JP2019009552A - Electronic device - Google Patents

Abstract

To provide a heat dissipation structure of an electronic device capable of simultaneously and efficiently cooling a first substrate and a second substrate which are heat sources by using one cooling fan.SOLUTION: The electronic device includes: a main unit 200; a first substrate 901 which is disposed substantially parallel to a side surface of the main unit 200 and serves as a heat source; a second substrate 207 which is disposed on an end face orthogonal to the side face of the main unit 200 and serves as a heat source; a first duct 902 having air inlets 902c, 902d and having a flow path for cooling the first substrate 901 formed thereon; a second duct 401 having a suction port 410 and an exhaust port 411 and having a flow path for cooling the second substrate 207; and a cooling fan 904 attached to the first duct 902 and having an exhaust port 904a for exhausting air flowing into the flow path of the first duct 902. The first duct 902 is provided with an opening 905 which is connected to the exhaust port 411 of the second duct 401 and allows air from the exhaust port 411 to flow into the flow path of the first duct 902.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a heat dissipation structure for an electronic device including an imaging device such as a digital camera or a digital video camera.

  In an electronic apparatus such as a digital video camera, power consumption increases with the recent increase in the number of pixels of an image sensor, and a structure having a higher heat dissipation effect for the image sensor is required. For example, the heat of the image sensor is circulated in the camera body by an air circulation path formed by a fan and a blower duct, and a part of the air circulation path is formed by a heat dissipation member, and the heat transmitted to the heat dissipation member is transmitted to the camera body. There has been proposed a structure for radiating heat to the outside air through a through-hole provided in (Patent Document 1).

JP 2009-71722 A

  By the way, when cooling both the image sensor and the main board in the camera body, it is possible to cool the image sensor and the main board at the same time using only one fan from the viewpoint of miniaturization of the camera body and cost reduction. desirable. However, since only one of the image sensor and main board is cooled by a single fan, the heat dissipation effect is reduced, so that both the image sensor and main board can be cooled simultaneously by one fan. A structure with high heat dissipation efficiency is required.

  The present invention has been made in response to such technical demands, and uses a single cooling fan to provide a first substrate that is a heat source and a surface that intersects the surface on which the first substrate is disposed. An object of the present invention is to provide a heat dissipation structure for an electronic device that can cool two substrates simultaneously and efficiently.

  In order to achieve the above object, an electronic apparatus according to the present invention includes a main unit, a first substrate disposed substantially parallel to a side surface of the main unit, and serving as a heat source, and a surface intersecting the side surface of the main unit. A second duct that is disposed and serves as a heat source; a first duct having an air inlet and having a flow path for cooling the first board; an air inlet and an air outlet; and cooling the second board And a cooling fan attached to the first duct and having an exhaust port for exhausting air that has flowed into the flow path of the first duct. Is connected to the exhaust port of the second duct, and is provided with an opening through which air from the exhaust port of the second duct flows into the flow path of the first duct.

  According to the present invention, it is possible to simultaneously and efficiently cool the first substrate, which is a heat source, and the second substrate disposed on the surface intersecting the surface on which the first substrate is disposed, using one cooling fan. A heat dissipation structure for an electronic device can be provided.

(A) is the perspective view which looked at the digital video camera which is an example of embodiment of the electronic device of this invention from the back side, (b) is the perspective view which looked at the digital video camera shown to (a) from the front side. . It is a perspective view which shows the state which attached the battery to the digital video camera shown to Fig.1 (a). (A) is the perspective view which looked at the internal structure of the digital video camera from the back side, (b) is the perspective view which looked at the internal structure of the digital video camera from the front side. FIG. 4 is a partially enlarged view of FIG. It is a figure explaining the angle adjustment method of an imaging unit. (A) is a perspective view which shows the state which attached the holder metal plate and the sensor duct unit with respect to the camera housing | casing to which the sensor unit was attached, (b) is an exploded perspective view of a sensor duct unit. FIG. 7 is a rear view of FIG. It is the PP sectional view enlarged view of FIG. It is a disassembled perspective view which shows the state which attaches a main board | substrate, a main duct, a main duct cover, and a cooling fan from the state of FIG. (A) is the figure which looked at the assembly of FIG. 9 from the arrow X direction, (b) is the QQ sectional view taken on the line of (a).

  Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1A is a perspective view of a digital video camera as an example of an embodiment of an electronic apparatus according to the present invention as seen from the back side, and FIG. 1B is a perspective view of the digital video camera shown in FIG. FIG. FIG. 2 is a perspective view showing a state in which a battery is attached to the digital video camera shown in FIG. In the figure, Z denotes the optical axis, and the subject side (front side) is described as + Z direction, and the photographer side (back side) is described as −Z direction. In this embodiment, a digital video camera which is an example of an imaging apparatus is illustrated as the electronic apparatus of the present invention, but the present invention is not limited to this.

  As shown in FIG. 1, a digital video camera 100 (hereinafter referred to as a camera 100) of the present embodiment has a lens unit 300 disposed on the front side, and an operation such as manual focus is performed on the outer peripheral unit 300 of the lens unit. A possible operating ring 103 is provided. A display unit 101 made of an LCD or the like is supported on the left side as viewed from the back side of the camera 100 so as to be openable and closable. The camera housing 200 corresponds to an example of the main unit of the present invention.

  On the back side of the camera 100, a viewfinder 102, a battery chamber 104, a battery release switch 105, battery mounting guides 106a and 106b, a battery chamber inlet 107, and battery lock portions 113a and 113b are provided. The battery mounting guides 106 a and 106 b are not shown in the figure, but the same is provided on the opposite side in the battery chamber 104.

  A grip part 114 that is gripped by the user is provided on the left side when the camera 100 is viewed from the front side, and main air intakes 108 a and 108 b are provided on the front side of the grip part 114. Is provided with an exhaust port 109. Further, on the top surface of the camera 100, a microphone unit 110 is provided on the front side, and a zoom key 111 is provided on the back side.

  The camera 100 sucks outside air from the direction of arrow A at the battery chamber inlet 107, sucks outside air from the directions of arrows B and C at the main inlets 108 a and 108 b, and exhausts the air in the direction of arrow D at the outlet 109. The inside of the camera 100 is cooled.

  The battery lock portions 113 a and 113 b are urged in the −Z direction by an elastic member (not shown) and protrude from the battery chamber 104 in a normal state. The battery release switch 105 is a slide switch that can be operated in the + Z direction, and the battery release switch 105 and the battery lock portions 113a and 113b are integrated. For this reason, along with the sliding operation of the battery release switch 105, the battery lock portions 113a and 113b can be retracted to a position where they do not protrude from the battery chamber 104.

  As shown in FIG. 2, the battery 112 is detachably attached to the battery chamber 104. In such a mounted state, movement of the battery 112 in the −Z direction is restricted by engagement of a claw portion (not shown) provided in the battery 112 with the battery mounting guides 106 a and 106 b provided in the battery chamber 104. The

  Further, the battery lock portions 113 a and 113 b protruding from the battery chamber 104 support the bottom surface portion 112 a of the battery 112, so that the battery 112 is held in the battery chamber 104. In this state (FIG. 2), the battery chamber intake 107 is exposed to the outside, so that outside air can be sucked from the battery chamber intake 107 even when the battery 112 is attached.

  Next, the internal structure of the camera 100 will be described with reference to FIGS. 3A is a perspective view of the internal structure of the camera 100 as viewed from the back side, and FIG. 3B is a perspective view of the internal structure of the camera 100 as viewed from the front side. FIG. 4 is a partially enlarged view of FIG.

  As shown in FIG. 3, the camera housing 200 is provided with holder mounting bosses 201a to 201k and sensor mounting bosses 202a to 202c for screwing a holder metal plate 500 (see FIG. 7) described later. As shown in FIG. 4, concentric concave portions 218a to 218c that are slightly larger than the outer shape of the sensor mounting bosses 202a to 202c are provided outside the sensor mounting bosses 202a to 202c. Adjustment coil springs 216a to 216c are attached to the recessed portions 218a to 218c so as to fit along the outer shapes of the sensor attachment bosses 202a to 202c.

  In addition, the imaging unit 260 is positioned on the rear end face of the camera housing 200 by fitting the positioning holes 210a and 210b of the sensor mounting plate 208 into the positioning pins 203a and 203b provided in the camera housing 200. Installed in a state. The image sensor 206 mounted on the sensor substrate 207 is fixed to the sensor mounting plate 208 by an adhesive or the like and integrated. The sensor substrate 207 corresponds to an example of a second substrate serving as a heat source of the present invention.

  The connection connector 217 mounted on the sensor board 207 is electrically connected to a main board 901 (see FIG. 9) described later, and can send image information obtained from the image sensor 206 to the main board 901. . A part of the surface of the sensor substrate 207 opposite to the imaging element 206 is a copper foil exposed portion 212, and the copper foil exposed portion 212 has a heat conductive adhesive member 213 that is slightly smaller than the copper foil exposed portion 212. Is pasted. The heat conductive adhesive member 213 has the flange surface of the heat radiating fin 214 attached thereto, whereby the heat radiating fin 214 is thermally connected to the copper foil exposed portion 212 via the heat conductive adhesive member 213 and generated on the sensor substrate 207. Heat is transferred to the radiation fins 214.

  The imaging unit 260 attached to the camera housing 200 is temporarily fixed by inserting the adjustment screws 215a to 215c into the through holes 209a to 209c of the sensor attachment plate 208 and fastening them to the sensor attachment bosses 202a to 202c. The Then, after adjusting the angle of the imaging unit 260 in this state, the imaging unit 260 is permanently fixed to the camera housing 200 with an adhesive or the like.

  Next, a method for adjusting the angle of the imaging unit 260 will be described with reference to FIG. I will explain. 5A is a rear view of the camera housing 200 in a state where the imaging unit 260 is temporarily fixed, FIG. 5B is an enlarged cross-sectional view taken along line MM in FIG. 5A, and FIG. FIG. 6 is an enlarged cross-sectional view taken along line MM in FIG. 5A when the angle of the imaging unit 260 is adjusted.

  In the state of FIG. 5B, the imaging unit 260 receives the urging force in the −Z direction by the adjustment coil spring 216a. When the adjustment screw 215a is loosened in this state, the imaging unit 260 is also pushed up by the biasing force of the adjustment coil spring 216a, and the portion (N axis) supported by the adjustment screws 215b and 215c shown in FIG. As a result, the inclination shown in FIG. 5C is obtained.

  Similarly, when the adjustment screws 215b and 215c are loosened, the imaging unit 260 is pushed up by that amount by the urging force of the adjustment coil springs 216b and 216c, and an inclination is generated. In this way, by adjusting the amount of looseness of the adjustment screws 215a to 215c, the imaging unit 260 can be adjusted to an arbitrary position and posture.

  6A is a perspective view showing a state in which the holder metal plate 500 and the sensor duct unit 400 are attached to the camera housing 200 to which the imaging unit 260 is attached, and FIG. 6B is an exploded perspective view of the sensor duct unit 400. FIG.

  As shown in FIG. 6 (a), the holder metal plate 500 is attached by screws 501a to 501k (screws 501g to 501k are not shown) at positions corresponding to the holder mounting bosses 201a to 201k (see FIG. 3) of the camera housing 200. It has been. In addition, the sensor duct unit 400 is attached to the holder metal plate 500 by screws 601 a to 601 c so as to cover the imaging unit 260.

  As shown in FIG. 6B, the sensor duct unit 400 includes a sensor duct 401, a sensor duct lid 402, an elastic member 404, an intake port elastic member 412, and an exhaust port elastic member 413. Is provided with an opening 403. The opening 403 has an opening area in which the tip of the fin portion 214b of the heat radiating fin 214 can be inserted in the assembled state. The elastic member 404 is attached to the sensor duct lid 402 via a double-sided tape (not shown). The sensor duct 401 corresponds to an example of the second duct of the present invention.

  The opening area of the opening 407 of the elastic member 404 is larger than the opening 403 of the sensor duct lid 402. The sensor duct 401 and the sensor duct lid 402 are integrated by fastening the screws 406a to 406b with the bosses 409a to 409b through the through holes 408a to 408b of the sensor duct lid 402.

  The sensor duct 401 is provided with an intake port 410 and an exhaust port 411. The intake port 410 and the exhaust port 411 are respectively provided with an intake port elastic member 412 and an exhaust port elastic member 413 having a low heat transfer coefficient, such as sponge. Is affixed with a double-sided tape (not shown). The intake port 410 corresponds to the battery chamber intake port 107.

  Next, a heat dissipation structure of the imaging unit 260 using the sensor duct unit 400 will be described with reference to FIGS. FIG. 7 is a rear view of FIG. FIG. 8A is an enlarged sectional view taken along the line P-P in FIG.

  As shown in FIG. 8 (a), the sensor duct 401 is opposed to the heat dissipating fin 214 in the Z direction, and has a concave surface portion 401a that is a concave shape in order to secure a gap with the tip of the fin portion 214b. And a flat portion 401b which is a region other than that. The distance h0 from the fin part 214b to the concave surface part 401a is set so that the fin part 214b and the concave surface part 401a do not come into contact with each other due to the movement of the tip of the fin part 214b due to the angle adjustment of the imaging unit 260 or the deformation of the concave surface part 401a due to impact or the like. Sufficient distance is secured.

  In addition, the elastic member 404 is assembled in a charged state between the flange surface 214 a of the radiating fin 214 and the sensor duct lid 402. The charge amount of the elastic member 404 is sufficiently ensured so that the airtightness with respect to the outside is maintained regardless of which direction of the imaging unit 260 moves in the ± Z direction in accordance with the angle adjustment described above.

  As shown in FIG. 7, the sensor duct unit 400 is connected to the battery chamber inlet 107 (see FIG. 1A) via the inlet elastic member 412 at the inlet 410. For this reason, the air sucked from the battery chamber inlet 107 flows into the inlet 410 in the direction of arrow E in FIG. 7, passes through the heat radiation fin 214 on the way, takes the heat of the sensor board 207, and remains in the direction of the arrow. And exhausted from the exhaust port 411 in the direction of arrow F.

  As shown in FIG. 8B, when the plane portion 401c is entirely separated from the heat radiating fin 214, when the inflow air passes through the region of the fin portion 214b, the difference in ventilation resistance causes the gap between the fin portions 214b. Many flows in the region between the tip of the fin portion 214b and the flat portion 401c. On the other hand, as shown in FIG. 8A, the flow of air is limited by providing the concave surface portion 401a, and the air can be more positively applied to the fin portion 214b of the radiating fin 214.

  Further, as shown in FIG. 8C, the rib 401d is provided in the direction perpendicular to the air flow direction, for example, to prevent the air flow between the area of the concave surface portion 401a and the radiation fin 214 with respect to the sensor duct 401. When formed, it becomes difficult for air to flow in the region of the distance h0 as compared with FIG. For this reason, air can be positively applied to the fin part 214b of the radiation fin 214.

  As described above, the distance h1 perpendicular to the optical axis direction of the fin portion 214b and the rib 401d is also affected by the movement of the tip of the fin portion 214b by the angle adjustment of the imaging unit 260, the deformation of the concave surface portion 401a due to an impact, or the like. In consideration, it is desirable to secure a sufficient distance.

  Next, a heat dissipation structure of the main board 901 using the main duct 902 will be described with reference to FIGS. FIG. 9 is an exploded perspective view showing a state in which the main board 901, the main duct 902, the main duct lid 903, and the cooling fan 904 are further attached from the state of FIG. 10A is a view of the assembly of FIG. 9 as viewed from the direction of the arrow X, and FIG. 10B is a cross-sectional view taken along the line QQ of FIG. 10A. In FIG. 10A, the main duct lid 903 is not shown for convenience of explanation.

  As shown in FIG. 9, the main substrate 901 is disposed on a plane that is substantially parallel to the side surface of the camera housing 200, that is, on a plane that intersects substantially at right angles to the plane on which the sensor substrate 207 is disposed. The side of the main substrate 901 facing the holder sheet metal 500 is thermally connected to the holder sheet metal 500 via a heat conductive elastic member (not shown). Similarly, the side of the main board 901 facing the main duct 902 is thermally connected to the main duct 902 via a heat transfer elastic member (not shown).

  As a result, the heat generated in the main board 901 is divided into two paths: a path that diffuses into the camera 100 through the holder metal plate 500 and a path that is exhausted to the outside by forced air cooling through the main duct 902. Heat is dissipated. Further, in order to further enhance the effect of diffusing heat into the camera 100 through the holder sheet metal 500, the holder sheet metal 500 is made of a material having a high heat transfer coefficient such as an aluminum alloy, and around the camera casing 200 as much as possible. A lot of area is taken to surround. The main board 901 corresponds to an example of a first board serving as a heat source of the present invention, and the main duct 902 corresponds to an example of a first duct of the present invention.

  The main duct 902 includes radiating fins 902a and flat portions 902b (FIG. 10B) that are substantially parallel to the main substrate 901 and on which the radiating fins 902a are formed. As shown in FIG. 10B, the main duct lid 903 includes an opening 903a for allowing air to flow between the cooling fan 904, a flat portion 903b facing the heat radiating fin 902a, and a heat radiating fin 902a of the main duct 902. And a flat portion 903c facing the non-exposed region. Note that the cooling fan 904 is constituted by, for example, a centrifugal fan. The cooling fan 904 is attached to the main duct 902 so that the rotation axis P is substantially orthogonal to the main board.

  Here, the distance from the flat portion 902b of the main duct 902 to the flat portion 903b of the main duct lid 903 (height of the radiation fin 902a) is h2, and the distance from the flat portion 902b to the flat portion 903c of the main duct lid 903 is h3. And

  The air flow in the main duct 902 is first sucked from the directions of arrows B and C shown in FIG. 10B through the air inlets 902c and 902d, and the sucked air flows into the flat portion 902b and the flat portion 903b. Pass through the space between. The air passing through the space between the flat surface portion 902b and the flat surface portion 903b takes heat from the radiating fin 902a, passes through the space between the flat surface portion 902b and the flat surface portion 903c, flows to the cooling fan 904, and exhausts the air outlet 904a. Is exhausted in the direction of arrow D. The intake ports 902c and 902d correspond to the intake ports 108a and 108b in FIG. 1B, and the exhaust port 904a corresponds to the exhaust port 109 in FIG. 1B.

  By the way, since the ventilation resistance of air is mainly determined by the cross-sectional area of the flow path, the cross-sectional integral flow path of the heat radiation fin 902a becomes narrow in the region where the heat radiation fin 902a is disposed. For this reason, if the flow path cross-sectional area of the area where the heat dissipating fins 902a are disposed is the same as the area where the heat dissipating fins 902a are not disposed, the area where the heat dissipating fins 902a are not disposed is the dimension in the cross-sectional integral height direction of the heat dissipating fins Can be suppressed (h2-h3).

  As a result, the cooling fan 904 can be placed close to the optical axis, in other words, at a position lower than the radiation fin 902a, and the main duct 902 including the cooling fan 904 can be downsized. In addition, when the heat dissipation structure of the main duct 902 including the cooling fan 904 is downsized and disposed inside the grip portion 114, the grip portion 114 can be brought closer to the optical axis, and the center of gravity position of the camera 100 and the grip portion 114 can be obtained. Approaches and improves ease of holding.

  The main duct 902 is provided with a duct connection opening 905 for connecting to the exhaust port 411 of the sensor duct unit 400. The duct connection opening 905 is disposed on the opposite side of the rotation axis P of the cooling fan 904 with respect to the air flow flowing from the arrow B direction and the arrow C direction in FIG. 10B to the cooling fan 904. Has been. As a result, the air flow from the arrow B direction and the arrow C direction toward the cooling fan 904 and the air flow from the exhaust port 411 of the sensor duct unit 400 toward the cooling fan 904 cool without interfering with each other. Guided to fan 904. For this reason, it becomes possible to efficiently exhaust the air flows from the two directions.

  Further, since the air that has been warmed by passing through the radiation fins 902a flows to the cooling fan 904, it is difficult for the air to flow toward the duct connection opening 905 on the opposite side of the radiation fins 902a with the cooling fan 904 interposed therebetween. . Furthermore, the exhaust port 411 and the duct connection opening 905 are in contact only via the exhaust port elastic member 413 having a lower thermal conductivity than the main duct 902 and the sensor duct 401. For this reason, it is possible to minimize the heat of the main duct 902 from being transmitted to the sensor duct unit 400 via the duct connection opening 905.

  As described above, in the present embodiment, the air flow from the direction of arrows B and C toward the cooling fan 904 and the air flow from the exhaust port 411 of the sensor duct unit 400 to the cooling fan 904 are mutually flowed. It is guided to the cooling fan 904 without disturbing. Therefore, it is possible to efficiently exhaust the air flows from the two directions, and the image sensor 206 and the main board 901 can be simultaneously and efficiently cooled by using one cooling fan 904.

  The configuration of the present invention is not limited to that exemplified in the above embodiment, and the material, shape, dimensions, form, number, arrangement location, and the like can be changed as appropriate without departing from the scope of the present invention. It is.

DESCRIPTION OF SYMBOLS 100 Camera 200 Camera housing 207 Sensor board 401 Sensor duct 410 Intake port 411 Exhaust port 901 Main board 902 Main duct 902c, 902d Intake port 904 Cooling fan 904a Exhaust port 905 Duct connection opening

In order to achieve the above object, an electronic apparatus according to the present invention includes a main unit, a first substrate disposed substantially parallel to a side surface of the main unit, and serving as a heat source, and a surface intersecting the side surface of the main unit. is arranged, a second substrate as a heat source, having a first inlet, a first duct flow path is formed for cooling the first substrate, the second inlet and the first outlet And a second duct having a flow path for cooling the second substrate, and a second exhaust port attached to the first duct and exhausting the air flowing into the flow path of the first duct. A cooling fan, wherein the first duct is connected to the first exhaust port of the second duct, and air from the first exhaust port of the second duct is allowed to flow through the first duct. An opening for flowing into the road is provided.
The image pickup apparatus of the present invention includes a main unit, a first substrate disposed substantially parallel to a side surface of the main unit, a second substrate disposed on a surface intersecting the first substrate, and the first substrate. A first duct disposed to contact the substrate, a second duct connected to the first duct and disposed to contact the second substrate, and a cooling fan attached to the first duct; It is characterized by providing.
The imaging apparatus according to the present invention includes a main unit, a first substrate disposed substantially parallel to a side surface of the main unit, a first duct disposed so as to abut on the first substrate, and the first And a cooling fan attached to the first duct so that the rotation axis is substantially orthogonal to the substrate.

Claims (7)

The main unit,
A first substrate disposed substantially parallel to the side surface of the main unit and serving as a heat source;
A second substrate disposed on a surface intersecting with the side surface of the main unit and serving as a heat source;
A first duct having an air inlet and having a flow path for cooling the first substrate;
A second duct having an air inlet and an air outlet and having a flow path for cooling the second substrate;
A cooling fan attached to the first duct and having an exhaust port for exhausting air flowing into the flow path of the first duct;
The first duct is provided with an opening which is connected to the exhaust port of the second duct and allows air from the exhaust port of the second duct to flow into the flow path of the first duct. Features electronic equipment.   The cooling fan is attached to the first duct so that a rotation axis thereof is substantially orthogonal to the first substrate, and the opening portion is on the side of the intake port of the first duct with the rotation axis interposed therebetween. The electronic device according to claim 1, wherein the electronic device is provided on a side opposite to the electronic device.   The exhaust port of the second duct and the opening are in contact with each other via an elastic member having a lower heat transfer coefficient than the first duct and the second duct. Electronics.   In the flow path of the first duct, radiating fins are formed on the inlet side of the first duct from the cooling fan, and the cooling fan is disposed at a position lower than the height of the radiating fins. The electronic device according to claim 1, wherein:   5. The electronic device according to claim 4, wherein the first duct is formed so that a cross-sectional area of a flow path is substantially the same between a region where the heat dissipating fins are disposed and a region where the heat radiating fins are not disposed.   The electronic apparatus according to claim 1, wherein an image sensor is mounted on the second substrate.   The electronic apparatus according to claim 6, further comprising a grip portion that is held by a user, wherein the first duct including the cooling fan is disposed inside the grip portion.

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