JP2014020811A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a time required for re-inspection.SOLUTION: In the re-inspection of Ka pieces of substrates P among 4×4=16 pieces of substrates P partitioned on one face of a substrate 20, such conditions that the probing of each of all probes in 2×2=4 pieces of probe arrangement regions in a fixture 4 for inspection is performed to any inspection point are satisfied, and first processing of performing the probing of each probe to each inspection point in order to perform the probing of each probe in a probe arrangement region positioned at the edge of a preliminarily specified side (for example, left lower side) among four probe arrangement regions to each inspection point in the substrate P positioned at the edge of the same side (left lower side) as the preliminarily specified side among the Ka pieces of substrates P, second processing of inspecting inspection points in Kb pieces of substrates P as the object of re-inspection in which the probing of each probe is performed to each inspection point; and third processing of obtaining Kc pieces of substrates P excluding the Kb pieces of substrates whose re-inspection is completed as new Ka pieces of substrates P are repeatedly executed in this order until Ka=0.

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting an inspection target substrate in which a plurality of inspection target regions in which inspection points are defined with the same arrangement are defined.

  As this type of board inspection apparatus (board inspection method), the applicant has disclosed a circuit board inspection apparatus (circuit board inspection method) in Japanese Patent Application Laid-Open No. 2009-80061. As an example, this circuit board inspection apparatus (hereinafter also simply referred to as “inspection apparatus”) is multifaceted to one workpiece (partitioned on one surface of the workpiece) 5 × 6 (5 rows and 6 columns) = 30 In order to be able to inspect the same kind of circuit boards, adjacent 3 × 2 (3 rows and 2 columns) = 6 circuit boards (or adjacent 2 × 3 (2 rows and 3 columns) = 6 circuit boards) On the other hand, a configuration is employed in which an inspection head having a plurality of probes arranged in six groups so as to be probable simultaneously is used. Further, in this inspection apparatus, the above-mentioned 5 × 6 = 30 circuit boards are blocked into five blocks (board groups) composed of 3 × 2 = 6 (or 2 × 3 = 6) circuit boards. In other words, a configuration is adopted in which each probe of the inspection head is probed for each block, and inspection points on the circuit board are sequentially inspected.

  Specifically, in this inspection apparatus, prior to the start of inspection, as an example, the above-mentioned 5 × 6 = 30 circuit boards are sequentially blocked from the lower left corner of the workpiece. More specifically, 3 × 2 = 6 circuit boards belonging to the first column and the second column from the first row to the third row are defined as a block A, and the third column from the first row to the third row. And 3 × 2 = 6 circuit boards belonging to the fourth column are block B, and 3 × 2 = 6 circuit boards belonging to the fifth and sixth columns from the first row to the third row are block C. 2 × 3 = 6 circuit boards belonging to the 4th and 5th rows from the 1st column to the 3rd column are referred to as a block D, and the 4th and 5th rows belong to the 4th to 6th columns. Let 2 × 3 = 6 circuit boards be block E.

  Next, by moving the inspection head toward the work held by the holding mechanism, the probes belonging to the six groups are first probed on the six circuit boards belonging to the block A. Subsequently, the measurement unit measures the current value of the current flowing between the pair of probes according to the procedure defined in advance, and the processing unit determines the pair of the above based on the measurement result of the measurement unit. The inspection point where the probe is probed is inspected for quality (insulation state). The current value measurement by the measurement unit and the non-defective product inspection by the processing unit are sequentially executed for all the inspection points defined on the six circuit boards belonging to the block A, so that the circuit boards belonging to the block A can be detected. The quality is inspected. Thereafter, the circuit boards belonging to the blocks B to E are inspected in the same manner as the circuit boards belonging to the block A. Thereby, the inspection of 5 × 6 = 30 circuit boards is completed.

Japanese Patent Laying-Open No. 2009-80061 (page 4-8, FIG. 1-11)

  However, the inspection apparatus (inspection method) disclosed by the applicant has the following problems to be improved. In other words, in the inspection apparatus (inspection method) disclosed by the applicant, each circuit board is sequentially blocked starting from the lower left corner of the workpiece, so that the position of the block for probing each probe of the inspection head and the probing A configuration (method) that defines the order is employed. In this case, when inspecting this type of workpiece (inspection target board), some of the circuit boards (inspection target areas) may be inspected as defective, and the circuit board may need to be reinspected. Specifically, as a result of the above inspection, as an example, the circuit board in the third row and the second column, the circuit board in the second row and the fourth column, the circuit board in the third row and the fifth column, the circuit board in the fourth row and the third column, When the circuit board in the 4th row and the 4th column is inspected as defective (an example in which one or more defective portions exist in each block), a re-inspection process for these five circuit boards is performed. Run.

  At this time, in the inspection apparatus disclosed by the applicant, the circuit board in the third row and the second column is re-inspected with the inspection head (probe) probed on the six circuit boards belonging to the block A, and the block The circuit board in the second row and the fourth column is re-inspected in the state where the inspection heads are probed on the six circuit boards belonging to B, and the third row in the state where the inspection heads are probed on the six circuit boards belonging to the block C. The circuit board in the fifth column is re-inspected, and the circuit board in the fourth row and the third column is re-inspected in a state where the inspection head is probed to the six circuit boards belonging to the block D, and the six circuits belonging to the block B The circuit board in the fourth row and the fourth column is re-inspected in a state where the inspection head is probed on the substrate. As a result, for example, when there is a circuit board that is erroneously inspected as a defect because a foreign object is sandwiched between the inspection point and the probe, the circuit board is inspected as a non-defective product.

  However, in the inspection apparatus (inspection method) disclosed by the applicant, when the circuit board inspected as defective exists in a plurality of blocks as in the above example, the block in which the circuit board inspected as defective exists. Therefore, it is necessary to perform the process of moving the inspection heads by the number of probes to probe each probe. For this reason, in the inspection apparatus (inspection method) disclosed by the applicant, it is difficult to shorten the time required for reinspecting the circuit board, and it is preferable to improve this point.

  The present invention has been made in view of the problems to be improved, and a main object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method capable of sufficiently shortening the time required for re-inspection.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1 is configured to arrange a plurality of inspection points respectively defined in a plurality of inspection target areas partitioned on one surface of the inspection target substrate in each inspection target area. Accordingly, an inspection jig in which a plurality of inspection probes are arranged, and at least one of the inspection jig and the inspection target substrate is moved with respect to the other, and the inspection probes are used as the inspection points. A moving mechanism for probing, an inspection unit for inspecting each inspection point based on an electric signal inputted / outputted to / from each of the inspection points in the inspection target region via the inspection probes, and the movement A control unit that controls the at least one movement by a mechanism and the inspection of each inspection point by the inspection unit, and the inspection jig is in a first direction Each inspection point is defined such that the number of strokes is Na and the number of sections along the second direction intersecting with the first direction is Nb and the arrangement is the same (Na × Nb) (Na and Nb are both natural numbers and at least one satisfies the condition of 4 or more) (Ma × Mb) (Ma is Na or less) It is a natural number and is a number along the first direction, Mb is a natural number equal to or less than Nb and is a number along the second direction, and at least one of Ma and Mb is 2 or more. (La × Lb) pieces (La is in a third direction corresponding to the first direction) so that the inspection probes can be probed at the inspection points in the inspection target region. The number of sections along the line, Ma The same number, and Lb is the number of sections along the fourth direction corresponding to the second direction and the same number as Mb), and the probe for each inspection in the same arrangement Is arranged, and the control unit controls the moving mechanism to place the inspection probes of the inspection jig at the inspection points in the (Na × Nb) inspection target regions. A substrate inspection apparatus that controls each inspection point by sequentially inspecting each inspection point while probing sequentially, wherein the control unit includes Ka (Ka is a natural number of Na × Nb or less) of the inspection target regions. At the time of re-inspection, all the inspection probes in the (La × Lb) probe placement regions are in the inspection target region in any of the (Na × Nb) inspection target regions. When probed to each inspection point The (La × Lb) probe placement areas are satisfied at the respective inspection points in the inspection target area located at a predetermined end of the Ka inspection target areas. And controlling the moving mechanism so that each of the inspection probes in the probe disposition region located at the end on the same side as the predetermined side is probed with respect to the at least one side with respect to the other side. A first process of probing each inspection probe to each inspection point, and controlling the inspection unit to re-examine the Kb pieces (Kb) to be re-inspected. Is a natural number less than or equal to Ka) before the second process for inspecting the inspection point in the inspection target area and re-inspection of the Ka inspection target areas is completed. The third process of setting the Kc inspection target areas excluding Kb to the new Ka inspection target areas is repeated in this order until Ka = 0.

  According to a second aspect of the present invention, there is provided a substrate inspection method comprising: a plurality of inspection points each defined in a plurality of inspection target regions partitioned on one surface of the inspection target substrate, in accordance with an arrangement in each inspection target region; Each inspection probe in a state where at least one of the inspection jig on which the inspection probe is disposed and the inspection target substrate is moved with respect to the other and the inspection probe is probed to the inspection point When the inspection points are inspected based on the electric signal inputted / outputted to / from each inspection point in the inspection object area via Na, the number of sections along the first direction is Na. The inspection points are defined so that the number of sections along the second direction intersecting the direction of 1 is Nb and the same arrangement is obtained (Na × Nb). (Na and Nb are both natural numbers and at least one satisfies the condition of 4 or more) (Ma × Mb) (Ma is a natural number of Na or less) out of the inspection target regions. The number along the first direction, Mb is a natural number equal to or less than Nb and the number along the second direction, and at least one of Ma and Mb is 2 or more. (La × Lb) pieces (La is a section along the third direction corresponding to the first direction) so that the inspection probes can be probed at the inspection points in the inspection target area of the number to be satisfied. The same number as Ma, and Lb is the same number for each of the probe placement regions of the fourth direction corresponding to the second direction and the same number as Mb) Each of the inspection probes is arranged in Using the inspection jig, inspecting each inspection point while sequentially probing the inspection probes of the inspection jig to the inspection points in the (Na × Nb) inspection object regions A method of inspecting a substrate, wherein, when re-inspecting Ka areas (Ka is a natural number equal to or less than Na × Nb), all the inspections in the (La × Lb) probe placement areas are performed. The condition that the probe is probed to each inspection point in any one of the (Na × Nb) inspection target areas and the Ka inspection target areas are satisfied End of the (La × Lb) number of probe placement areas on the same side as the predetermined side at each inspection point in the inspection target area located at the end of the predetermined side Located in A first process for probing each inspection probe to each inspection point by moving at least one of the inspection probes in the lobe arrangement region with respect to the other so that the inspection probes are probed; A second process for inspecting the inspection points in the inspection target area of Kb pieces (Kb is a natural number equal to or less than Ka) whose re-inspection targets are probed to the inspection points, and the Ka inspection targets. The third process of setting the Kc inspection target areas excluding the Kb pieces of the reexamination among the areas to be the new Ka inspection target areas is repeated in this order until Ka = 0. Run.

  In the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 2, an inspection is performed at the time of re-inspecting Ka of (Na × Nb) inspection target areas partitioned on one surface of the inspection target substrate. The condition that all the inspection probes in the (La × Lb) probe placement areas in the jig for the probe are probed to each inspection point in any of the inspection target areas is satisfied, and Ka pieces At each inspection point in the inspection target region located at the end on the predetermined side of the inspection target region, at the end on the same side as the predetermined side of the (La × Lb) probe arrangement regions Each inspection probe is probed to each inspection point by moving at least one of the inspection jig and the substrate to be inspected relative to the other so that each inspection probe in the located probe placement region is probed. First processing, second processing for inspecting inspection points in Kb inspection target areas to be inspected by probing the inspection probe to inspection points, and re-inspection of Ka inspection target areas The third process of setting the Kc inspection target areas excluding Kb having completed the above to new Ka inspection target areas is repeated in this order until Ka = 0.

  Therefore, according to the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 2, depending on the position of the inspection target region to be reinspected on the inspection target substrate, reinspection of Ka inspection target regions is performed. The number of probing times can be set to a small number of times, and even when the number of probing times is the largest number of times, probing exceeding the same number of times as the inspection apparatus disclosed by the applicant is not required. The time required for re-inspection can be sufficiently shortened. In addition, since the number of probing times during the re-inspection process can be reduced to a small number, the service life of the inspection probe can be extended sufficiently, and a larger number of inspection target substrates can be inspected at a lower cost.

1 is a block diagram showing a configuration of a substrate inspection apparatus 1. FIG. It is explanatory drawing for demonstrating the position of each probe arrangement | positioning area | region A-A1, A-A2, A-B1, and A-B2 in the jig | tool 4 for inspection. The position of each substrate P-A1 to P-A4, P-B1 to P-B4, P-C1 to P-C4, P-D1 to P-D4, and the position of the inspection jig 4 on the inspection target substrate 20 It is explanatory drawing for demonstrating the relationship. It is explanatory drawing for demonstrating the probing position of the test | inspection jig | tool 4 at the time of re-inspection when the board | substrates P-B2 and P-C3 are test | inspected as defect. It is explanatory drawing for demonstrating the probing position of the test | inspection jig | tool 4 at the time of re-inspection when the board | substrates P-B1, P-B3, P-C2, and P-C4 are test | inspected as defective. It is explanatory drawing for demonstrating the probing position of the test | inspection jig | tool 4 at the time of re-inspection when the board | substrates P-B2, P-B4, P-C1, and P-C3 are test | inspected as a defect. It is explanatory drawing for demonstrating the probing position of the test | inspection jig | tool 4 at the time of a re-inspection when the board | substrate P-A1, P-A4, P-D1, and P-D4 are test | inspected as a defect. It is explanatory drawing for demonstrating the probing position of the test | inspection jig | tool 4 at the time of the re-inspection of the test object board | substrate 20a in which the board | substrates P-B1 and P-C2 were test | inspected as defective. It is explanatory drawing for demonstrating the probing position of the test | inspection jig | tool 4a at the time of the re-inspection of the test object board | substrate 20b by which board | substrate P-B1, P-C1 was test | inspected as defect.

  Embodiments of a substrate inspection apparatus and a substrate inspection method according to the present invention will be described below with reference to the accompanying drawings.

  A substrate inspection apparatus 1 shown in FIG. 1 is an inspection apparatus configured to be able to electrically inspect a substrate 20 to be inspected according to a “substrate inspection method” to be described later, and includes a substrate holding unit 2, a moving mechanism 3, an inspection treatment. It comprises a tool 4, an inspection unit 5, an operation unit 6, a display unit 7, a control unit 8, and a storage unit 9. In this case, the inspection target substrate 20 is a multi-sided substrate (multi-piece substrate) which is an example of the “inspection target substrate”, and as shown in FIG. 3, the substrates P-A1 to P-A4 and P-B1 to P1-B1. P-B4, P-C1 to P-C4, P-D1 to P-D4 (hereinafter, also simply referred to as “substrate P” when not distinguished from each other) are arranged in 4 rows and 4 columns.

  Further, in this inspection target substrate 20, wiring patterns are formed in the same arrangement in each substrate P (not shown), and in order to inspect the quality of these wiring patterns, the same arrangement in each substrate P. A plurality of inspection points are defined respectively. In this case, in the inspection target substrate 20 of this example, each substrate P corresponds to an “inspection target region”. Therefore, the inspection target substrate 20 has a partition number along the “first direction (as an example, the left-right direction in the figure)” with Na = 4 and the “second direction” intersecting the “first direction”. (In this example, the vertical direction in the figure) corresponds to an “inspection target substrate” in which 4 × 4 = 16 “inspection target regions” are divided so that the number of divisions along Nb = 4.

  On the other hand, the substrate holding unit 2 holds the inspection target substrate 20 under the control of the control unit 8. The moving mechanism 3 is disposed in the inspection jig 4 by moving the inspection jig 4 toward the inspection target substrate 20 held by the substrate holding unit 2 under the control of the control unit 8. Each inspection probe 10 (see FIG. 1) is probed to an inspection point in each substrate P on the inspection target substrate 20 (the “inspection jig and at least one of the inspection target substrates” is a configuration of “inspection jig”. Example). The inspection jig 4 is provided with a plurality of inspection probes 10 according to the arrangement of the inspection points defined in the substrates P provided on one surface of the inspection target substrate 20 in the substrate P. Configured.

  Specifically, as shown in FIG. 2, the inspection jig 4 has a “first direction (in this example, a diagram of 4 × 4 = 16 substrates P) provided on the inspection target substrate 20. 3 in the left-right direction in FIG. 3) × “Mb = 2 in the second direction (for example, in the up-down direction in FIG. 3)” = respectively defined in four substrates P The probe 10 for inspection (see FIG. 1) can be probed at the inspection point, and the number of sections along the “third direction (in this example, the horizontal direction in FIG. 2) corresponding to the“ first direction ”is La = 2 and 4th direction corresponding to the “second direction”. In this example, the number of divisions along the vertical direction in FIG. 2 is L × Lb = 4. Probe placement areas A-A1, A-A2, A-B1, A-B2 (hereinafter referred to as “probe” Inspection probe 10 also referred) each in the same arrangement as the region where A 'is constituted is arranged.

  The inspection unit 5 controls each inspection point in the four substrates P on which each inspection probe 10 is probed via each inspection probe 10 of the inspection jig 4 under the control of the control unit 8. Each inspection point is sequentially inspected based on the electric signal input / output in this manner, and inspection result data D indicating the inspection result is output to the control unit 8. The operation unit 6 includes various operation switches for setting operation conditions (inspection conditions) of the substrate inspection apparatus 1, and outputs an operation signal corresponding to the switch operation to the control unit 8. Under the control of the control unit 8, the display unit 7 notifies an operation condition setting screen for setting an operation condition (inspection condition) of the substrate inspection apparatus 1 and an inspection result for the inspection target substrate 20 (substrate P). Various display screens (all not shown) such as an inspection result notification screen are displayed.

  The control unit 8 comprehensively controls the substrate inspection apparatus 1. Specifically, the control unit 8 controls the moving mechanism 3 to move the inspection jig 4 toward the inspection target substrate 20 held by the substrate holding unit 2. Each of the inspection probes 10 in the above-described four probe placement areas A of the inspection jig 4 is probed on any four of the 16 substrates P. Further, the control unit 8 controls the inspection unit 5 to electrically inspect the inspection target substrate 20 (substrate P). Furthermore, the control unit 8 performs re-inspection processing for the substrate P when any of the 16 substrates P is inspected based on the inspection result data D output from the inspection unit 5. Run. The storage unit 9 stores an operation program of the control unit 8, inspection result data D output from the inspection unit 5, and the like.

  When inspecting the inspection target substrate 20 by the substrate inspection apparatus 1, first, the inspection target substrate 20 is held by the substrate holding unit 2. Next, an inspection process is started by operating a start switch (not shown) of the operation unit 6. At this time, the control unit 8 controls the moving mechanism 3 to, as shown in FIG. 3, for example, the substrates P-A1, P-A2, out of the 16 substrates P of the inspection target substrate 20. The inspection probes 10 in the probe placement areas A-A1, A-A2, A-B1, and A-B2 in the inspection jig 4 are probed to the inspection points in the four inspection points P-B1 and P-B2, respectively. . Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrates P-A1, P-A2, P-B1, and P-B2. At this time, the inspection unit 5 inspects the quality of each substrate P and outputs inspection result data D indicating the inspection result to the control unit 8. In addition, the control unit 8 sequentially stores the inspection result data D output from the inspection unit 5 in the storage unit 9.

  Next, when the inspection on the four substrates P is completed, the control unit 8 controls the moving mechanism 3 to, for example, the substrate among the 12 substrates P that are not inspected. Each inspection probe 10 in the probe placement region A in the inspection jig 4 is probed to each inspection point in four of P-A3, P-A4, P-B3, and P-B4, and the inspection unit 5 To inspect each inspection point in each substrate P. Thereby, the inspection of four substrates P-A3, P-A4, P-B3, and P-B4 is completed, and the inspection result data D is stored in the storage unit 9. Subsequently, the control unit 8 controls the moving mechanism 3 to, for example, the substrates P-C1, P-C2, P-D1, and P-D2 among the eight substrates P that are not inspected. Each of the four inspection points is probed with each inspection probe 10 in the probe placement area A of the inspection jig 4, and the inspection unit 5 is controlled to inspect each inspection point in each substrate P. . Thereby, the inspection of the four substrates P-C1, P-C2, P-D1, and P-D2 is completed, and the inspection result data D is stored in the storage unit 9.

  Next, the control unit 8 controls the moving mechanism 3 to inspect each inspection point on the four substrates P-C3, P-C4, P-D3, and P-D4 that are not inspected. 4, each inspection probe 10 in the probe placement area A is probed, and each inspection point in each substrate P is inspected by controlling the inspection unit 5. As a result, the inspection for the four substrates P-C3, P-C4, P-D3, and P-D4 is completed, and the inspection result data D for all the 16 substrates P is stored in the storage unit 9. The Subsequently, based on the inspection result data D stored in the storage unit 9, the control unit 8 has a substrate P on which one of the 16 substrates P in the inspection target substrate 20 has an inspection point inspected as defective. It is determined whether or not to do so. At this time, when there is no inspection point inspected as defective on any of the substrates P, the control unit 8 determines that the inspection target substrate 20 is a non-defective product and displays the determination result on the display unit 7 for inspection. The process ends.

  When there is an inspection point inspected as defective on any of the 16 substrates P, the control unit 8 performs re-inspection processing for the substrate P on which the inspection point inspected as defective exists. Run. In this case, in the substrate inspection apparatus 1, when any one of the 16 substrates P is re-inspected, the re-inspection target substrate P is the substrate P-A1, P-A2, P-B1, P. In any case of -B2, each inspection probe 10 in each probe placement region A in the inspection jig 4 is probed to each inspection point in the four substrates P, and the substrate P to be reinspected is When one of the substrates P-A3, P-A4, P-B3, and P-B4, each inspection point in each of the four substrates P is used for each inspection in each probe placement region A in the inspection jig 4. Each probe 10 is probed, and when the substrate P to be re-inspected is any one of the substrates P-C1, P-C2, P-D1, and P-D2, each of the inspection points in the four substrates P is used for inspection. Each probe placement area A in the jig 4 When each of the inspection probes 10 is probed and the substrate P to be re-inspected is one of the substrates P-C3, P-C4, P-D3, and P-D4, each inspection point in the four substrates P Then, each inspection probe 10 in each probe placement area A in the inspection jig 4 is probed, and each inspection point in the substrate P to be reinspected is inspected in the same manner as in the first inspection.

  On the other hand, in this substrate inspection apparatus 1, when there are inspection points inspected as defective on any two or more of the 16 substrates P, the four probe arrangements in the inspection jig 4 are arranged. The substrate P to be re-inspected is within a range where the “condition” that all the inspection probes in the installation area A are probed to the inspection point in any one of the 16 substrates P is satisfied. Is programmed to change the probing position of the inspection jig 4 with respect to the inspection target substrate 20 in accordance with the position of the inspection object.

  Specifically, when it is determined that there is an inspection point inspected as defective on two or more substrates P, the control unit 8 is positioned, for example, on the lowermost left side of the substrates P to be reinspected. Inspection jig 4 at each inspection point in the substrate P (the substrate P having the smallest number of substrates P existing between the substrate P-A1: “predetermined side” is “lower left side”) Probing mode A for probing each inspection probe 10 in the probe arrangement area A-A1 (the lowermost left probe arrangement area A) of the four probe arrangement areas A in FIG. Within the substrate P located on the upper right side of P (the substrate P having the smallest number of substrates P existing between the substrate P-D4: an example in which “predetermined side” is “upper right side”) 4 probes in the inspection jig 4 are arranged at each inspection point. Probing mode B for probing each inspection probe 10 in the probe placement area A-B2 (the uppermost right probe placement area A) in the area A, and the leftmost upper side of each substrate P to be retested For inspection at each inspection point in the substrate P located at (the substrate P having the smallest number of substrates P existing between the substrates P-A4: “predetermined side” is “upper left”)) Probing mode C for probing each inspection probe 10 in the probe arrangement area A-A2 (upper left probe arrangement area A) of the four probe arrangement areas A in the tool 4, and a retest object The substrate P (the substrate P having the smallest number of substrates P existing between the substrate P-D1 and the “predetermined side” is the “lower right side”). Example) for inspection at each inspection point in In the order of the probing mode D for probing each inspection probe 10 in the probe arrangement area A-B1 (the lowermost right probe arrangement area A) of the four probe arrangement areas A in the tool 4, It is determined whether or not the above “condition” is satisfied, and the inspection jig 4 is first probed in a state where it is determined that the above “condition” is satisfied.

  In this substrate inspection apparatus 1, as an example, when there are a plurality of substrates P to be reinspected with the smallest number of substrates P existing between the substrates P-A1, the lowermost of the substrates P A mode in which each inspection probe 10 in the probe placement area A-A1 in the inspection jig 4 is probed to each inspection point in the substrate P located at the position P is a probing mode A, and exists between the substrate P-D4. When there are a plurality of substrates P to be reinspected with the smallest number of substrates P to be inspected, the probe placement region A in the inspection jig 4 is placed at each inspection point in the substrate P located on the uppermost side of the substrates P. A mode in which each inspection probe 10 in B2 is probed is a probing mode B, and there are a plurality of substrates P to be re-inspected with the least number of substrates P existing between the substrates P-A4. In some cases, a mode in which each inspection probe 10 in the probe placement area A-A2 in the inspection jig 4 is probed to each inspection point in the substrate P located on the uppermost side of the substrate P is a probing mode C. When there are a plurality of substrates P to be re-inspected with the smallest number of substrates P existing between the substrates P-D1, each inspection point in the substrate P located on the lowermost side of the substrates P A configuration in which the probe probe D is used as the probe probe for each probe 10 in the probe placement region A-B1 in the inspection jig 4 is employed.

  More specifically, as shown in FIG. 4, when there are inspection points inspected as defective on two of the 16 substrates P, that is, the substrates P-B2 and P-C3 (“Ka = 2”). ), The control unit 8 is located at the lower leftmost substrate P-B2 of the substrates P-B2 and P-C3 (the end of a predetermined side of “Ka inspection target regions”). It is determined that the above “condition” is satisfied when probing each inspection probe 10 in the probe placement region A-A1 on the lowermost left side in the inspection jig 4 as an example of “inspection region”. Each inspection probe 10 in each probe placement area A in the inspection jig 4 is probed to each inspection point in the four substrates P-B2, P-B3, P-C2, and P-C3 (probing mode) A: An example of “first processing”). In FIG. 5 and FIG. 5 to be referred to later, “x” is drawn on the substrate P on which the inspection points inspected as defective are present.

  Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrate P-B2 via each inspection probe 10 in the probe placement area A-A1. Subsequently, the control unit 8 has the probe arrangement area A of the inspection probe 10 probed on the substrate P to be reinspected in the three probe arrangement areas A excluding the probe arrangement area A-A1. It is determined whether or not to do so. In this example, since the substrate P-C3 on which each of the inspection probes 10 in the probe arrangement area A-B2 is probed is a reinspection object, the control unit 8 controls the inspection unit 5 to control the probe arrangement area. Each inspection point in the substrate P-C3 is inspected via each inspection probe 10 in A-B2. Subsequently, the control unit 8 counts the number excluding Kb = 2 of the Ka = 2 substrates P that have completed reinspection (the number of substrates P that have not been reinspected: Kc: new Ka) ) Is zero (an example of “third process”), and the re-inspection process for the inspection target substrate 20 is completed.

  Further, as shown in FIG. 5, when inspection points inspected as defective are present on four of the sixteen substrates P-B1, P-B3, P-C2, and P-C4 (“ In the example of “Ka = 4”), the control unit 8 sets the lower leftmost substrate P-B1 among these substrates P (“inspection located at a predetermined end of“ Ka inspection target regions ”). It is determined that the above “condition” is satisfied when each inspection probe 10 in the probe placement area A-A1 in the inspection jig 4 is probed to another example of “target region”, and the substrate P- Each inspection probe 10 in each probe placement area A in the inspection jig 4 is probed to each inspection point in B1, P-B2, P-C1, and P-C2 (probing mode A: “ Another example of “first process”). Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrate P-B1 via each inspection probe 10 in the probe placement area A-A1.

  Subsequently, the control unit 8 determines that the substrate P-C2 on which each of the inspection probes 10 in the probe arrangement area A-B2 is probed is a reinspection target, and controls the inspection section 5 to control the probe arrangement area. Each inspection point in the substrate P-C2 is inspected via each inspection probe 10 in A-B2. Next, the control unit 8 sets Kc = 2 substrates P-B3, P-C4 excluding Kb = 2 substrates P-B1, P-C2 which have completed re-inspection among Ka = 4 substrates P. Are the new Ka = 2 reinspection objects (another example of “third process”).

  Subsequently, the control unit 8 causes each inspection probe 10 in the probe placement area A-A1 in the inspection jig 4 to be probed to the lower left substrate P-B3 among the substrates P to be reinspected. At this time, it is determined that the above "condition" is satisfied, and each probe placement area A in the inspection jig 4 is added to each inspection point in the four substrates P-B3, P-B4, P-C3, and P-C4. Each of the inspection probes 10 is probed (probing mode A: yet another example of “first processing”). Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrate P-B3 via each inspection probe 10 in the probe placement area A-A1.

  Subsequently, the control unit 8 determines that the substrate P-C4 on which the probes 10 for inspection in the probe arrangement areas A-B2 are probed is a reinspection target, and controls the inspection section 5 to control the probe arrangement areas. Each inspection point in the substrate P-C4 is inspected via each inspection probe 10 in A-B2. Next, the control unit 8 determines that the number of the new Ka = 2 substrates P excluding Kb = 2 that has completed the reinspection (the number of substrates P that have not been reinspected: Kc) is 0. (Another example of the “third process”), and the re-inspection process for the inspection target substrate 20 is completed.

  Further, as shown in FIG. 6, when inspection points inspected as defective are present on four of the 16 substrates P, that is, the substrates P-B2, P-B4, P-C1, and P-C3 (“ In another example of “Ka = 4”), the control unit 8 sets the lower leftmost substrate P-B2 of these substrates P (at the end on the predetermined side of “Ka inspection target regions”). It is determined that the above “condition” is satisfied when each inspection probe 10 in the probe placement area A-A1 in the inspection jig 4 is probed to another example of “inspection area to be checked” Each inspection probe 10 in each probe placement area A in the inspection jig 4 is probed to each inspection point in four of P-B2, P-B3, P-C2, and P-C3 (probing mode A : Still another example of “first processing”). Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrate P-B2 via each inspection probe 10 in the probe placement area A-A1.

  Subsequently, the control unit 8 determines that the substrate P-C3 on which the probes 10 for inspection in the probe arrangement regions A-B2 are probed is a reinspection target, and controls the inspection unit 5 to control the probe arrangement regions. Each inspection point in the substrate P-C3 is inspected via each inspection probe 10 in A-B2. Next, the control unit 8 sets Kc = 2 substrates P-B4, P-C1 excluding Kb = 2 substrates P-B2, P-C3 which have completed re-inspection among Ka = 4 substrates P. Are the new Ka = 2 reinspection objects (a further example of the “third process”).

  Subsequently, the control unit 8 causes each inspection probe 10 in the probe placement area A-A1 in the inspection jig 4 to be probed to the lower leftmost substrate P-C1 among the substrates P to be reinspected. At this time, it is determined that the above “condition” is satisfied, and each probe placement region A in the inspection jig 4 is added to each inspection point in the four substrates P-C1, P-C2, P-D1, and P-D2. Each of the inspection probes 10 is probed (probing mode A: yet another example of “first processing”). Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrate P-C1 via each inspection probe 10 in the probe placement area A-A1. Subsequently, the control unit 8 determines that there is no reinspection target on the substrate P on which the inspection probe 10 in each probe arrangement area A except the probe arrangement area A-A1 is probed, and a new Ka = Of the two substrates P, Kb = 1 substrate P-B4 excluding Kb = 1 substrate P-C1 which has completed reinspection is set as a new Ka = 1 reinspection target (“third Still another example of “processing”).

  Subsequently, the control unit 8 probes the probe in the inspection jig 4 on the lowermost leftmost substrate P among the substrates P to be reinspected (in this example, only the substrate P-B4 exists, and thus the substrate P-B4). When the inspection probes 10 in the arrangement area A-A1 are probed, the above “conditions” are not satisfied, and the uppermost substrate P (the substrate P in this example) among the substrates P to be reinspected. It is determined that the above “condition” is satisfied when probing each inspection probe 10 in the probe placement region A-B2 in the inspection jig 4 in −B4). Accordingly, the control unit 8 controls the moving mechanism 3 so that each probe placement region in the inspection jig 4 is in each inspection point on the four substrates P-A3, P-A4, P-B3, and P-B4. Each inspection probe 10 in A is probed (probing mode B: still another example of “first processing”). Next, the control unit 8 controls the inspection unit 5 to inspect each inspection point in the substrate P-B4 via each inspection probe 10 in the probe placement region A-B2. Subsequently, the control unit 8 determines that the number of the new Ka = 1 substrates P excluding Kb = 1 that has completed the reinspection (the number of substrates P that have not been reinspected: Kc) is 0. It is discriminated that it becomes a piece (a further example of “third process”), and the re-inspection process for this inspection target substrate 20 is completed.

  On the other hand, as shown in FIG. 7, when inspection points inspected as defective are present on four of the 16 substrates P, that is, the substrates P-A1, P-A4, P-D1, and P-D4 (“ Still another example of “Ka = 4”), the control unit 8 sets the lower leftmost substrate P-A1 among these substrates P (at the end on the predetermined side of “Ka inspection target regions”). It is determined that the above “condition” is satisfied when each inspection probe 10 in the probe placement area A-A1 in the inspection jig 4 is probed in “another inspection target area”. . Therefore, the control unit 8 sets each inspection probe 10 in each probe placement area A in the inspection jig 4 to each inspection point in the four substrates P-A1, P-A2, P-B1, and P-B2. Are probing (probing mode A: another example of “first processing”), and each inspection point in the substrate P-A1 by the inspection unit 5 is executed.

  Next, the control unit 8 is located at the upper rightmost substrate P-D4 (“Ka in the inspection target area of the Ka inspection target regions) among the other three substrates P to be reinspected. It is determined that the above “condition” is satisfied when each inspection probe 10 in the probe placement area A-B2 in the inspection jig 4 is probed to “another inspection area”. Therefore, the control unit 8 sets each inspection probe 10 in each probe placement area A in the inspection jig 4 to each inspection point in the four substrates P-C3, P-C4, P-D3, and P-D4. Are probing (probing mode B: another example of “first processing”), and each inspection point in the substrate P-D4 by the inspection unit 5 is executed.

  Subsequently, the control unit 8 positions the leftmost upper substrate P-A4 (the “Ka inspected region at the end of the predetermined side of the other two substrates P to be reinspected). It is determined that the above “condition” is satisfied when each inspection probe 10 in the probe placement area A-A2 in the inspection jig 4 is probed to “another inspection target area”. Therefore, the control unit 8 sets each inspection probe 10 in each probe placement area A in the inspection jig 4 to each inspection point in the four substrates P-A3, P-A4, P-B3, and P-B4. Are probing (probing mode C: another example of “first processing”), and each inspection point in the substrate P-A4 by the inspection unit 5 is executed.

  Next, the control unit 8 further includes another substrate P-D1 (“inspection target region located at the end on the predetermined side of the Ka inspection target regions”) which is the remaining one to be reinspected. It is determined that the above “condition” is satisfied when each inspection probe 10 in the probe placement region A-B2 in the inspection jig 4 is probed as an example. Therefore, the control unit 8 sets each inspection probe 10 in each probe placement area A in the inspection jig 4 to each inspection point in the four substrates P-C1, P-C2, P-D1, and P-D2. Are respectively probed (probing mode D: another example of “first processing”), and each inspection point in the substrate P-D1 by the inspection unit 5 is executed. Thus, the re-inspection processing for the inspection target substrate 20 is completed.

  In this case, with respect to the re-inspection processing of the inspection target substrate 20 in which the substrate P having the inspection point inspected as defective exists as in the example shown in FIG. 4, the same procedure as the inspection apparatus disclosed by the applicant is used. When the position and order for probing the inspection jig 4 are defined, at least probing to the substrates P-A1, P-A2, P-B1, and P-B2 for re-inspection of the substrate P-B2, and It is necessary to perform probing twice in total for probing the substrates P-C3, P-C4, P-D3, and P-D4, which are targets for re-inspection of the substrate P-C3. On the other hand, in the substrate inspection apparatus 1 of this example, as described above, the re-inspection processing for Ka = 2 substrates P-B2 and P-C3 is completed by one probing.

  Further, regarding the re-inspection processing of the inspection target substrate 20 in which the substrate P on which the inspection point inspected to be defective exists as in the example shown in FIG. 5, inspection is performed in the same procedure as the inspection apparatus disclosed by the applicant. When the position and sequence for probing the jig 4 are defined, at least the probing to the substrates P-A1, P-A2, P-B1, and P-B2 for the re-inspection of the substrate P-B1, the substrate P Probing to substrates P-C1, P-C2, P-D1, and P-D2 for re-inspection of C2, and substrates P-A3, P-A4, P for re-inspection of substrate P-B3 -Probing to B3, P-B4 and probing to substrates P-C3, P-C4, P-D3, P-D4 for the re-inspection of the substrate P-C4 is performed a total of 4 times. There is a need. On the other hand, in the substrate inspection apparatus 1 of this example, as described above, the re-inspection processing for Ka = 4 substrates P-B1, P-B3, P-C2, and P-C4 by two probing operations. Is completed.

  Further, regarding the re-inspection processing of the inspection target substrate 20 in which the substrate P on which the inspection point inspected to be defective exists as in the example shown in FIG. 6, the inspection is performed in the same procedure as the inspection apparatus disclosed by the applicant. When the position and sequence for probing the jig 4 are defined, at least the probing to the substrates P-A1, P-A2, P-B1, and P-B2 for the re-inspection of the substrate P-B2, the substrate P Probing to the substrates P-C1, P-C2, P-D1, and P-D2 for the re-inspection of C1, and substrates P-A3, P-A4, P for the re-inspection of the substrate P-B4 -Probing to B3, P-B4, and probing to substrates P-C3, P-C4, P-D3, and P-D4 for the re-inspection of the substrate P-C3 are performed four times in total. There is a need. On the other hand, in the substrate inspection apparatus 1 of this example, as described above, re-inspection processing for Ka = 4 substrates P-B2, P-B4, P-C1, and P-C3 by three times of probing. Is completed.

  On the other hand, regarding the re-inspection processing of the inspection target substrate 20 in which the substrate P on which the inspection point inspected as defective exists is as shown in FIG. 7, the inspection is performed in the same procedure as the inspection device disclosed by the applicant. When the position and order for probing the jig 4 are defined, at least the probing to the substrates P-A1, P-A2, P-B1, and P-B2 for the re-inspection of the substrate P-A1, the substrate P -Probing the substrates P-C1, P-C2, P-D1, and P-D2 for re-inspection of A4, and substrates P-A3, P-A4, P for re-inspecting the substrate P-D1 -Probing to B3, P-B4, and probing to substrates P-C3, P-C4, P-D3, and P-D4 for the re-inspection of the substrate P-D4 are performed four times in total. There is a need.

  Regarding such an example, the substrate inspection apparatus 1 of this example also completes the re-inspection processing for Ka = 4 substrates P-B2, P-B4, P-C1, and P-C3, as described above. Until then, the same four probing steps as the inspection apparatus disclosed by the applicant are required. However, in the substrate inspection apparatus 1 of this example, the same procedure as that of the inspection apparatus disclosed by the applicant is applicable regardless of how many substrates P to be reinspected exist at any position on the inspection target substrate 20. Thus, the number of probing times when the position and sequence for probing the inspection jig 4 are defined is not exceeded.

  As described above, in the substrate inspection apparatus 1 and the substrate inspection method using the substrate inspection apparatus 1, the inspection is performed at the time of reinspecting Ka of the Na × Nb substrates P partitioned on one surface of the inspection target substrate 20. The condition that all the inspection probes 10 in the La × Lb probe placement areas A in the jig 4 are probed to the inspection points in any of the substrates P is satisfied, and Ka substrates are provided. Each inspection point in the substrate P located at the “predetermined end” of P is located at the end of the La × Lb probe placement area A on the same side as the predetermine side. The inspection jig 4 is moved with respect to the inspection target substrate 20 so that each inspection probe 10 in the probe placement area A is probed, and each inspection probe 10 is probed to each inspection point. processing" “Second process” for inspecting inspection points in Kb substrates P to be reinspected by probing the inspection probe 10 to inspection points, and Kb pieces for which reinspection has been completed among the Ka substrates P The “third process” in which the Kc substrates P except for the new Ka substrates P are repeated in this order until Ka = 0.

  Therefore, according to the substrate inspection method by the substrate inspection apparatus 1 and the substrate inspection apparatus 1, depending on the position of the substrate P to be reinspected on the inspection target substrate 20, the number of probing times at the time of reinspection of the Ka substrates P Even when the number of probing times is the largest number, probing exceeding the same number of times as the inspection apparatus disclosed by the applicant is not required. The time required can be shortened sufficiently. Further, the useful life of the inspection probe 10 can be sufficiently extended by the amount that the number of probing during the re-inspection processing can be reduced to a small number, and a larger number of inspection target substrates 20 can be inspected at a lower cost.

  The configuration of the “substrate inspection apparatus” and the specific procedure of the “substrate inspection method” are not limited to the configuration of the substrate inspection apparatus 1 and the example of the procedure of the substrate inspection method performed by the substrate inspection apparatus 1. For example, by using the inspection jig 4 in which the inspection probe 10 is disposed for every La × Lb = 2 × 2 = 4 probe disposition regions A, Na × Nb = 4 × 4 = 16 substrates The configuration / method for sequentially inspecting P has been described as an example, but as shown in FIG. 8, an inspection probe 10 is provided for each of La × Lb = 2 × 2 = 4 probe placement areas A. Configuration / method (La) for inspecting an inspection target substrate 20a (another example of “inspection target substrate”) in which Na × Nb = 4 × 2 = 8 substrates P are partitioned using the inspection jig 4 Even in the case where one of Lb and Lb is the same number as Na or Nb), the time required for the re-inspection processing can be sufficiently shortened in the same manner as in the substrate inspection apparatus 1 described above.

  Specifically, the applicant discloses an example of the same figure in which there are inspection points inspected as defective in Ka = 2 substrates P of the substrates P-B1 and P-C2 in the inspection target substrate 20a. When the position and order for probing the inspection jig 4 are defined in the same procedure as the existing inspection apparatus, the substrates P-A1, P-A2, P-B1, P- for the re-inspection of the substrate P-B1 It is necessary to execute probing to B2 and probing to the substrates P-C1, P-C2, P-D1, and P-D2 for the re-inspection of the substrate P-C2 twice in total. On the other hand, in the substrate inspection apparatus 1 of this example, an inspection jig is provided at each inspection point in the substrate P-B1 located on the lower left side among the Ka = 2 substrates P-B1 and P-C2. 4 by probing each inspection probe 10 in the probe placement region A-A1 located at the lower leftmost position in each probe placement region A (an example of probing satisfying the “condition”) ” Each inspection probe 10 in the region A-B2 is probed to each inspection point in the substrate P-C2 to be reinspected. Therefore, in this example, the reinspection process for Ka = 2 substrates P-B1 and P-C2 is completed by one probing.

  Further, as shown in FIG. 9, Na × Nb = 4 using an inspection jig 4 a in which inspection probes 10 are arranged for every La × Lb = 2 × 1 = 2 probe arrangement regions A. × 1 = Configuration / method for inspecting inspection target substrate 20b (another example of “inspection target substrate”) in which four substrates P are partitioned (one of Na and Nb is one, and accordingly, Even in the case where one of La and Lb is the same number as Na or Nb), the time required for the re-inspection processing can be sufficiently shortened as in the case of the substrate inspection apparatus 1 described above.

  Specifically, the applicant discloses an example of the figure in which there are inspection points inspected as defective in Ka = 2 substrates P of the substrates P-B1 and P-C1 in the inspection target substrate 20b. When the position and sequence for probing the inspection jig 4a are defined in the same procedure as the existing inspection apparatus, the probing to the substrates P-A1 and P-B1 for the re-inspection of the substrate P-B1, and the substrate P -It is necessary to perform probing twice in total for probing the substrates P-C1 and P-D1 targeted for re-inspection of C1. On the other hand, in the substrate inspection apparatus 1 of this example, the inspection jig 4 is attached to each inspection point in the substrate P-B1 located on the leftmost side of the Ka = 2 substrates P-B1, P-C1. By probing each inspection probe 10 in the probe placement region A located on the leftmost side in each probe placement region A (an example of probing that satisfies “conditions”), other probe placement regions A Each inspection probe 10 is probed to each inspection point in the substrate P-C1 to be reinspected. Therefore, in this example, the re-inspection process for Ka = 2 substrates P-B1 and P-C1 is completed by one probing.

  Further, the example of inspecting the inspection target substrates 20, 20 a, 20 b on which the plurality of substrates P are formed has been described. For example, a plurality of wiring pattern regions are arranged so that inspection points are arranged in the same manner on one substrate Even when inspecting an object provided with (another example of “inspection target area”), the time required for re-inspection is sufficiently shortened in the same manner as inspecting the above-described inspection target substrates 20, 20a, 20b. can do. In addition, the configuration and method of probing the inspection probe 10 to each inspection point of the inspection target substrate 20 by moving the inspection jig 4 toward the inspection target substrate 20 by the moving mechanism 3 has been described as an example. , A configuration / method for probing the “inspection probe” to each “inspection point” by moving the “substrate to be inspected” toward the “inspection jig” fixedly arranged at a predetermined position, Probing “Inspection Probes” to “Inspection Points” by moving “Inspection Substrate” toward “Inspection Jig” while moving “Inspection Jig” toward “Inspection Substrate” It is also possible to adopt a configuration / method to be performed.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 3 Moving mechanism 4, 4a Inspection jig | tool 5 Inspection part 8 Control part 9 Memory | storage part 10 Inspection probe 20, 20a, 20b Inspection object board | substrate A-A1, A-A2, A-B1, A-B2 Probe placement area D Inspection result data P-A1 to P-A4, P-B1 to P-B4, P-C1 to P-C4, P-D1 to P-D4 Substrate

Claims (2)

An inspection jig in which a plurality of inspection probes are arranged in accordance with the arrangement of a plurality of inspection points respectively defined in a plurality of inspection target areas partitioned on one surface of the inspection target substrate in each inspection target area A moving mechanism that moves at least one of the inspection jig and the substrate to be inspected relative to the other to probe the inspection probes to the inspection points, and the inspection via the inspection probes. An inspection unit that inspects each inspection point based on an electric signal input / output to / from each inspection point in the target area, the at least one movement by the moving mechanism, and each inspection point by the inspection unit A control unit for controlling the inspection of
The inspection jig is partitioned such that the number of sections along the first direction is Na and the number of sections along the second direction intersecting with the first direction is Nb and the same arrangement. The (Na × Nb) (Na × Nb are both natural numbers, and at least one satisfies the condition of 4 or more) of the inspection target regions in which the inspection points are respectively defined. Of these, (Ma × Mb) (Ma is a natural number equal to or less than Na and the number along the first direction, and Mb is a natural number equal to or less than Nb and the number along the second direction. And at least one of Ma and Mb satisfies the condition that it is 2 or more) (La × Lb) (provided that each of the inspection probes in the inspection target region can be probed). La corresponds to the first direction 3 is the same number as Ma, and Lb is the number of sections along the fourth direction corresponding to the second direction and the same number as Mb). Each inspection probe is arranged in the same arrangement for each installation area,
The control unit controls the moving mechanism to sequentially probe the inspection probes of the inspection jig at the inspection points in the (Na × Nb) inspection target regions, and the inspection unit. A board inspection apparatus that controls each inspection point by controlling
At the time of re-examination of the inspection target area of Ka pieces (Ka is a natural number equal to or less than Na × Nb), the control unit sets all the inspection probes in the (La × Lb) probe arrangement areas. Of the (Na × Nb) number of inspection target areas, a condition that the probe point is to be probed at each of the inspection points in the inspection target area is satisfied, and among the Ka number of inspection target areas, Each inspection point in the inspection target region positioned at the end on the predetermined side is positioned at the end on the same side as the predetermined side in the (La × Lb) probe arrangement regions. The moving mechanism is controlled so that each inspection probe in the probe placement region is probed, and at least one of the inspection probes is moved with respect to the other, so that each inspection probe is connected to each inspection point. A first process to be rubbed, and the inspection unit is controlled so that the inspection probe is probed at the inspection point in the inspection target region in the inspection target region of Kb pieces (Kb is a natural number equal to or less than Ka) Second processing for inspecting inspection points, and Kc of the inspection target areas excluding Kb of which the re-inspection has been completed out of the Ka inspection target areas are set as new Ka inspection target areas. A substrate inspection apparatus that repeatedly executes the third process in this order until Ka = 0. An inspection jig in which a plurality of inspection probes are arranged in accordance with the arrangement of a plurality of inspection points respectively defined in a plurality of inspection target areas partitioned on one surface of the inspection target substrate in each inspection target area And each inspection in the inspection target region via each inspection probe in a state where each inspection probe is probed to each inspection point by moving at least one of the inspection target substrate and the other inspection target substrate When inspecting each inspection point based on the electric signal input / output with respect to the point, the number of sections along the first direction is Na and the second direction intersects with the first direction. (Na × Nb) (Na and Nb are both natural numbers). Each inspection point is defined so that the number of sections is Nb and the same arrangement is made. And (Ma × Mb) (Ma is a natural number of Na or less and the number in the first direction) out of the inspection target regions. Mb is a natural number equal to or less than Nb and is a number along the second direction, and at least one of Ma and Mb satisfies the condition of 2 or more) (La × Lb) (La is the number of sections along the third direction corresponding to the first direction and the same number as Ma) so that each inspection probe can be probed at each inspection point. Yes, Lb is the number of sections along the fourth direction corresponding to the second direction and the same number as the probe Mb), and the inspection probes are arranged in the same arrangement. Using the inspection jig configured as described above, the (Na × Nb) A substrate inspection method for inspecting each inspection point while sequentially probing each inspection probe of the inspection jig to each inspection point in each of the inspection target regions,
At the time of re-inspection of the inspection target area Ka (Ka is a natural number equal to or less than Na × Nb), all the inspection probes in the (La × Lb) probe arrangement regions are the (Na × Nb). ) A condition that the probe point is to be probed at each inspection point in any one of the inspection target areas, and a predetermined side of the Ka inspection target areas is satisfied. The probe placement region located at the end on the same side as the predetermined side of the (La × Lb) probe placement regions at each inspection point in the inspection target region located at the end of the probe A first process for probing each inspection point to each inspection point by moving at least one of the inspection probes relative to the other so that each of the inspection probes is probed A second process for inspecting the inspection points in the inspection object area of Kb pieces (Kb is a natural number equal to or less than Ka) of re-inspection objects whose lobes are probed to the inspection points; and the Ka inspection objects The third process of setting the Kc inspection target areas excluding the Kb pieces of the reexamination among the areas to be the new Ka inspection target areas is repeated in this order until Ka = 0. Board inspection method to be executed.

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