層４の構成成分が効果的に付着しにくいものとなって、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等が効果的に阻害されず、導体電極３に対する電子部品の電気的および機械的な接続の信頼性が効果的に向上された配線基板１を得ることが可能となるものであり、好ましい。この構成において、主導体層４が銅（Ｃｕ）からなる場合は腐食防止層６としてシアン化銅を主成分とする錯体を形成する。また、主導体層４がニッケル（Ｎｉ）からなる場合は腐食防止層６としてシアン化ニッケルを主成分とする錯体を形成する。また、主導体層４が鉄（Ｆｅ）からなる場合は腐食防止層６としてシアン化鉄を主成分とする錯体を形成する。   Further, when the above-described complex is composed mainly of the cyanide of the element constituting the main conductor layer 4, the complex mainly composed of the cyanide of the element constituting the main conductor layer 4 has a stronger binding force, A complex mainly composed of cyanide of the element constituting the main conductor layer 4 is firmly attached to the exposed portion 4a of the main conductor layer 4, and the exposed portion 4a of the main conductor layer 4 is in contact with moisture in the atmosphere. The main conductor layer 4 is more corroded and less likely to be eluted, and the constituent components of the main conductor layer 4 are less likely to adhere effectively on the coated metal layer 5, Flip chip mounting property, wire bonding mounting property, solder wettability and the like are not effectively hindered, and the wiring substrate 1 in which the reliability of electrical and mechanical connection of the electronic component to the conductor electrode 3 is effectively improved It is possible to get and preferred . In this configuration, when the main conductor layer 4 is made of copper (Cu), a complex mainly composed of copper cyanide is formed as the corrosion prevention layer 6. When the main conductor layer 4 is made of nickel (Ni), a complex mainly composed of nickel cyanide is formed as the corrosion preventing layer 6. When the main conductor layer 4 is made of iron (Fe), a complex mainly composed of iron cyanide is formed as the corrosion prevention layer 6.

また、上記構成において、図２に示されているように、主導体層４が導体電極３上に導体電極３を覆うように設けられている場合には、導体電極３が主導体層４から露出しにくく、導体電極３が大気中の水分等と接触しにくいものとなり、導体電極３が酸化したり、導体電極３が腐食するのを防ぐことが可能となり、好ましい。   In the above configuration, as shown in FIG. 2, when the main conductor layer 4 is provided on the conductor electrode 3 so as to cover the conductor electrode 3, the conductor electrode 3 extends from the main conductor layer 4. This is preferable because it is difficult to expose and the conductor electrode 3 is less likely to come into contact with moisture or the like in the atmosphere, and the conductor electrode 3 can be prevented from being oxidized or corroded.

また、導体電極３と主導体層４とが同じ材料からなり、銅（Ｃｕ），ニッケル（Ｎｉ），鉄（Ｆｅ）等の金属材料のうち少なくとも１つから成る場合には、導体電極３が主導体層４から露出されていても、腐食防止層６を主導体層４の露出部４ａに形成する際に、導体電極３の主導体層４から露出されている箇所にも腐食防止層６を容易に形成することが可能となり、主導体層４の露出部４ａから導体電極３の主導体層４から露出されている箇所にわたって腐食防止層６が形成されることとなり、主導体層４の露出部４ａと導体電極３の主導体層４から露出されている箇所とを大気中の水分等と接触し難いものとなり、主導体層４と導体電極３の主導体層４から露出されている箇所とが腐食するのを効率的に防ぐことが可能となり、好ましい。   When the conductor electrode 3 and the main conductor layer 4 are made of the same material and are made of at least one of metal materials such as copper (Cu), nickel (Ni), iron (Fe), the conductor electrode 3 is Even when exposed from the main conductor layer 4, when the corrosion prevention layer 6 is formed on the exposed portion 4 a of the main conductor layer 4, the portion of the conductor electrode 3 exposed from the main conductor layer 4 is also exposed to the corrosion prevention layer 6. Thus, the corrosion prevention layer 6 is formed from the exposed portion 4a of the main conductor layer 4 to the portion exposed from the main conductor layer 4 of the conductor electrode 3, so that the main conductor layer 4 can be formed. The exposed portion 4a and the portion of the conductor electrode 3 exposed from the main conductor layer 4 are difficult to come into contact with moisture in the atmosphere, and are exposed from the main conductor layer 4 and the main conductor layer 4 of the conductor electrode 3. It is possible to efficiently prevent corrosion of the location, which is preferable

次に、本実施形態の配線基板１の製造方法について説明する。   Next, the manufacturing method of the wiring board 1 of this embodiment is demonstrated.

絶縁基板２は、例えば酸化アルミニウム（Ａｌ２Ｏ３）質焼結体からなり、上面または下面に導体パターンを含む導体電極３が設けられている。この絶縁基板２は、主成分が酸化アルミニウム（Ａｌ２Ｏ３）である酸化アルミニウム質焼結体から成る場合、Ａｌ２Ｏ３の粉末に焼結助材としてシリカ（ＳｉＯ２），マグネシア（ＭｇＯ）またはカルシア（ＣａＯ）等の粉末を添加し、さらに適当なバインダー、溶剤および可塑剤を添加し、次にこれらの混合物を混錬してスラリー状となす。その後、従来周知のドクターブレード法等の成形方法によって多数個取り用のセラミックグリーンシートを得る。 The insulating substrate 2 is made of, for example, an aluminum oxide (Al 2 O 3 ) -based sintered body, and a conductor electrode 3 including a conductor pattern is provided on the upper surface or the lower surface. When the insulating substrate 2 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al 2 O 3 ), silica (SiO 2 ), magnesia (MgO) is used as a sintering aid for the Al 2 O 3 powder. ) Or calcia (CaO) or the like, and further an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for obtaining a large number of pieces is obtained by a conventionally known molding method such as a doctor blade method.

このセラミックグリーンシートを用いて、以下の（１）〜（５）の工程により配線基板１が作製される。   Using this ceramic green sheet, the wiring substrate 1 is manufactured by the following steps (1) to (5).

（１）ビアホール導体またはスルーホール導体等の貫通導体となる部位の打ち抜き金型またはレーザーを用いた打ち抜き工程。   (1) A punching process using a punching die or a laser at a portion to be a through conductor such as a via-hole conductor or a through-hole conductor.

（２）絶縁基板２の上面および下面となる部位に形成される導体電極３、また絶縁基板２の上面から絶縁基板２内部、下面となる部位にかけてビアホール導体またはスルーホール導体等の貫通導体を含む配線導体をそれぞれ形成するための金属ペーストの印刷塗布工
程。 (2) Including a conductor electrode 3 formed on the upper and lower portions of the insulating substrate 2 and a through-hole conductor such as a via-hole conductor or a through-hole conductor from the upper surface of the insulating substrate 2 to the inside of the insulating substrate 2 and the lower surface. Metal paste printing application process for forming each wiring conductor.

（３）各絶縁層となるセラミックグリーンシートを積層してセラミックグリーンシート積層体を作製する工程。   (3) The process of producing the ceramic green sheet laminated body by laminating | stacking the ceramic green sheet used as each insulating layer.

（４）このセラミックグリーンシート積層体を焼成して、各上面、下面を有し、導体電極３が設けられた絶縁基板２が複数配列された多数個取り基板を得る工程。   (4) A step of firing this ceramic green sheet laminate to obtain a multi-piece substrate having a plurality of insulating substrates 2 each having an upper surface and a lower surface and provided with conductor electrodes 3.

（５）焼成して得られた多数個取り基板に配線基板１の外縁となる箇所に沿って分割溝を形成しておき、この分割溝に沿って破断させて分割する方法、またはスライシング法等により配線基板１の外縁となる箇所に沿って切断する方法等を用いることができる。なお、分割溝は、焼成後にスライシング装置により多数個取り基板の厚みより小さく切り込むことによって形成することができるが、多数個取り基板用のセラミックグリーンシート積層体にカッター刃を押し当てたり、スライシング装置により生成形体の厚みより小さく切り込んだりすることによって形成してもよい。   (5) A method in which a dividing groove is formed along a portion serving as the outer edge of the wiring substrate 1 on the multi-piece substrate obtained by firing, and a method of dividing by dividing along the dividing groove, a slicing method, or the like Thus, it is possible to use a method of cutting along a portion that becomes the outer edge of the wiring board 1. The dividing groove can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-piece substrate after firing, but the cutter blade can be pressed against the ceramic green sheet laminate for the multi-piece substrate, or the slicing device May be formed by cutting smaller than the thickness of the generated shape.

また、絶縁基板２の上面または下面に設けられた導体電極３を、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等の特性を高めるとともに主導体層４の酸化腐食を抑制するために、導体電極３に厚さ０．５〜１０μｍの主導体層４となる銅（Ｃｕ）めっき層を被着させ、この銅（Ｃｕ）めっき層を覆うように被覆金属層５となる厚さ０．５〜３μｍの金（Ａｕ）めっき層を順次被着させる。   In addition, in order to improve the characteristics such as flip chip mounting property, wire bonding mounting property, solder wettability and the like, and to suppress the oxidative corrosion of the main conductor layer 4, the conductive electrode 3 provided on the upper surface or the lower surface of the insulating substrate 2 is used. A copper (Cu) plating layer to be the main conductor layer 4 having a thickness of 0.5 to 10 μm is deposited on the conductor electrode 3, and the thickness of the covering metal layer 5 is 0.1 to cover the copper (Cu) plating layer. A gold (Au) plating layer of 5 to 3 μm is sequentially deposited.

また、シアン化カリウム溶液等のシアン溶液に銅（Ｃｕ）めっき層、金（Ａｕ）めっき層を被着させた絶縁基板２を浸漬して、シアン溶液のシアンと金（Ａｕ）めっき層から露出された銅（Ｃｕ）めっき層の露出部４ａの銅（Ｃｕ）とが結合し、金（Ａｕ）めっき層から露出された銅（Ｃｕ）めっき層の露出部４ａに腐食防止層６となるシアン化銅を主成分とする錯体を形成する。なお、主導体層４としてニッケル（Ｎｉ）層を被着させる場合は、同様に絶縁基板２を浸漬して、シアン溶液のシアンと金（Ａｕ）層から露出されたニッケル（Ｎｉ）層の露出部４ａのニッケル（Ｎｉ）とが結合し、金（Ａｕ）層から露出されたニッケル（Ｎｉ）層の露出部４ａに腐食防止層６となるシアン化ニッケルを主成分とする錯体を形成する。また、主導体層４として鉄（Ｆｅ）層を被着させる場合は、同様に絶縁基板２を浸漬して、シアン溶液のシアンと金（Ａｕ）層から露出された鉄（Ｆｅ）層の露出部４ａの鉄（Ｆｅ）とが結合し、金（Ａｕ）層から露出された鉄（Ｆｅ）層の露出部４ａに腐食防止層６となるシアン化鉄を主成分とする錯体を形成する。   Further, the insulating substrate 2 having a copper (Cu) plating layer and a gold (Au) plating layer deposited thereon was immersed in a cyan solution such as a potassium cyanide solution, and exposed from the cyan and gold (Au) plating layers of the cyan solution. Copper cyanide which is bonded to copper (Cu) in the exposed portion 4a of the copper (Cu) plating layer and becomes the corrosion prevention layer 6 on the exposed portion 4a of the copper (Cu) plating layer exposed from the gold (Au) plating layer Is formed as a main component. In the case of depositing a nickel (Ni) layer as the main conductor layer 4, the insulating substrate 2 is similarly immersed to expose the nickel (Ni) layer exposed from the cyan and gold (Au) layers of the cyan solution. The nickel (Ni) of the portion 4a is bonded to form a complex containing nickel cyanide as a main component to be the corrosion preventing layer 6 on the exposed portion 4a of the nickel (Ni) layer exposed from the gold (Au) layer. Further, when an iron (Fe) layer is deposited as the main conductor layer 4, the insulating substrate 2 is similarly immersed to expose the iron (Fe) layer exposed from the cyan and gold (Au) layers of the cyan solution. The iron (Fe) of the part 4a is bonded to form a complex containing iron cyanide as a main component as the corrosion prevention layer 6 on the exposed part 4a of the iron (Fe) layer exposed from the gold (Au) layer.

このようにして形成された配線基板１に電子部品を搭載する。配線基板１の上面に電子部品を搭載した電子装置を外部回路基板に実装することで、配線基板１に搭載した電子部品が導体電極３、配線導体を介して外部回路基板に電気的に接続される。なお、電子部品は例えば、半導体素子、ＣＣＤ型電子素子またはＣＭＯＳ型撮像素子、ＬＥＤ等の発光素子、チップコンデンサ、チップコイル、抵抗素子および振動子等である。電子部品は、配線基板１の導体電極３とフリップチップ実装、ワイヤーボンディング実装、はんだ等によるろう付けを行い、電子部品の各電極が金バンプ、はんだ等またはボンディングワイヤーにより電気的に接続される。なお、電子部品の各電極と複数の導体電極３との電気的な接続に、上述の金バンプまたははんだを用いる代わりに導電性樹脂（異方性導電樹脂等）から成る接続部材を用いてもよい。   Electronic components are mounted on the wiring board 1 formed in this way. By mounting an electronic device having electronic parts mounted on the upper surface of the wiring board 1 on the external circuit board, the electronic parts mounted on the wiring board 1 are electrically connected to the external circuit board via the conductor electrode 3 and the wiring conductor. The The electronic component is, for example, a semiconductor element, a CCD type electronic element or a CMOS type imaging element, a light emitting element such as an LED, a chip capacitor, a chip coil, a resistance element, and a vibrator. The electronic component is soldered to the conductor electrode 3 of the wiring substrate 1 by flip chip mounting, wire bonding mounting, solder, or the like, and each electrode of the electronic component is electrically connected by gold bumps, solder, or the like or a bonding wire. In addition, instead of using the above-mentioned gold bump or solder, a connecting member made of conductive resin (anisotropic conductive resin or the like) may be used for electrical connection between each electrode of the electronic component and the plurality of conductor electrodes 3. Good.

本実施形態の配線基板１は、主導体層４が被覆金属層５から露出された露出部４ａを有しており、露出部４ａには腐食防止層６が形成されている。これらによって、被覆金属層５が主導体層４を覆うように主導体層４上に設けられて、主導体層４が被覆金属層５から露出された露出部４ａを有していても、主導体層４の露出部４ａに腐食防止層６が形成さ
れているため、主導体層４の露出部４ａが大気中の水分等と接触し難いものとなり、主導体層４が腐食されにくくなり、被覆金属層５上に主導体層４の構成成分が付着しにくいものとなって、フリップチップ実装性、ワイヤボンディング実装性、はんだ濡れ性等が阻害されず、導体電極３に対する電子部品の電気的および機械的な接続の信頼性が向上された配線基板１を得ることが可能となるものである。 The wiring board 1 of the present embodiment has an exposed portion 4a in which the main conductor layer 4 is exposed from the coating metal layer 5, and a corrosion prevention layer 6 is formed on the exposed portion 4a. Thus, even if the covering metal layer 5 is provided on the main conductor layer 4 so as to cover the main conductor layer 4 and the main conductor layer 4 has the exposed portion 4 a exposed from the covering metal layer 5, Since the corrosion prevention layer 6 is formed on the exposed portion 4a of the body layer 4, the exposed portion 4a of the main conductor layer 4 is less likely to come into contact with moisture in the atmosphere, and the main conductor layer 4 is less likely to be corroded. The constituent components of the main conductor layer 4 are less likely to adhere to the covering metal layer 5, and the flip chip mounting property, wire bonding mounting property, solder wettability, etc. are not hindered, and the electrical components of the electronic component with respect to the conductor electrode 3 In addition, it is possible to obtain the wiring board 1 with improved mechanical connection reliability.

本実施形態の電子装置は、上記構成の配線基板１を備えていることによって、実装信頼性に関して向上されている。   The electronic device of this embodiment is improved in terms of mounting reliability by including the wiring board 1 having the above-described configuration.

１・・・・・配線基板
２・・・・・絶縁基板
３・・・・・導体電極
４・・・・・主導体層
４ａ・・・・露出部
５・・・・・被覆金属層
６・・・・・腐食防止層 DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Insulating board 3 ... Conductor electrode 4 ... Main conductor layer 4a ... Exposed part 5 ... Coated metal layer 6 ... Corrosion prevention layer

Claims (7)

絶縁基板と、
前記絶縁基板上に設けられた導体電極と、
前記導体電極上に設けられた主導体層と、
前記主導体層を覆うように該主導体層上に設けられた被覆金属層と、
前記主導体層が前記被覆金属層から露出された露出部を有しており、前記露出部に形成された腐食防止層とを備えていることを特徴とする配線基板。 An insulating substrate;
A conductor electrode provided on the insulating substrate;
A main conductor layer provided on the conductor electrode;
A coated metal layer provided on the main conductor layer so as to cover the main conductor layer;
The wiring board, wherein the main conductor layer has an exposed portion exposed from the coated metal layer, and includes a corrosion prevention layer formed on the exposed portion. 前記腐食防止層は、錯体からなることを特徴とする請求項１記載の配線基板。   The wiring board according to claim 1, wherein the corrosion prevention layer is made of a complex. 前記錯体は、前記主導体層を構成する元素のシアン化物を主成分とすることを特徴とする請求項２記載の配線基板。   3. The wiring board according to claim 2, wherein the complex is mainly composed of cyanide of an element constituting the main conductor layer. 前記主導体層は、銅、ニッケル、鉄のうち少なくとも１つからなることを特徴とする請求項１記載の配線基板。   The wiring board according to claim 1, wherein the main conductor layer is made of at least one of copper, nickel, and iron. 前記被覆金属層は、金からなることを特徴とする請求項１記載の配線基板。   The wiring board according to claim 1, wherein the covering metal layer is made of gold. 前記露出部は、前記主導体層の側部に位置することを特徴とする請求項１記載の配線基板。   The wiring board according to claim 1, wherein the exposed portion is located on a side portion of the main conductor layer. 請求項１に記載された配線基板と、該配線基板に搭載された電子部品とを備えていることを特徴とする電子装置。   An electronic device comprising: the wiring board according to claim 1; and an electronic component mounted on the wiring board.
JP2012212560A 2012-09-26 2012-09-26 Wiring board and electronic device Active JP5970317B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202386A (en) * 1993-06-30 1995-08-04 Hideaki Yamaguchi Metal surface protective agent and surface treatment method
JP2804452B2 (en) * 1995-03-24 1998-09-24 日鉱金属株式会社 Sealing treatment method for gold plated material
JP2009117542A (en) * 2007-11-05 2009-05-28 Panasonic Electric Works Co Ltd Circuit board and manufacturing method of the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202386A (en) * 1993-06-30 1995-08-04 Hideaki Yamaguchi Metal surface protective agent and surface treatment method
JP2804452B2 (en) * 1995-03-24 1998-09-24 日鉱金属株式会社 Sealing treatment method for gold plated material
JP2009117542A (en) * 2007-11-05 2009-05-28 Panasonic Electric Works Co Ltd Circuit board and manufacturing method of the same

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