JP2014044310A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress deformation of an imaging part when external force is added to an imaging device and deformation by temperature change caused by heat generation inside the imaging device.SOLUTION: The imaging part includes: an imaging element 119 where an optical image from an imaging lens unit is formed; a lens mount part 101 which is disposed on a front side close to the imaging lens unit than the imaging element and which mounts the imaging lens unit; and an imaging element holding member 122 which holds the imaging element as well holds the lens mount part. Imaging part mounting members 133a, 133b are used to fix the imaging part to an imaging device chassis 129. The imaging element holding member and the imaging device chassis are fixed to a plane parallel to the lens mount surface of the lens mount part by the imaging part mounting members.

Description

  The present invention relates to an imaging apparatus in which a photographic lens unit can be replaced, and more particularly, to an image sensor holding structure provided in the imaging apparatus.

  In general, an imaging device such as a digital camera in which a photographic lens unit (hereinafter simply referred to as a photographic lens or a lens) can be replaced includes an imaging element such as a CCD or CMOS sensor, an imaging element holding member that holds the imaging element, and a lens. It has an imaging part provided with a mount part. This imaging part is an important part for determining the distance from the lens mounting surface of the lens mount part to the light receiving surface of the imaging element, that is, the flange back.

  For this reason, when a deformation | transformation arises in an imaging part, the shift | offset | difference of a flange back will generate | occur | produce and the performance of an imaging device will fall as a result. In order to prevent such deformation of the imaging unit, in particular, to prevent the imaging unit from being deformed by an external force applied to the lens, the fixation between the imaging unit and the imaging apparatus body (that is, the imaging apparatus housing) is firmly fixed. Like to do.

  For example, an image sensor unit having an image sensor and an image sensor holding plate and a main chassis are attached to a connection box having a lens mount. In addition, there is a structure in which the vicinity of the lens mount portion in the connection box and the main chassis are fastened by a connection member to suppress a change in flange back due to an external force applied to the lens (see Patent Document 1).

  Furthermore, there is one in which a plurality of constituent units and an imaging unit are integrally coupled to suppress deformation of the imaging unit due to an external force applied to the lens (see Patent Document 2).

JP 2004-104168 A JP 2010-243634 A

  By the way, with the diversification of the functions of the imaging device, the amount of heat generated by the circuit board arranged inside the imaging device is increasing. For this reason, it is necessary to consider the heat dissipation structure also in the imaging device. In many cases, the connection box described in Patent Document 1 is a die-cast component using aluminum and magnesium in order to obtain a generally strong structure.

  However, die-cast parts using aluminum and magnesium have high thermal conductivity, and if a material with high thermal conductivity is used for the main chassis and connecting member, unnecessary heat is generated from the main chassis and connecting member fastened to the connecting box. Is likely to be transmitted to the imaging unit.

  When heat is transferred from the circuit board or the like to the connection box and the temperature rises, the connection box is extended due to thermal expansion, and the distance between the fastened lens mount portion and the imaging element is changed. That is, the flange back is displaced due to thermal expansion, and the performance of the imaging apparatus is degraded.

  On the other hand, in the structure described in Patent Document 2, when an external force is applied to the lens, the deformation of the imaging unit is suppressed by the strength of each unit coupled together, but the external force applied to the imaging device housing Affects the imaging unit, and as a result, the imaging unit is deformed.

  Accordingly, an object of the present invention is to provide an imaging device capable of suppressing the deformation of the imaging unit due to a temperature change caused by heat generation inside the imaging device, in particular, the influence of the imaging unit due to an external force applied to the imaging device. There is to do.

  In order to achieve the above object, an imaging apparatus according to the present invention is an imaging apparatus in which a photographic lens unit can be replaced, and an imaging element that forms an optical image from the photographic lens unit, An imaging unit including a lens mount unit disposed on a front surface side that is the side of the imaging lens unit and to which the imaging lens unit is attached; and an imaging device holding member that holds the imaging device and holds the lens mounting unit; An imaging unit mounting member for fixing the imaging unit to a housing of the imaging device, and the imaging element holding member and the housing of the imaging unit are arranged on the lens of the lens mount unit by the imaging unit mounting member. It is fixed in a plane parallel to the mounting surface.

  According to the present invention, since the imaging unit is fixed to the housing by the imaging unit mounting member on one surface parallel to the lens mounting surface of the lens mount unit, even if an external force is applied to the imaging device, the imaging unit is attached by the external force. The force transmitted to the imaging unit can be reduced by deforming the member. As a result, it is possible to reduce the influence of the imaging unit due to the external force applied to the imaging device.

1 is a perspective view showing an external appearance of an imaging apparatus according to a first embodiment of the present invention from the front side. It is a perspective view which shows the external appearance of the imaging device by the 1st Embodiment of this invention from the back side. It is a perspective view which shows the state which rotated the screen display part shown in FIG. 2, and showed the inner side. It is a perspective view which shows the state which mounted | wore the lens mount part shown in FIG. 1 with the imaging lens. It is a front view which shows the internal structure of the imaging device shown in FIG. It is sectional drawing along the AA line of FIG. It is a perspective view which decomposes | disassembles and shows the internal structure of the imaging device shown in FIG. It is a perspective view which decomposes | disassembles and shows the imaging part in the imaging device by the 2nd Embodiment of this invention. It is a disassembled perspective view of an example of the imaging unit holding structure used in the imaging apparatus according to the second embodiment of the present invention. It is a perspective view which shows the external appearance of the imaging part holding structure shown in FIG. It is a figure for demonstrating typically the effect | action of the force in the conventional imaging part support structure. It is a figure for demonstrating typically the effect | action of the force in the imaging part support structure demonstrated in FIG. It is sectional drawing which shows roughly an example of the imaging part holding structure used with the imaging device by the 2nd Embodiment of this invention. It is sectional drawing which shows roughly the other example of the imaging part holding structure used with the imaging device by the 2nd Embodiment of this invention.

  Hereinafter, an example of an imaging apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view showing the external appearance of the imaging apparatus according to the first embodiment of the present invention from the front side. FIG. 2 is a perspective view showing the appearance of the imaging apparatus according to the first embodiment of the present invention from the back side. The illustrated imaging apparatus is, for example, a digital camera in which a photographic lens unit (hereinafter simply referred to as a photographic lens) can be replaced, and FIGS. 1 and 2 are perspective views in a state in which the photographic lens is not attached. .

  Referring to FIGS. 1 and 2, in the imaging apparatus 1, the front side of the lens mount unit 101, the lens contact unit 102 for detecting the mounting of the photographing lens and performing electrical control, and the photographing lens are removed. A lens removal button 103 and a REC / PAUSE (recording / pause) button 104 are disposed.

  When the imaging device 1 is viewed from the front side, an operation button group 105, a power switch 106, and an ND dial unit 107 are arranged on the right side of the imaging device 1 for causing the imaging device to execute a predetermined operation in accordance with a photographer's operation. In addition, an exhaust port 108 is formed.

  The ND dial unit 107 is for selecting several types of ND filters arranged on the front surface of the image sensor inside the image pickup apparatus. The exhaust port 108 is for exhausting exhaust gas by a fan for radiating heat inside the image pickup apparatus.

  An accessory shoe 109 for attaching / detaching the handle portion 2 to / from the imaging device 1 is provided on the upper side of the imaging device 1.

  On the back side of the imaging apparatus 1, a screen display unit 110, a hinge unit 111, a viewfinder unit 112, a battery chamber 113, and an input / output terminal group 114 are provided. The screen display unit 110 displays the control state and video of the imaging device 1, and the photographer can check the control state and video by looking at the screen display unit 110. The screen display unit 110 is supported by the hinge unit 111 so as to be openable and closable and rotatable.

  The photographer can look into the viewfinder unit 112 and check the control state and video of the imaging apparatus 1. The battery chamber 113 stores a battery that is a power source of the imaging apparatus 1, and the input / output terminal group 114 is connected to, for example, an external device and a microphone / headphone.

  FIG. 3 is a perspective view showing a state in which the screen display unit 110 shown in FIG.

  When the screen display unit 110 is rotated around the hinge unit 111, the inside thereof is exposed. On the inner side, a recording medium mounting unit 115 and an operation button group 116 for performing a reproduction operation of the photographed image (video) are arranged.

  A screw part 117 for attaching / detaching the grip part 3 to / from the imaging apparatus 1 is formed on the right side when the imaging apparatus 1 is viewed from the back side, and for sucking outside air by a fan arranged inside the imaging apparatus 1. An intake port 118 is formed.

  A microphone unit 201 for collecting sound (sound) is disposed on the distal end side of the handle unit 2. When the handle portion 2 is viewed from the front end side, a voice button group 202 for adjusting the amplitude (that is, the magnitude) of the voice signal is arranged on the right side surface thereof.

  In addition, a REC / PAUSE button 203, an external accessory shoe 204, and a screw portion 205 are disposed on the upper side of the handle portion 2. The external accessory shoe 204 is for mounting an external accessory such as a video light.

  An accessory shoe foot (not shown) that fits into the accessory shoe 109 of the imaging device 1 is formed on the lower surface of the rear end of the handle portion 2, and the handle portion 2 is attached to the imaging device 1 by this foot. . Further, the handle portion 2 is provided with a dial screw portion 206, and the handle portion 2 is fixed to the imaging device 1 when the dial screw portion 206 is fitted to a screw portion (not shown) provided in the imaging device 1. Is done.

  Note that the dial screw portion 206 is biased vertically upward by an elastic member (not shown) such as a coil spring, whereby the handle portion 2 can be fixed to the imaging device 1.

  An external microphone connector 208 to which an external microphone is attached is provided on the right side as viewed from the back side of the handle portion 2. Further, an external microphone holder 209 that holds an external microphone (not shown) is provided on the right side of the front end of the handle portion 2.

  Note that the imaging device 1 and the handle unit 2 are connected by a signal cable (signal line) 207, and the handle unit 2 transmits and receives control signals and audio signals to and from the imaging device 1 through the signal line 207.

  As shown in the figure, the grip unit 3 includes a REC / PAUSE button 301, a diaphragm dial 302 for adjusting the lens diaphragm, a cross key 303, and a grip belt 304. The grip belt 304 is used as an assist when the photographer grips the grip 3.

  FIG. 4 is a perspective view showing a state in which the photographing lens is mounted on the lens mount unit 101 shown in FIG.

  A photographing lens 4 corresponding to the lens mount unit 101 is attached to the imaging device 1. When the photographic lens 4 is attached to the lens mount unit 101, the photographic lens 4 and the imaging device 1 are electrically connected via the lens contact unit 102, and the photographic lens 4 is operated by operating the operation button group 105 or the aperture dial 302. Control can be performed.

  FIG. 5 is a front view showing the internal structure of the imaging apparatus 1 shown in FIG. FIG. 6 is a sectional view taken along the line AA in FIG. 7 is an exploded perspective view showing the internal structure of the image pickup apparatus 1 shown in FIG.

  An imaging element 119 is disposed inside the imaging apparatus 1, and the imaging element 119 is located behind the lens mount unit 101 on the optical axis. An optical image (subject image) is formed on the image sensor 119 via the photographing lens 4, and the image sensor 119 outputs an electrical signal (analog signal) corresponding to the optical image.

  A sensor substrate 120 is disposed on the back side of the image sensor 119, and an electric element for driving the image sensor 119 is mounted on the sensor substrate 120. The image sensor 119 is bonded to the sensor substrate 120 by soldering.

  The sensor substrate 120 is fixed to the sensor holding plate 121 with an adhesive on the back side of the image sensor 119. Then, the image sensor 119, the sensor substrate 120, and the sensor holding plate 121 integrated by soldering are fixed to the arm portion 122 a of the image sensor holding member 122 with a screw 123.

  The screw 123 fixes the sensor holding plate 121 at three points with the optical axis as the center so as to form a plane parallel to the lens mount unit 101 screwed to the front surface side of the image sensor holding member 122. With this configuration, the distance from the mount surface of the lens mount unit 101 to the light receiving surface of the image sensor 119, that is, the flange back is determined.

  The imaging element holding member 122 is desirably a die-cast component that is formed of a metal material such as magnesium, for example. If it is a die-cast part, the image sensor holding member 122 can be easily processed such as a tap portion, and has a high thermal conductivity and can be electrically connected with respect to electrical grounding.

  Further, on the front side of the image sensor 119, an ND unit 124 incorporating several types of ND filters is arranged, and as described above, by rotating the ND dial unit 107, several types of NDs positioned on the front surface of the image sensor 119 are arranged. One of the filters can be selected.

  A circuit board 125 that controls the imaging device when the imaging device 1 is operated is disposed on the inner rear surface side of the imaging device 1. The circuit board 125 is disposed on the rear side of the image sensor 119 and controls a variety of functions in the image pickup apparatus 1 and is a large heat source that consumes a large amount of power.

  If the temperature of the circuit board 125 is equal to or higher than a predetermined temperature, the imaging device 1 may not operate normally because the temperature exceeds the operation guarantee temperature of the electric elements mounted on the circuit board 125. For this reason, it is necessary to radiate the heat generated in the circuit board 125.

  In the illustrated example, the heat generation on the front side of the circuit board 125 is radiated by forced air cooling (forced exhaustion). For forced air cooling, a duct portion 126 for performing intake and exhaust is disposed on the front side of the circuit board 125, and a fan 127 is disposed on the front surface of the duct portion 126 so as to overlap each other when viewed from the optical axis direction.

  The duct 126 is formed by, for example, aluminum die casting, and also serves as a heat sink that dissipates heat generated by the circuit board 125 that serves as a heat source. In the example shown in the figure, the fan 127 is a centrifugal fan, and sucks air from a surface perpendicular to the rotation axis and blows out (blows) air to the side surface. That is, the heat generated in the circuit board 125 is transferred to the duct portion 126, and the air in the duct 126 warmed by driving the fan 127 is sucked (that is, outside air is sucked into the imaging device 1 from the air inlet 118), and the air outlet The air is exhausted from the imaging apparatus 1 through 108. When the fan 127 is driven by this flow, the warm air inside is discharged outside (forced air cooling).

  On the other hand, the heat generation on the rear surface side of the circuit board 125 is dissipated by heat conduction. Here, a heat radiating plate (heat radiating member) 128 is disposed on the rear surface of the circuit board 125, and the heat radiating plate 128 is made of a material having high thermal conductivity such as aluminum or copper. Then, heat from the rear side of the circuit board 125 is transmitted to the heat radiating plate 128.

  The heat radiating plate 128 is connected to the main body housing (imaging device housing) 129 by screws 130. As a result, the heat conducted to the heat radiating plate 128 is transmitted to the imaging device casing 129 and diffused naturally. Note that the imaging device housing 129 is formed by, for example, magnesium die casting.

  Since the imaging device housing 129 is formed by magnesium die casting, the imaging device housing 129 has high strength, so that it not only dissipates heat but also has a strong skeleton of the imaging device 1. The imaging device housing 129 substantially covers the internal configuration (structure) of the imaging device 1 and includes a tap portion on each surface for fastening an exterior cover. Further, a strap belt ring 131 that requires strength, a mounting screw portion 132 of the handle dial screw 207, and the like are also screw-fixed to the imaging device housing 129.

  The imaging unit mounting members 133 a and 133 b are fixed to the imaging device housing 129 by screws 134, and the imaging unit mounting members 133 a and 133 b are fixed to the imaging element holding member 122 by screws 135. That is, the imaging element holding member 122 is fixed to the imaging device housing 129 via the imaging unit mounting members 133a and 133b.

  The imaging unit mounting members 133 a and 133 b are arranged in a substantially circular shape around the lens mount unit 101. The imaging device housing 129 and the imaging element holding member 122 are arranged substantially concentrically in the vicinity of the imaging unit mounting members 133a and 133b.

  The screws 134 for fixing the imaging unit mounting members 133a and 133b to the imaging device housing 129 and the screws 135 for fixing the imaging unit holding member 122 are positioned in the vicinity of each other in the radial direction of the concentric circles described above. The imaging unit mounting members 133a and 133b and the imaging device housing 129 are screw-fixed at three positions, and similarly, the imaging unit mounting members 133a and 133b and the imaging element holding member 122 are screw-fixed at three positions.

  In the illustrated example, the imaging unit mounting members 133a and 133b are formed of a material having lower thermal conductivity than the imaging element holding member 122 and the imaging device housing 129 formed by magnesium die casting. As described above, as a result of heat diffusing into the imaging device housing 129 due to heat radiation of the circuit board 125, the temperature of the imaging device casing 129 increases.

  On the other hand, as described above, since the imaging device housing 129 is fastened only via the imaging element holding member 122 and the imaging unit mounting members 133a and 133b having low thermal conductivity, the imaging device housing is fixed to the imaging device holding member 122. Heat is not easily transmitted from 129. As a result, it is possible to prevent the flange back from changing due to the expansion of the image sensor holding member 122 due to thermal expansion.

  As described above, the imaging element holding member 122 is fixed to the imaging device housing 129 via the imaging unit mounting members 133a and 133b on a plane parallel to the lens mount unit 101. As a result, the imaging unit mounting members 133a and 133b can be simplified to a planar shape, and the imaging device 1 can be reduced in size and cost.

  Here, the imaging unit mounting members 133a and 133b may have a single configuration, but in the first embodiment, the imaging unit mounting members 133a and 133b have a two-sheet configuration (multiple configuration). As a result, when the imaging unit mounting members 133a and 133b are replaced, the imaging unit mounting members 133a and 133b can be replaced while maintaining a predetermined distance of the flange back.

  That is, if a plurality of imaging unit mounting members are provided, the imaging unit mounting members 133a and 133b can be exchanged without readjustment of the flange back, and assembling convenience can be improved. In this case, it is desirable that the plurality of imaging unit mounting members be arranged on the same plane.

  As described above, a plate-like metal member having a thermal conductivity lower than that of the imaging element holding member 122 and the imaging device housing 129 formed by magnesium die casting is used as the material of the imaging unit attachment members 133a and 133b. This not only relieves the force applied to the image sensor holding member 122 due to the spring property of the plate-shaped metal member, but also electrically connects the image sensor holding member 122 formed by magnesium die casting and the main body side casing 129. And can be conducted.

  In the first embodiment, as the imaging unit mounting members 133a and 133b, stainless steel leaf spring materials having lower thermal conductivity than the imaging element holding member 122 and the main body side housing 129 formed by die casting of magnesium are used. It was.

  Even when a plastic material is used, the imaging unit mounting members 133a and 133b are subjected to metal plating or conductive coating, or the imaging unit mounting members 133a and 133b are made conductive by using a conductive resin material or the like. It may be provided so as to be electrically connected to electrical ground.

  Although the first embodiment has been described with reference to the drawings, various modifications can be made without being limited to the configuration of the drawings. For example, in the first embodiment, the imaging unit mounting members 133a and 133b are configured in two pieces, and the imaging element holding member 122 and the main body side casing 129 are screw-fixed at three locations in the vicinity of the radial direction. As described above, the imaging unit mounting members 133a and 133b may have a single configuration.

  Furthermore, it is good also as a structure of 6 imaging part attachment members so that only the location which connects the image pick-up element holding member 122 and the main body side housing | casing 129 in a radial direction may be connected.

  As described above, in the first embodiment of the present invention, the imaging element holding member is fixed to the imaging apparatus housing via the imaging unit mounting member having low thermal conductivity. Thereby, the heat transmitted from the imaging device housing to the imaging element holding member can be suppressed, and the change in the flange back due to the temperature change can be suppressed.

[Second Embodiment]
Subsequently, an imaging apparatus according to a second embodiment of the present invention will be described. The external appearance of the imaging apparatus according to the second embodiment is the same as that of the imaging apparatus shown in FIGS. 1 to 4, and here, the holding structure of the imaging unit (imaging unit holding structure) will be described.

  FIG. 8 is an exploded perspective view illustrating the imaging unit in the imaging apparatus according to the second embodiment of the present invention. FIG. 9 is an exploded perspective view of an example of the imaging unit holding structure used in the imaging apparatus according to the second embodiment of the present invention. FIG. 10 is a perspective view showing the appearance of the imaging unit holding structure shown in FIG.

  In FIG. 8, the imaging unit 901 includes an imaging element 801, and the imaging element 801 is fixed to the imaging element holding member 802 with a screw 804. On the other hand, the lens mount portion 803 is fixed to the image sensor holding member 802 with screws 805. The distance from the lens mounting surface 803a defined in the lens mount portion 803 to the image sensor surface 801a of the image sensor 801 is the flange back.

  Referring also to FIGS. 9 and 10, the imaging unit 901 is fixed to the imaging unit mounting member 903 by screws 905a to 905f only on one surface parallel to the lens mounting surface 803a. As shown in the figure, the imaging unit mounting member 903 has a substantially circular shape and is disposed around the lens mounting surface 803a. The imaging unit mounting member 903 is formed of a metal material and functions as a leaf spring.

  The main body side housing 902 is fixed by an imaging unit mounting member 903 and screws 904a to 904f. When the assembly is completed, the appearance of the imaging unit holding structure is as shown in FIG.

  Since the other configuration of the imaging apparatus has been described in the first embodiment, the description thereof is omitted here.

  Here, when an external force is applied to the photographing lens (not shown) or an external force is applied to the main body side housing 902, the applied external force is efficiently transmitted to the imaging unit mounting member 903, and the imaging unit is mounted. An operation when the external force applied to the imaging unit 901 is reduced by deforming the unit 903 will be described.

  Here, in order to easily understand the operation of the imaging unit support structure according to the second embodiment, first, the operation of the conventional imaging unit holding structure will be described.

  FIG. 11 is a diagram for schematically explaining the action of force in the conventional imaging unit support structure. In FIG. 11, for simplification of description, the part of the imaging unit mounting member that contacts and supports the imaging unit 901 on the lower side is referred to as an imaging unit mounting member 1103 a 1 and contacts the imaging unit 901 on the upper side. Let the supporting part be the imaging part attachment member 1103a2.

  In FIG. 11, in the illustrated imaging unit holding structure, the imaging unit 901, the imaging unit mounting member 1103a1, and the imaging unit mounting member 1103a2 are not fixed on a plane parallel to the lens mounting surface 803a. At this time, when an external force Fl is applied to the photographic lens 1104, the force Fr acts on the fixed portion between the imaging unit 901 and the imaging unit mounting member 1103a2 with the imaging unit 901 and the fixed site of the imaging unit mounting member 1103a1 as a fulcrum 1150. .

  The force Fr acts around the fulcrum 1150 in the tangential direction of a circle passing through a fixed portion between the imaging unit 901 and the imaging unit mounting member 1103a2. The force Fr is divided into a component force Fx in the plate thickness direction that easily deforms the imaging unit mounting member 1103a2 and a component force Fy in the plate surface direction in which the imaging unit mounting member 1103a2 is difficult to deform.

  Since the component force Fx deforms the imaging member 1103a2, the force applied to the imaging unit 901 is reduced. However, since the imaging member 1103a2 is not easily deformed by the component force Fy, a force is applied to the imaging unit 901, and the imaging unit 901 is deformed by this force.

  FIG. 12 is a diagram for schematically explaining the action of force in the imaging unit support structure described in FIG. 9. In FIG. 12, for simplification of description, the imaging unit mounting member 903 described in FIG. 9 is the imaging unit mounting member 1103 b 1 that is supported by contacting the imaging unit 901 on the lower side, and the imaging unit 901. The portion that is in contact with and supported on the upper side is referred to as an imaging unit mounting member 1103b2.

  In FIG. 12, when an external force Fl is applied to the photographic lens, the force Fr acts on the fixing point between the imaging unit 901 and the imaging unit mounting member 1103b2 with the fixing point between the imaging unit 901 and the imaging unit mounting member 1103b1 as a fulcrum 1150. . The force Fr acts around the fulcrum 1150 in the tangential direction of a circle passing through the fixed portion between the imaging unit 901 and the imaging unit mounting member 1103b2.

  As described above, since the imaging unit mounting member 1103b1 and the imaging unit mounting member 1103b2 are fixed on one surface parallel to the lens mounting surface 803a, the force Fr can easily deform the imaging unit mounting member 1103b2. Is equal to the force Fx (Fr = Fx). Further, the component force Fy in the plate surface direction in which the imaging unit mounting member 1103b2 is difficult to deform does not occur.

  As a result, in the imaging unit support structure described with reference to FIG. 9, deformation of the imaging unit 901 can be suppressed.

  Next, the action of force when an external force is applied to the main body side housing 902 will be described.

  First, referring to FIG. 11, in the illustrated imaging unit holding structure, the rigidity of the imaging unit mounting members 1103a1 and 1103a2 is increased in order to suppress deformation of the imaging unit 901 due to external force.

  Therefore, when the fixing point between the imaging unit 901 and the imaging unit mounting member 1103a1 is the fulcrum 1150, the external force Fc applied to the main body side housing 902 is not weakened, and the acting force is applied to the fixing point between the imaging unit 901 and the imaging unit mounting member 1103a2. Will join as. This force causes deformation of the imaging unit 901.

  On the other hand, in the imaging unit support structure shown in FIG. 12, the imaging unit mounting members 1103b1 and 1103b2 are deformed in order to suppress deformation of the imaging unit 901 due to external force. When the fixed location between the imaging unit 901 and the imaging unit mounting member 1103b1 is a fulcrum 1150, when an external force Fc is applied to the main body side housing 902, the acting force applied to the fixed site between the imaging unit 901 and the imaging unit mounting member 1203b2 is imaged. Since the part mounting member 1103b2 is deformed, it becomes weaker than the external force Fc.

  In addition, since the imaging unit mounting member 1103b1 and the imaging unit mounting member 1103b2 are fixed on one surface parallel to the lens mounting surface 803a, the fixing portion is fixed regardless of the external force acting on the main body side housing 902 from any direction. The acting force is equivalent. For this reason, there is no direction which becomes remarkably weak with respect to external force.

  If the imaging unit holding member 903 is too rigid, the force applied to the imaging unit 901 increases when an external force is applied to the main body side housing 902. On the other hand, if the rigidity of the imaging unit mounting member 903 is too weak, the imaging unit 901 is greatly deformed only by the weight of the imaging lens 114, and the imaging lens 1104 is inclined. For this reason, it is desirable to adjust the rigidity of the imaging unit mounting member 903 in accordance with the assumed maximum weight of the photographing lens 1104.

  FIG. 13 is a cross-sectional view schematically showing an example of an imaging unit holding structure used in the imaging apparatus according to the second embodiment of the present invention.

  In FIG. 13, as described above, the imaging unit 901 includes the imaging device 801, the imaging device holding member 802, and the lens mount unit 803. The imaging unit 901 is fixed to the imaging unit mounting member 903 only on one surface parallel to the lens mounting surface of the lens mount unit 803. As described above, the imaging unit mounting member 903 has a substantially circular flat plate shape, and is fixed to the imaging element holding member 802 in a plane parallel to the lens mounting surface and is also fixed to the main body side housing 902.

  Since the imaging unit mounting member 903 has a flat plate shape, the rigidity can be easily adjusted only by changing the plate thickness.

  FIG. 14 is a cross-sectional view schematically showing another example of the imaging unit holding structure used in the imaging apparatus according to the second embodiment of the present invention.

  In FIG. 14, the imaging unit 901 includes an imaging element 801, an imaging element holding member 802, and a lens mount unit 803. The imaging unit mounting member 903 is formed of, for example, a plate-like material, and is fixed to the imaging element holding member 802 in a plane parallel to the lens mounting surface 803a of the lens mount unit 803 and is attached to the main body side housing 902. It is fixed.

  In addition, in the example shown in FIG. 14, the main body side housing 902 has two surfaces parallel to the lens mounting surface 803a. The imaging unit mounting member 903 fixes the imaging element holding member 802 and the main body side casing 902 on the same plane on the lower side in the figure, and the imaging unit holding member 802 and the main body side casing 902 on the upper side in parallel with the lens mounting surface 803a. It is fixed on two sides.

  In this relationship, the imaging unit mounting member 903 shown in FIG. 14 has a stepped shape on the upper side in the drawing. Also in the structure shown in FIG. 14, the imaging unit mounting member 903 is fixed to the imaging device holding member 802 directly or via the lens mounting unit 803 on a surface parallel to the lens mounting surface 803 a of the lens mounting unit 803. Is done.

  In the example shown in FIG. 14, the imaging unit mounting member 903 is molded from a plate-like material, so that the rigidity can be easily adjusted only by changing the plate thickness.

  Note that a configuration using an optical path in the flange back, such as a shutter, an AF control device, a mirror, a pentaprism, and an ND filter, may be added to the imaging unit 901. Further, the fixing portion of the imaging unit 901 may be provided on the lens mount unit 803.

  As described above, in the second embodiment of the present invention, the imaging unit is fixed to the housing of the imaging device by the imaging unit mounting member on one surface parallel to the lens mounting surface of the lens mount unit. Accordingly, even when an external force is applied to the imaging device, the imaging unit mounting member is deformed by the external force, and the force transmitted to the imaging unit can be reduced.

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to these embodiment, Various forms of the range which does not deviate from the summary of this invention are also contained in this invention. .

DESCRIPTION OF SYMBOLS 1 Imaging device 101 Lens mount part 119 Imaging element 122 Imaging element holding member 125 Circuit board 126 Duct part 127 Fan 128 Heat sink 129 Imaging device housing 133a, 133b Imaging part attachment member

Claims (12)

An imaging device capable of replacing a taking lens unit,
An imaging element on which an optical image from the photographing lens unit forms an image; a lens mount portion to which the photographing lens unit is attached and disposed on a front side that is closer to the photographing lens unit than the imaging element; and the imaging element An imaging unit comprising an imaging element holding member that holds and holds the lens mount unit;
An imaging unit mounting member for fixing the imaging unit to a housing of the imaging device;
The imaging device holding member and the housing of the imaging unit are fixed on the plane parallel to the lens mounting surface of the lens mount unit by the imaging unit mounting member.   The imaging apparatus according to claim 1, wherein the imaging unit mounting member is formed of a material having lower thermal conductivity than the imaging element holding member and the housing.   The imaging device holding member and the housing of the imaging unit are fixed on at least one surface parallel to the lens mounting surface of the lens mount unit by the imaging unit mounting member. The imaging device described.   The imaging apparatus according to claim 1, wherein a plurality of the imaging unit mounting members are provided, and the plurality of imaging unit mounting members are arranged on the same plane. . A circuit board that is disposed inside the imaging device and controls the imaging device;
The image pickup apparatus according to claim 1, further comprising forced exhaust means for forcibly exhausting heat generated from the circuit board to the outside of the housing. The forced exhaust means is a duct portion for exhausting heat from the circuit board to the outside of the housing,
The imaging apparatus according to claim 5, further comprising a fan that blows air to the duct portion. The circuit board is disposed on the rear side of the image sensor;
The imaging apparatus according to claim 5, wherein the duct part and the fan are disposed on a front side of the circuit board.   The imaging apparatus according to claim 5, further comprising a heat dissipation member connected to the circuit board and connected to the housing. A circuit board that is disposed inside the imaging device and controls the imaging device;
The imaging apparatus according to claim 1, further comprising a heat dissipation member connected to the circuit board and connected to the housing.   The imaging apparatus according to claim 1, wherein the imaging unit mounting member is formed from a plate-shaped material.   The image pickup apparatus according to claim 1, wherein the image pickup unit mounting member is a leaf spring formed of a metal material.   The imaging apparatus according to claim 1, wherein the imaging unit attachment member has predetermined rigidity.

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