CN103369210B - The supervising device of tool image capture element independence heat dissipation design - Google Patents

The supervising device of tool image capture element independence heat dissipation design Download PDF

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Publication number
CN103369210B
CN103369210B CN201210082393.6A CN201210082393A CN103369210B CN 103369210 B CN103369210 B CN 103369210B CN 201210082393 A CN201210082393 A CN 201210082393A CN 103369210 B CN103369210 B CN 103369210B
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China
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image capture
capture element
image
heat radiation
supervising device
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CN103369210A (en
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林建顺
曾培逢
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404 SCI-TECH Co Ltd
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404 SCI-TECH Co Ltd
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Abstract

A kind of supervising device having image capture element independence heat dissipation design, by body assembly and image-pickup assembly separately design, thereby can reach image capture element and dispel the heat respectively with processing circuit board, to promote image capture element and the technology effect processing circuit board each radiating effect and the image frame obtaining good quality.

Description

The supervising device of tool image capture element independence heat dissipation design
Technical field
A kind of supervising device, refers in particular to a kind of supervising device having image capture element independence heat dissipation design.
Background technology
In order to ensure the safety of citizen and grasp the situation of each administrative region at any time, government in street end to end, Each hotel owner, bank are designed with supervising device, except threatening ruffian's intention of crime with building etc., it is possible to will The image frame of convict is noted down, with the investigation clue providing the police to handle a case in the future, to guarantee people's people's livelihood Life property does not incurs loss.
General existing supervising device is provided with image capture element at casing front end face, and rear end face offers Some louvres, can reduce the temperature in casing by cross-ventilation, in order to avoid internal processor and circuit board Burn;But relative, dust storm, rainwater also readily penetrate through louvre and enter inside supervising device, significantly contract The short service life monitoring camera.
For above-mentioned problem, then propose a kind of supervising device, be provided with image at casing only front end face Capture hole, and the latter half of system of this casing is for heat radiation material and in closed, and lock in circuit board and be provided with one Heat-conducting plate, is provided with again the fin that can be close to the latter half of inwall of casing at heat-conducting plate side;Thereby can make prison Do not attacked by dust storm, rainwater inside control device, and utilize heat-conducting plate by the heat energy on processor and circuit board Be delivered in casing, specifically reach circuit board and be isolated from the outside, and can effect person of quick heat radiating, but its The contact area of fin inwall latter half of with casing is little, and the effect of heat radiation is the most extremely limited.
But, supervising device use be limited to fan-free under the conditions of, ambient temperature limit the most Celsius 50 degree extremely Between 60 degree, along with ambient temperature raises, the noise of its image frame will occur therewith, when temperature liter When height is to a limit, whole supervising device just loses function, and existing supervising device is all to be picked by image Taking element to be included in same casing with treatment element, this can cause image capture element and treatment element Produced heat energy all needs to dispel the heat through same casing, but right for image capture element The reaction of temperature is the sensitiveest, therefore can cause what image capture element cannot be real-time to obtain good heat radiation, To cause the image frame that cannot obtain good quality.
In sum, it is known that existed through casing image capture element since prior art is medium-term and long-term always Dispel the heat with treatment element simultaneously, cause image capture element radiating efficiency to be processed the impact of element And decline, the problem causing obtaining the image frame of good quality, it is therefore necessary to improvement is proposed Technological means, solves this problem.
Summary of the invention
Image capture element is dissipated with treatment element simultaneously because prior art exists through casing Heat, causes image capture element radiating efficiency to be processed the impact of element and decline, causes obtaining The problem of the image frame of good quality, the present invention then provides a kind of tool image capture element independently to dispel the heat and sets The supervising device of meter, wherein:
The supervising device of tool image capture element independence heat dissipation design provided by the present invention, it comprises: lead Body assembly and image-pickup assembly, wherein, body assembly further includes: process outside circuit board and main body Shell;Image-pickup assembly further includes: image capture element, cooling base, heat radiation outer housing and optical frames Head.
The process circuit board of body assembly is to receive image frame and process image frame;Main Body case has main body accommodation space, processes circuit board and is configured in main body accommodation space, at offer The heat radiation of reason circuit board.
The image capture element of image-pickup assembly is in order to pick-up image picture;Dissipating of image-pickup assembly Hot radical seat has first surface and second surface, and first surface is relative to second surface, in first surface Being provided with accommodation space, image capture element is fixed in accommodation space, and second surface is provided with multiple dissipating Hot fin, to provide image capture element heat radiation to be used, and cooling base is provided with through slot, through slot Running through first surface and second surface, wherein, image capture element is by through slot and process circuit board electricity Property connect, with offer process circuit board image frame;The heat radiation outer housing of image-pickup assembly have clamping part, Fixed part, camera lens perforate and camera lens fixed part, oneself heat radiation outer housing two ends of clamping part extend, and in order to incite somebody to action Cooling base is fixed on heat radiation outer housing, and when cooling base is fixed on heat radiation outer housing, image capture unit It is online that the center of part and the center of camera lens perforate are positioned at same axle, and heat radiation outer housing is picked with image Taking element laminating, to provide image capture element heat radiation to be used, wherein, image-pickup assembly is by fixing The main body cover of portion and body assembly is fixed, and forms heat radiation sky between image-pickup assembly and body assembly Between;The optical lens of image-pickup assembly is fixed on camera lens fixed part.
As above, and the difference between prior art is that the present invention is by main body to device provided by the present invention The separately design of assembly and image-pickup assembly, body assembly processes circuit board through main body cover offer and enters Row heat radiation, image-pickup assembly is then to provide image capture through cooling base and heat radiation outer housing simultaneously Element dispels the heat, and when body assembly combines with image-pickup assembly, at body assembly and image Also can form heat-dissipating space between acquisition component, use and provide the radiating fin on cooling base better Radiating effect, to improve the radiating effect to image capture element, and makes image capture element to obtain Individually heat radiation, uses the image frame obtaining good quality.
Through above-mentioned technological means, the present invention can reach image capture element and process circuit board respectively Dispel the heat, to promote image capture element and to process circuit board each radiating effect and obtain good quality Technology effect of image frame.
Accompanying drawing explanation
Fig. 1 is schematically shown as the stereo decomposing that the present invention has the supervising device of image capture element independence heat dissipation design Schematic diagram.
Fig. 2 is schematically shown as the body assembly that the present invention has the supervising device of image capture element independence heat dissipation design Three-dimensional combination schematic diagram.
Fig. 3 is schematically shown as the image capture that the present invention has the supervising device of image capture element independence heat dissipation design Assembly rear plan schematic diagram.
Fig. 4 is schematically shown as the image capture that the present invention has the supervising device of image capture element independence heat dissipation design Assembly solid combination schematic diagram.
Fig. 5 is schematically shown as the three-dimensional combination that the present invention has the supervising device of image capture element independence heat dissipation design Schematic diagram.
Fig. 6 is that the plane being schematically shown as the supervising device that the present invention has image capture element independence heat dissipation design regards Angle schematic diagram.
[main element symbol description]
10 body assemblies
11 process circuit board
12 main body covers
121 main body accommodation spaces
20 image-pickup assemblies
21 image capture element
22 cooling bases
221 first surfaces
222 second surfaces
223 accommodation spaces
224 radiating fins
225 through slots
23 heat radiation outer housings
231 clamping parts
232 fixed parts
233 camera lens perforates
234 camera lens fixed parts
235 screw parts
24 optical lens
31 heat-dissipating spaces
Detailed description of the invention
Embodiments of the present invention are described in detail, thereby to the present invention below in conjunction with graphic and embodiment How application technology means solve technical problem and reach the process that realizes of technology effect and can fully understand also Implement according to this.
Will be described below the supervising device of tool image capture element independence heat dissipation design provided by the present invention, And refer to shown in " Fig. 1 ", " Fig. 1 " is schematically shown as the present invention and has image capture element independence heat dissipation design The perspective exploded view of supervising device.
The supervising device of tool image capture element independence heat dissipation design provided by the present invention, it comprises: lead Body assembly 10 and image-pickup assembly 20, wherein, body assembly 10 further includes: process circuit board 11 And main body cover 12;Image-pickup assembly 20 further includes: image capture element 21, cooling base 22, Heat radiation outer housing 23 and optical lens 24.
The circuit board 11 that processes of body assembly 10 is the image capture element in order to self imaging acquisition component 20 Image frame image frame is processed is received in 21, and after the image frame after processing provides Continuous process, and process circuit board 11 and be configured in the main body cover 12 of body assembly 10, main Body case 12 has main body accommodation space 121 and is used in order to configure process circuit board 11, processes circuit board 11 is the main body accommodation space 121 being fixed and being configured at main body cover 12 through screw-in version, and Main body cover 12 be by high thermal conductivity coefficient metal material (such as: aluminium alloy, ferroalloy ... etc.) made Become, the most i.e. can will process heat energy produced by circuit board 11 chips in addition through main body cover 12 Conduct and dispel the heat.
It is configured at the main body accommodation space 121 of main body cover 12 with the master being combined into by processing circuit board 11 Body assembly 10 refer to shown in " Fig. 2 ", and " Fig. 2 " is schematically shown as the present invention and has image capture element independently The body assembly solid combination schematic diagram of the supervising device of heat dissipation design.
Please also refer to shown in " Fig. 1 " and " Fig. 3 ", " Fig. 3 " is schematically shown as the present invention to be had image and picks Take the image-pickup assembly rear plan schematic diagram of the supervising device of element independence heat dissipation design.
The image capture element 21 of image-pickup assembly 20 is in order to pick-up image picture, image capture unit Part 21 can be CCD specification or CMOS specification ... etc., at this by way of example only it, not with The application category of this limitation present invention, and the image frame that captured of image capture element 21 can provide to The circuit board 11 that processes of body assembly 10 carries out the process of image frame.
Then, the cooling base 22 of image-pickup assembly 20 has first surface 221 and second surface 222, and the second surface 222 of the first surface 221 of cooling base 22 and cooling base 22 is each other Two corresponding surfaces, that is when the first surface 221 of cooling base 22 is front, cooling base The second surface 222 of 22 is the back side.
The first surface 221 of cooling base 22 is provided with accommodation space 223, image-pickup assembly 20 Image capture element 21 snap fit or screw-in version can be used to be fixed in institute on first surface 221 In the accommodation space 223 being provided with, the second surface 222 of cooling base 22 is provided with multiple radiating fin 224, cooling base 22 be use high thermal conductivity coefficient metal material (such as: aluminium alloy, ferroalloy ... Deng) by made by die casting mode, in the manufacture process of cooling base 22, can be directly at first surface 221 are provided with accommodation space 223, and are provided with multiple radiating fin 224 on second surface 222, and consolidate In accommodation space 223, image capture element 21 i.e. can pass through the second surface 222 of cooling base 22 Heat energy is conducted and is dispelled the heat by the radiating fin 224 being provided with.
Being provided with through slot 225 at the two ends of cooling base 22 at one of them, through slot 225 is to run through The first surface 221 of cooling base 22 and the second surface 222 of cooling base 22, through slot 225 is to carry Image capture element 21 and the electricity processing circuit board 11 of body assembly 10 for image-pickup assembly 20 Property connect, using the image frame allowing image capture element 21 be captured can provide to body assembly 10 Process circuit board 11 and carry out the process of image frame.
Then, the heat radiation outer housing 23 of image-pickup assembly 20 has clamping part 231, fixed part 232, mirror Head perforate 233 and camera lens fixed part 234, clamping part 231 is to extend from heat radiation outer housing 23 two ends, and And with snap fit, cooling base 22 is fixed on heat radiation outer housing 23 through clamping part 231.
It should be noted that and be fixed on outside heat radiation with snap fit through clamping part 231 at cooling base 22 When covering 23, the center of image capture element 21 can be positioned at same with the center of camera lens perforate 233 One axle is online, uses the image of avoiding image capture element 21 the to be captured shadow by camera lens perforate 233 Ring.
Heat radiation outer housing 23 also be use high thermal conductivity coefficient metal material (such as: aluminium alloy, ferroalloy ... Deng) by made by die casting mode, in the manufacture process of cooling base 22, card can be formed the most respectively Button portion 231, fixed part 232, camera lens perforate 233 and camera lens fixed part 234, and at cooling base 22 When being fixed on heat radiation outer housing 23 through clamping part 231 with snap fit, heat radiation outer housing 23 also can be with image Capturing element 21 is fitted each other, and image capture element 21 is except adding heat energy through cooling base 22 With conduction and outside dispelling the heat, also can pass through heat radiation outer housing 23 and heat energy conducted and dispels the heat, Image capture element 21 further radiating effect is provided.
It addition, screw part 235 more can be comprised at clamping part 231, use so that cooling base 22 can be same Time by snap fit and screw-in version be fixed on heat radiation outer housing 23, thereby can further provide for cooling base 22 bed knifes being fixed on heat radiation outer housing 23, use and avoid the fatigue of snap-in structure to cause cooling base 22 displacements or rotation, in turn result in the center of image capture element 21 and the center of camera lens perforate 233 Position, position is positioned at not coaxial online so that image capture element 21 captures the image arrived by camera lens perforate The impact of 233.
Then, the optical lens 24 of image-pickup assembly 20 is solid through screw-in version or snap fit On the camera lens fixed part 234 of heat radiation outer housing 23, optical lens 24 i.e. can provide image capture unit Part 21 Radix Rumicis effect, Zoom effect ... wait functional effect.
And by image capture element 21, cooling base 22, heat radiation outer housing 23 and optical lens 24 in addition Image-pickup assembly 20 after combination refer to shown in " Fig. 4 ", and " Fig. 4 " is schematically shown as the present invention and has shadow Image-pickup assembly solid combination schematic diagram as the supervising device of capturing element independence heat dissipation design.
Then, refer to shown in " Fig. 5 " and " Fig. 6 ", " Fig. 5 " is schematically shown as the present invention and has image The three-dimensional combination schematic diagram of the supervising device of capturing element independence heat dissipation design;" Fig. 6 " is schematically shown as the present invention The plane angle schematic diagram of the supervising device of tool image capture element independence heat dissipation design.
Body assembly 10 and image-pickup assembly 20 are that the fixed part 232 by heat radiation outer housing 23 is to screw togather Mode is fixed, and the reference signal such as " figure after body assembly 10 and image-pickup assembly 20 are combined 5 " shown in.
It should be noted that and can form heat-dissipating space between body assembly 10 and image-pickup assembly 20 31, that is body assembly 10 after combining can't be closely sealed with image-pickup assembly 20, at body assembly The heat-dissipating space 31 formed between 10 and image-pickup assembly 20 also can improve the second of cooling base 22 The radiating effect of the radiating fin 224 that surface 222 is provided with, uses raising to image capture element 21 Radiating effect, heat-dissipating space 31 refer to shown in " Fig. 5 ".
In sum, it is known that the difference between the present invention and prior art is that the present invention is by body assembly And image-pickup assembly separately design, body assembly processes circuit board through main body cover offer and dissipates Heat, image-pickup assembly is then to provide image capture element through cooling base and heat radiation outer housing simultaneously Dispel the heat, and when body assembly combines with image-pickup assembly, at body assembly and image capture Also can form heat-dissipating space between assembly, use the heat radiation providing the radiating fin on cooling base better Effect, to improve the radiating effect to image capture element, and makes image capture element can obtain individually Heat radiation, use obtain good quality image frame.
Can solve to pass through casing existing for prior art to image capture element by this technological means Dispel the heat with treatment element simultaneously, cause image capture element radiating efficiency to be processed the impact of element And decline, the problem causing obtaining the image frame of good quality, and then reach image capture element Dispel the heat respectively with processing circuit board, each dispel the heat effect with processing circuit board promoting image capture element Fruit and the technology effect of image frame obtaining good quality.
Although embodiment provided by the present invention is as above, only described content also is not used to directly limit this The scope of patent protection of invention.Any persond having ordinary knowledge in the technical field of the present invention, is not taking off On the premise of spirit and scope provided by the present invention, and can do some in details implement in form The change permitted.The scope of patent protection of the present invention, must be with appended the defined person of claim still Accurate.

Claims (8)

1. having a supervising device for image capture element independence heat dissipation design, it comprises:
One body assembly, this body assembly further includes:
One processes circuit board, in order to receive an image frame and to process this image frame;And
One main body cover, this main body cover has a main body accommodation space, and this process circuit board is joined It is placed in this main body accommodation space, to provide the heat radiation of this process circuit board;And
One image-pickup assembly, this image-pickup assembly further includes:
One image capture element, in order to capture this image frame;
One cooling base, this cooling base has a first surface and a second surface, and this is first years old Surface, relative to this second surface, is provided with an accommodation space in this first surface, this image capture element Being fixed in this accommodation space, this second surface is provided with multiple radiating fin, to provide this image capture Element radiating is used, and this cooling base is provided with a through slot, and this through slot runs through this first surface With this second surface, wherein, this image capture element is electrically connected with this process circuit board by this through slot, To provide this this image frame of process circuit board, this cooling base is by the metal material institute of high thermal conductivity coefficient Make;
One heat radiation outer housing, this heat radiation outer housing have a clamping part, a fixed part, a camera lens perforate with And a camera lens fixed part, this clamping part extends from these heat radiation outer housing two ends, and in order to this cooling base is solid On this heat radiation outer housing, and when this cooling base is fixed on this heat radiation outer housing, this image capture element To be positioned at same axle online the center of center and this camera lens perforate, and this heat radiation outer housing and this shadow As capturing element is fitted, to provide the heat radiation of this image capture element to be used, wherein, this image-pickup assembly Fix by the main body cover of this fixed part with this body assembly, and this image-pickup assembly and this main body group Forming heat-dissipating space between part, what heat-dissipating space improved that this second surface of this cooling base is provided with dissipates Hot fin and the heat loss through convection effect of external environment condition;And
One optical lens, this optical lens is fixed on this camera lens fixed part.
2. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This main body cover is by made by the metal material of high thermal conductivity coefficient.
3. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This cooling base is with made by die casting mode.
4. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This heat radiation outer housing is by made by the metal material of high thermal conductivity coefficient.
5. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This heat radiation outer housing is with made by die casting mode.
6. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This clamping part further includes a screw part, so that this cooling base is fixed on screw-in version by snap fit On this heat radiation outer housing.
7. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This image-pickup assembly is fixed with the main body cover of screw-in version with this body assembly by this fixed part.
8. the supervising device having image capture element independence heat dissipation design as claimed in claim 1, wherein This image capture element is by being to be formed with this process circuit board through this through slot through winding displacement mode electrically to connect Connecing, this image capture element is to provide this this image frame of process circuit board.
CN201210082393.6A 2012-03-26 2012-03-26 The supervising device of tool image capture element independence heat dissipation design Active CN103369210B (en)

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CN103369210B true CN103369210B (en) 2016-12-14

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107113371B (en) 2015-11-23 2020-06-05 深圳市大疆创新科技有限公司 Image acquisition module and aerial photography aircraft
CN109274881B (en) * 2018-11-29 2021-01-08 维沃移动通信有限公司 Lens support, camera module and terminal

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Publication number Priority date Publication date Assignee Title
CN101141566A (en) * 2006-09-05 2008-03-12 索尼株式会社 Camera shake correction mechanism and image capture apparatus
CN101163200A (en) * 2006-10-11 2008-04-16 索尼株式会社 Image-capture apparatus
CN101539711A (en) * 2008-03-19 2009-09-23 卡西欧计算机株式会社 Digital camera
JP2012047798A (en) * 2010-08-24 2012-03-08 Canon Inc Electronic apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101141566A (en) * 2006-09-05 2008-03-12 索尼株式会社 Camera shake correction mechanism and image capture apparatus
CN101163200A (en) * 2006-10-11 2008-04-16 索尼株式会社 Image-capture apparatus
CN101539711A (en) * 2008-03-19 2009-09-23 卡西欧计算机株式会社 Digital camera
JP2012047798A (en) * 2010-08-24 2012-03-08 Canon Inc Electronic apparatus

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