JP2014063801A5 - - Google Patents
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- Publication number
- JP2014063801A5 JP2014063801A5 JP2012206743A JP2012206743A JP2014063801A5 JP 2014063801 A5 JP2014063801 A5 JP 2014063801A5 JP 2012206743 A JP2012206743 A JP 2012206743A JP 2012206743 A JP2012206743 A JP 2012206743A JP 2014063801 A5 JP2014063801 A5 JP 2014063801A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- wiring
- layer
- via hole
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000007788 roughening Methods 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012206743A JP6057641B2 (ja) | 2012-09-20 | 2012-09-20 | 配線基板及びその製造方法 |
| US14/021,110 US9137896B2 (en) | 2012-09-20 | 2013-09-09 | Wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012206743A JP6057641B2 (ja) | 2012-09-20 | 2012-09-20 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014063801A JP2014063801A (ja) | 2014-04-10 |
| JP2014063801A5 true JP2014063801A5 (cg-RX-API-DMAC7.html) | 2015-10-01 |
| JP6057641B2 JP6057641B2 (ja) | 2017-01-11 |
Family
ID=50273291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012206743A Active JP6057641B2 (ja) | 2012-09-20 | 2012-09-20 | 配線基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9137896B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6057641B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9087777B2 (en) * | 2013-03-14 | 2015-07-21 | United Test And Assembly Center Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
| JP6075789B2 (ja) * | 2014-01-31 | 2017-02-08 | 京セラ株式会社 | 配線基板の製造方法 |
| JP6550260B2 (ja) * | 2015-04-28 | 2019-07-24 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| JP7063101B2 (ja) * | 2018-05-11 | 2022-05-09 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
| JP7715590B2 (ja) | 2021-09-27 | 2025-07-30 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| JP7715010B2 (ja) | 2021-11-02 | 2025-07-30 | 新光電気工業株式会社 | 配線基板及びその製造方法、半導体装置 |
| KR20230097817A (ko) * | 2021-12-24 | 2023-07-03 | 삼성전기주식회사 | 인쇄회로기판, 캐리어 부착 인쇄회로기판 및 인쇄회로기판 패키지의 제조방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3913966B4 (de) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung |
| EP0620703B1 (en) * | 1993-04-12 | 1997-12-29 | Ibiden Co, Ltd. | Resin compositions and printed circuit boards using the same |
| JP4012307B2 (ja) | 1998-04-02 | 2007-11-21 | イビデン株式会社 | 多層プリント配線板の製造方法 |
| JP3527694B2 (ja) * | 2000-08-11 | 2004-05-17 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP2007073834A (ja) * | 2005-09-08 | 2007-03-22 | Shinko Electric Ind Co Ltd | 絶縁樹脂層上の配線形成方法 |
| EP1850648A4 (en) * | 2005-11-02 | 2011-03-30 | Ibiden Co Ltd | Multilayer printed circuit board for a semiconductor device and manufacturing method therefor |
| WO2007059152A1 (en) * | 2005-11-14 | 2007-05-24 | World Properties, Inc. | Circuit material, multi-layer circuits, and methods of manufacture thereof |
| JP4895795B2 (ja) | 2006-12-20 | 2012-03-14 | 新光電気工業株式会社 | 多層配線基板の製造方法 |
| JP5092547B2 (ja) * | 2007-05-30 | 2012-12-05 | 凸版印刷株式会社 | 印刷配線板の製造方法 |
| JP5092662B2 (ja) | 2007-10-03 | 2012-12-05 | 凸版印刷株式会社 | 印刷配線板の製造方法 |
| DE112009000839T5 (de) * | 2008-04-10 | 2011-05-12 | World Properties, Inc., Lincolnwood | Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel |
| JP5322531B2 (ja) * | 2008-05-27 | 2013-10-23 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP5251464B2 (ja) * | 2008-12-03 | 2013-07-31 | 日立化成株式会社 | 配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法 |
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2012
- 2012-09-20 JP JP2012206743A patent/JP6057641B2/ja active Active
-
2013
- 2013-09-09 US US14/021,110 patent/US9137896B2/en active Active