JP5649369B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device, and more particularly to a cooling structure for an electronic device.

  Electronic devices such as digital cameras and digital video cameras have a large number of circuit elements mounted on an internal circuit board. The circuit element generates heat during a high load operation such as image processing, and raises the temperature of the element itself and other circuits. In particular, in recent years, the number of pixels in an image sensor, the frame rate, and the shooting assist function have been expanded, and the amount of heat generated by circuit elements tends to increase. Since the temperature rise inside the electronic device may cause malfunction or failure, it is necessary to cool the circuit element and the circuit board.

  As a method for effectively cooling the inside of an electronic device, it has been proposed to form an air flow path inside the camera and cool it by forced air cooling. Specifically, there is an apparatus in which an intake port and an exhaust port are provided in a camera housing and ventilated by a fan on the exhaust port side to generate an air flow on a circuit board and a circuit element to perform forced air cooling. (See Patent Document 1)

JP 2009-33718 A

  However, since the configuration disclosed in Patent Document 1 directly cools the circuit board by air, the cooling effect varies greatly depending on the shape of the circuit board and the peripheral configuration. If it is attempted to secure a sufficient air flow path for obtaining the air cooling effect, a space corresponding to a substantial volume is required around the substrate, and the entire apparatus is increased in size.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an electronic device having a high cooling effect without increasing the size of the device.

In order to achieve the above object, in the electronic device of the present invention, the first exothermic element is mounted on the first surface, and the second exothermic element is provided on the second surface which is the back surface of the first surface. A circuit board to be mounted, a first heat radiating member that is thermally coupled to the first heat-generating element to form a fin-shaped first heat radiating portion, and a heat-coupled to the second heat-generating element, a second heat radiating member in which the second heat radiating portion of the fin shape is formed, the first heat radiation member, and the board case yield volumes of the second heat radiation member and the circuit board, the first heat radiation possess a fan for cooling the member and the second heat radiating member, said first heat radiation member and the second heat radiating member, between said first radiating portion and the second heat radiation member A space that becomes a duct is formed by contacting the first heat radiating portion and the second heat radiating portion. The space to be the duct is formed separately from the space in which the circuit board is accommodated, and the board case is formed with an air inlet and an air outlet of the space to be the duct, and the fan is It is arrange | positioned in the space used as a duct, The air of the space used as the said duct is discharged | emitted .

  An electronic device having a high cooling effect can be provided without increasing the size of the device.

FIG. 3 is a perspective view illustrating an appearance of the digital camera according to the embodiment. Sectional drawing which cut | disconnected the digital camera of this embodiment by the horizontal surface containing an optical axis, and was seen from the upper surface side. Sectional drawing which cut | disconnected the digital camera of this embodiment by the perpendicular surface orthogonal to an optical axis, and was seen from the back side. The figure which expanded the A section shown in FIG.

  Hereinafter, a digital camera as an electronic apparatus embodying the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view for explaining the external appearance of the digital camera of this embodiment. FIG. 1A is a perspective view of the digital camera of the present embodiment as viewed from the front, and FIG. 1B is a perspective view of the digital camera of the present embodiment as viewed from the back.
As shown in FIGS. 1A and 1B, the digital camera of this embodiment includes a camera body 10, a lens barrel portion 11, and a grip portion 12. The camera body 10 has a liquid crystal monitor 10a that can be opened and closed on the top surface, a viewfinder 10b and operation switches 10c and 10d on the back surface, and an air inlet 20 and an air exhaust port 21 that will be described later on the left side when viewed from the back side. The lens barrel 11 is disposed on the front side of the camera body 10 and includes a focus ring 11a and a zoom ring 11b. The grip portion 12 is disposed on the right side when viewed from the back side of the camera body 10 and has a protruding shape suitable for the photographer to hold with the right hand. A release button 12a and a zoom lever 12b are provided on the top surface portion of the grip portion 12 at a position where the photographer can operate with the right index finger. The digital camera of this embodiment holds the grip part 12 with the right hand, attaches the left hand to the lens barrel part 11, and operates the focus ring 11a and the zoom ring 11b.

  FIG. 2 is a cross-sectional view of the digital camera according to the present embodiment cut along a horizontal plane including the optical axis and viewed from the upper surface side. FIG. 3 is a cross-sectional view of the digital camera according to the present embodiment cut from a vertical plane orthogonal to the optical axis and viewed from the back side.

  The substrate case 22 accommodates circuit boards 30 and 31 and heat sinks 23 and 24 arranged inside the camera body 10. The substrate case 22 has a substantially rectangular parallelepiped shape opened in the back direction of the digital camera, and is disposed in a space where the camera body 10 and the grip portion 12 communicate with each other. The circuit boards 30 and 31 and the heat sinks 23 and 24 are stacked and fixed inside the board case 22. The substrate case 22 is made of a conductive material and blocks noise that enters the circuit boards 30 and 31 from the outside, or suppresses unnecessary radiation emitted to the surroundings as the circuit boards 30 and 31 operate. Has an effect.

  The circuit boards 30 and 31 have a horizontally long and substantially rectangular shape, and are disposed in a space formed by the board case 22 in a direction orthogonal to the optical axis of the lens barrel portion 11. As shown in FIG. 2, circuit elements 30a and 31a for driving and controlling the digital camera are mounted on the circuit boards 30 and 31, respectively. The circuit boards 30 and 31 perform a number of processes as the digital camera operates. The circuit elements 30 a and 31 a generate heat when the high load process is executed, and act as a heating element inside the camera body 10. The circuit element 30a is mounted on the first surface and the second surface of the circuit board 30, respectively, and the circuit element 31a is mounted on the first surface of the circuit board 31 and the second surface that is the back surface of the first surface, respectively. Has been. Accordingly, the circuit element 30a corresponds to the first exothermic element or the second exothermic element, and the circuit element 31a corresponds to the first exothermic element or the second exothermic element.

  As illustrated in FIG. 2, the heat sink 23 is disposed so as to face the first surface of the circuit board 30, and the heat sink 24 is disposed so as to face the second surface of the circuit board 30.

  The heat sinks 23 and 24 are made of a material having high thermal conductivity such as aluminum or copper. The heat radiating plates 23 and 24 are disposed substantially parallel to the circuit board 30, and have a function of radiating the circuit element 30 a by a heat transfer structure, which will be described later, and positioning and fixing the circuit board 30. Similarly, the heat sink 25 is disposed so as to face the first surface of the circuit board 31, and the heat sink 26 is disposed so as to face the second surface of the circuit board 31. The heatsinks 25 and 26 are made of a material having high thermal conductivity, and are arranged substantially parallel to the circuit board 31. The heat radiating plates 25 and 26 have a function of radiating heat from the circuit element 31a by a heat transfer structure described later and fixing the circuit board 31 after positioning. That is, the heat sinks 23 and 25 correspond to the first heat sink, and the heat sinks 24 and 26 correspond to the second heat sink.

  The heat radiating plates 23 to 26 are formed with fin-shaped heat radiating portions 23 a, 24 a, 25 a, and 26 a at portions opposite to the grip portion 12, respectively. That is, the heat radiating portions 23a and 25a correspond to the first heat radiating portion, and the heat radiating portions 24a and 26a correspond to the second heat radiating portion.

  The heat radiating portions 23 a to 26 a are located outside the space in which the circuit boards 30 and 31 are arranged in the board case 22, and form a space that becomes the duct 28 together with a part of the board case 22. When the heat radiating portions 23a to 26a are in contact with each other, the space serving as the duct 28 is separated from the space where the circuit boards 30 and 31 are disposed. As shown in FIG. 3, the duct 28 has a shape that directly connects the intake port 20 and the exhaust port 21 provided in the camera body 10 in the vertical direction, and a blower fan 29 is disposed at the upper end of the duct 28. The blower fan 29 is fixed to the substrate case 22 in such a posture that the air discharge direction is directed to the exhaust port 21, and the air flow by the blower fan 29 is as shown in FIG. Flowing. That is, the air is sucked from the air inlet 20, flows upward in the duct 28, and is discharged from the air outlet 21. Each radiating fin is formed to extend from the inner wall of the duct 28 in a direction perpendicular to the direction of the air flow flowing through the air flow path F so as not to interfere with the forced air cooling effect by the air flow flowing through the air flow path F. .

  In this embodiment, the ventilation capability of the ventilation duct 28 is improved by making the ventilation fan 29 into the axial flow fan which has a large air volume characteristic. Further, by arranging the blower fan 29 on the exhaust side of the blower duct 28, the inside of the duct 28 is uniformly sucked to form a uniform wind speed distribution without blowing up or stagnation.

  FIG. 4 is an enlarged view of part A shown in FIG. The heat sink 23 is formed with a protrusion 23 b that protrudes toward the mounting surface of the circuit board 30. The protrusion 23b is located immediately above the circuit element 30a mounted on the circuit board 30, and has a shape that is approximately projected from the top surface of the circuit element 30a. The heat radiation rubber 27 is sandwiched in a slight gap provided between the protrusion 23b and the circuit element 30a, and the heat radiation rubber 27 is compressed by the protrusion 23b and the circuit element 30a. 30a is thermally coupled. The heat sink 24 and the circuit element 30a, the heat sink 25 and the circuit element 31a, and the heat sink 26 and the circuit element 31a are also thermally coupled with the same configuration.

The cooling action in the digital camera of this embodiment will be described. The circuit elements 30a and 31a mounted on the circuit boards 30 and 31 generate heat by executing a high load process. The heat generated in the circuit elements 30a and 31a is transmitted to the heat radiating plates 23 to 26 by heat conduction, and is transmitted to the heat radiating portions 23a to 26a formed in the heat radiating plates 23 to 26, respectively. The heat transmitted to the heat radiating portions 23a to 26a warms the air in the duct 28. When the air flow from the blower fan 29 flows through the air flow path F, the warmed air is discharged from the exhaust port 21 to the outside of the camera, and cold air flows into the duct 28 from the intake port 20. By repeating this, the heat of the circuit elements 30a and 31a is efficiently discharged outside the camera.

  In the digital camera of this embodiment, the space where the circuit boards 30 and 31 are arranged and the space serving as the duct 28 are separated from each other by the heat radiating plates 23 to 26. Thereby, air cooling with a high cooling effect can be performed regardless of the shape of the circuit board and the presence or absence of the surrounding space, and at the same time, since the degree of freedom in arrangement is high, high cooling performance can be realized while being small. Further, since the space of the duct 28 in which the air flow path F is formed can be separated from other spaces, even if dust is sucked from the air inlet 20, it does not enter the space other than the duct 28, and the digital camera Can have high dustproof property.

  When the photographer uses the digital camera according to the present embodiment, the grip unit 12 is gripped with the right hand, the left hand is attached to the lens barrel unit 11, and the focus ring 11a and the zoom ring 11b are operated. When the digital camera is in an operating state, the above-described air cooling operation is performed, so that intake and exhaust are performed from the intake port 20 and the exhaust port 21. Since the intake port 20 and the exhaust port 21 are arranged on the side opposite to the grip portion 12, intake and exhaust are not hindered by the photographer's hand or arm. Further, since the exhaust is performed in a direction different from the direction in which the image is displayed on the liquid crystal monitor 10a and the viewfinder 10b, even if the photographer's face is brought close to the liquid crystal monitor 10a and the viewfinder 10b, the exhaust is exhausted to the photographer's face. Will not win.

  Although the present invention has been described in detail based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the present invention are also included in the present invention. included. For example, although the present embodiment has been described as an application example to a digital camera, the present invention is not limited to this, and the present invention can be similarly applied even to a digital video camera, for example.

DESCRIPTION OF SYMBOLS 10 Camera body 12 Grip part 20 Air inlet 21 Exhaust port 22 Substrate case 23 Heat sink 23a Heat sink 24 Heat sink 24a Heat sink 25 Heat sink 25a Heat sink 26 Heat sink 26a Heat sink 27 Heat sink 28 Duct 29 Fan fan 30 Circuit board 30a circuit element 31 circuit board 31a circuit element

Claims (4)

A circuit board on which a first exothermic element is mounted on a first surface and a second exothermic element is mounted on a second surface which is the back surface of the first surface;
A first heat radiating member thermally coupled to the first exothermic element to form a fin-shaped first heat radiating portion;
A second heat dissipating member thermally coupled to the second exothermic element to form a fin-shaped second heat dissipating part;
Said first heat radiating member, said second heat radiation member and the substrate case to the circuit board you yield capacity,
Have a, a fan that cools the first heat radiation member and the second heat radiating member,
The first heat radiating member and the second heat radiating member are in contact with each other between the first heat radiating portion and the second heat radiating portion,
A space serving as a duct is formed by bringing the first heat radiating portion and the second heat radiating portion into contact with each other,
The space to be the duct is formed separately from the space in which the circuit board is accommodated,
The board case is formed with an air inlet and an air outlet of the space to be the duct,
The fan is disposed in a space serving as a duct, and discharges air from the space serving as the duct . It said first heating element and the second heating element so as not to overlap on the front and back of the circuit board, electronic apparatus according to claim 1, characterized that they are being mounted on the circuit board. The fin shape of the first heat radiating portion and the fin shape of the second heat radiating portion are fin shapes that do not hinder the air flow in the space serving as the duct, respectively. Electronic equipment.   4. The electronic device according to claim 1, wherein a grip portion that is photographed by a photographer is formed, and the duct is formed in a portion opposite to the grip portion. Item 1. An electronic device according to item 1.

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