JP2014042954A - Ｍｅｍｓ素子、電子機器、およびｍｅｍｓ素子の製造方法 - Google Patents

Ｍｅｍｓ素子、電子機器、およびｍｅｍｓ素子の製造方法 Download PDF

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Publication number
JP2014042954A
JP2014042954A JP2012186181A JP2012186181A JP2014042954A JP 2014042954 A JP2014042954 A JP 2014042954A JP 2012186181 A JP2012186181 A JP 2012186181A JP 2012186181 A JP2012186181 A JP 2012186181A JP 2014042954 A JP2014042954 A JP 2014042954A
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Japan
Prior art keywords
layer
insulating layer
wiring
mems
sacrificial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012186181A
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English (en)
Japanese (ja)
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JP2014042954A5 (https=
Inventor
Yoji Kitano
洋司 北野
Takuya Kinugawa
拓也 衣川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012186181A priority Critical patent/JP2014042954A/ja
Priority to US13/966,384 priority patent/US20140054729A1/en
Publication of JP2014042954A publication Critical patent/JP2014042954A/ja
Publication of JP2014042954A5 publication Critical patent/JP2014042954A5/ja
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012186181A 2012-08-27 2012-08-27 Ｍｅｍｓ素子、電子機器、およびｍｅｍｓ素子の製造方法 Withdrawn JP2014042954A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012186181A JP2014042954A (ja) 2012-08-27 2012-08-27 Ｍｅｍｓ素子、電子機器、およびｍｅｍｓ素子の製造方法
US13/966,384 US20140054729A1 (en) 2012-08-27 2013-08-14 Mems device, electronic apparatus, and manufacturing method of mems device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012186181A JP2014042954A (ja) 2012-08-27 2012-08-27 Ｍｅｍｓ素子、電子機器、およびｍｅｍｓ素子の製造方法

Publications (2)

Publication Number Publication Date
JP2014042954A true JP2014042954A (ja) 2014-03-13
JP2014042954A5 JP2014042954A5 (https=) 2014-05-01

Family

ID=50147269

Family Applications (1)

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JP2012186181A Withdrawn JP2014042954A (ja) 2012-08-27 2012-08-27 Ｍｅｍｓ素子、電子機器、およびｍｅｍｓ素子の製造方法

Country Status (2)

Country Link
US (1) US20140054729A1 (https=)
JP (1) JP2014042954A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111924797A (zh) * 2020-09-29 2020-11-13 深圳市海谱纳米光学科技有限公司 一种具有可动镜面的法珀腔器件及其制作工艺

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015174150A (ja) * 2014-03-13 2015-10-05 株式会社東芝 Ｍｅｍｓデバイスおよびその製造方法
TWI610406B (zh) * 2015-02-09 2018-01-01 精材科技股份有限公司 晶片封裝體與其製備方法
US10618801B2 (en) * 2016-11-10 2020-04-14 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS structure with bilayer stopper and method for forming the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035290A (ja) * 2005-07-22 2007-02-08 Hitachi Ltd スイッチ、半導体装置およびその製造方法
JP2010129371A (ja) * 2008-11-27 2010-06-10 Toshiba Corp スイッチ及びｅｓｄ保護素子
JP2010158734A (ja) * 2009-01-07 2010-07-22 Seiko Epson Corp Ｍｅｍｓデバイス及びその製造方法
JP2011049303A (ja) * 2009-08-26 2011-03-10 Toshiba Corp 電気部品およびその製造方法
JP2011223470A (ja) * 2010-04-13 2011-11-04 Seiko Epson Corp Ｍｅｍｓデバイス、電子機器
US20120098074A1 (en) * 2010-10-21 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Mems device with release aperture

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011189423A (ja) * 2010-03-12 2011-09-29 Seiko Epson Corp Ｍｅｍｓ素子および発振器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035290A (ja) * 2005-07-22 2007-02-08 Hitachi Ltd スイッチ、半導体装置およびその製造方法
JP2010129371A (ja) * 2008-11-27 2010-06-10 Toshiba Corp スイッチ及びｅｓｄ保護素子
JP2010158734A (ja) * 2009-01-07 2010-07-22 Seiko Epson Corp Ｍｅｍｓデバイス及びその製造方法
JP2011049303A (ja) * 2009-08-26 2011-03-10 Toshiba Corp 電気部品およびその製造方法
JP2011223470A (ja) * 2010-04-13 2011-11-04 Seiko Epson Corp Ｍｅｍｓデバイス、電子機器
US20120098074A1 (en) * 2010-10-21 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Mems device with release aperture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111924797A (zh) * 2020-09-29 2020-11-13 深圳市海谱纳米光学科技有限公司 一种具有可动镜面的法珀腔器件及其制作工艺

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Publication number Publication date
US20140054729A1 (en) 2014-02-27

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