JP2014011468A - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
- Publication number
- JP2014011468A JP2014011468A JP2013136323A JP2013136323A JP2014011468A JP 2014011468 A JP2014011468 A JP 2014011468A JP 2013136323 A JP2013136323 A JP 2013136323A JP 2013136323 A JP2013136323 A JP 2013136323A JP 2014011468 A JP2014011468 A JP 2014011468A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- substrate
- extending
- socket
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】本発明に係る電子デバイスは、ソケットと、前記ソケットに収容され、且つ基板及び基板の中心に設置されるチップを含む電子部品と、下表面が前記チップに接触するヒートスプレッダと、可撓性固定具と、を備える。前記可撓性固定具の一端は前記ヒートスプレッダに当接され、前記可撓性固定具の他端は前記基板又は前記ソケットに当接される。
【選択図】図3
Description
10 ソケット
20 電子部品
30 放熱装置
40、40’ 可撓性固定具
50 保持プレート
11 底板
12 側壁
13 当接ブロック
14 位置決めブロック
15 位置決め溝
16 収容部
21 基板
22 チップ
23 可撓性棒
31 ヒートスプレッダ
32 ヒートパイプ
311 端部
41 固定部
42 連接部
43 延伸部
411 貫通孔
431 延伸アーム
511 第一固定片
512 第二固定片
513 位置決め孔
523 固定孔
521 第一固定アーム
522 第二固定アーム
53 ネジ
Claims (5)
- ソケットと、前記ソケットに収容され、且つ基板及び基板の中心に設置されるチップを含む電子部品と、下表面が前記チップに接触するヒートスプレッダと、を備える電子デバイスであって、可撓性固定具をさらに備え、前記可撓性固定具の一端は、前記ヒートスプレッダに当接され、前記可撓性固定具の他端は、前記基板又は前記ソケットに当接されることを特徴とする電子デバイス。
- 前記可撓性固定具は金属材料からなり、固定部と、固定部の一端から下方へ延伸する連接部と、連接部の一端からチップに向かって延伸する延伸部と、を備え、前記固定部は前記ヒートスプレッダの下表面に当接され、前記延伸部の自由端は、前記基板又は前記ソケットに当接されることを特徴とする請求項1に記載の電子デバイス。
- 前記延伸部は、互いに間隔をあけて平行に延伸する2つの延伸アームを備え、2つの延伸アームの自由端は、基板とソケットとの間に挟まれることを特徴とする請求項2に記載の電子デバイス。
- 前記ソケットは、矩形の底板と、底板の対向する辺縁から上方に前記底板に対して垂直に延伸する2つの側壁と、底板の他の対向する辺縁から上方に延伸する位置決めブロックと、を備え、各辺縁には、2つの位置決めブロックがそれぞれ形成され、2つの位置決めブロックの間には、位置決め溝が形成され、前記可撓性固定具の延伸部は、前記位置決め溝を通って前記底板の辺縁に当接されることを特徴とする請求項2又は3に記載の電子デバイス。
- 前記可撓性固定具はゴム材料からなり、ヒートスプレッダと基板との間に挟まれ、且つ前記チップの周囲の基板の辺縁に位置することを特徴とする請求項1に記載の電子デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101123564A TWI486748B (zh) | 2012-06-29 | 2012-06-29 | 電子裝置 |
TW101123564 | 2012-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014011468A true JP2014011468A (ja) | 2014-01-20 |
JP5788438B2 JP5788438B2 (ja) | 2015-09-30 |
Family
ID=49777925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013136323A Expired - Fee Related JP5788438B2 (ja) | 2012-06-29 | 2013-06-28 | 電子デバイス |
Country Status (3)
Country | Link |
---|---|
US (1) | US9119328B2 (ja) |
JP (1) | JP5788438B2 (ja) |
TW (1) | TWI486748B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629446B (zh) * | 2016-12-29 | 2018-07-11 | 廣達電腦股份有限公司 | 散熱組合件及應用其之電子裝置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05243329A (ja) * | 1991-11-04 | 1993-09-21 | Internatl Business Mach Corp <Ibm> | アタッチメントならびに集積回路パッケージとその製造方法 |
US6188577B1 (en) * | 1999-11-18 | 2001-02-13 | Yen-Wen Liu | Protective device for central processing unit |
US6304453B1 (en) * | 2000-05-30 | 2001-10-16 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
JP2002271066A (ja) * | 2001-03-12 | 2002-09-20 | Nec Gumma Ltd | ヒートシンクの取付構造 |
JP2003133448A (ja) * | 2001-10-05 | 2003-05-09 | Motorola Inc | デバイスを遮蔽する装置および方法 |
JP2009515329A (ja) * | 2005-11-03 | 2009-04-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多接合部ばねフィンガを有する接地ばねを用いて電子コンポーネントに熱的に接触したヒート・シンクを接地するための方法および装置 |
JP2009076674A (ja) * | 2007-09-20 | 2009-04-09 | Toshiba Corp | 電子機器および冷却ユニット |
JP2010532097A (ja) * | 2007-06-27 | 2010-09-30 | インテル・コーポレーション | モバイル・プラットフォーム用ランド・グリッド・アレイ(lga)ソケットの荷重メカニズム |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7602060B2 (en) * | 2007-06-25 | 2009-10-13 | Intel Corporation | Heat spreader in a flip chip package |
US7773383B2 (en) * | 2009-01-06 | 2010-08-10 | Malico Inc. | Heatsink assembly |
TWM399581U (en) | 2010-08-20 | 2011-03-01 | Micro Star Int Co Ltd | Fixing mechanism for fixing a thermal module on a base and related electronic device |
TWM424526U (en) * | 2011-02-25 | 2012-03-11 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly and heat dissipating system for the same |
-
2012
- 2012-06-29 TW TW101123564A patent/TWI486748B/zh not_active IP Right Cessation
-
2013
- 2013-04-15 US US13/862,660 patent/US9119328B2/en not_active Expired - Fee Related
- 2013-06-28 JP JP2013136323A patent/JP5788438B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05243329A (ja) * | 1991-11-04 | 1993-09-21 | Internatl Business Mach Corp <Ibm> | アタッチメントならびに集積回路パッケージとその製造方法 |
US6188577B1 (en) * | 1999-11-18 | 2001-02-13 | Yen-Wen Liu | Protective device for central processing unit |
US6304453B1 (en) * | 2000-05-30 | 2001-10-16 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
JP2002271066A (ja) * | 2001-03-12 | 2002-09-20 | Nec Gumma Ltd | ヒートシンクの取付構造 |
JP2003133448A (ja) * | 2001-10-05 | 2003-05-09 | Motorola Inc | デバイスを遮蔽する装置および方法 |
JP2009515329A (ja) * | 2005-11-03 | 2009-04-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多接合部ばねフィンガを有する接地ばねを用いて電子コンポーネントに熱的に接触したヒート・シンクを接地するための方法および装置 |
JP2010532097A (ja) * | 2007-06-27 | 2010-09-30 | インテル・コーポレーション | モバイル・プラットフォーム用ランド・グリッド・アレイ(lga)ソケットの荷重メカニズム |
JP2009076674A (ja) * | 2007-09-20 | 2009-04-09 | Toshiba Corp | 電子機器および冷却ユニット |
Also Published As
Publication number | Publication date |
---|---|
TW201401026A (zh) | 2014-01-01 |
US20140002999A1 (en) | 2014-01-02 |
TWI486748B (zh) | 2015-06-01 |
JP5788438B2 (ja) | 2015-09-30 |
US9119328B2 (en) | 2015-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7349212B2 (en) | Heat dissipation device | |
JP5223212B2 (ja) | ヒートシンクを備える電子部品の実装構造 | |
US20070146990A1 (en) | Heat dissipating assembly | |
JP6512644B1 (ja) | 放熱構造体、および放熱方法 | |
JP2011077337A (ja) | 電子機器 | |
US20090027858A1 (en) | Heat dissipating device assembly | |
KR200490472Y1 (ko) | 방열장치 조립 구조 | |
TW201227243A (en) | Heat sink for storing module | |
US20120222835A1 (en) | Heat dissipating device | |
CN102215658B (zh) | 散热装置组合及使用该散热装置组合的电子装置 | |
TWM538606U (zh) | 主機板組件 | |
JP5788438B2 (ja) | 電子デバイス | |
TWI504852B (zh) | 散熱模組 | |
TW201201000A (en) | Heat dissipation apparatus | |
TW201347646A (zh) | 散熱裝置組合 | |
JP2008192657A (ja) | 電子機器 | |
JP2017050393A (ja) | 光モジュール | |
US20120024495A1 (en) | Heat dissipation apparatus | |
US20150156924A1 (en) | Heat conductive plate and heat dissipating module using the same | |
TWI517783B (zh) | 固定組件 | |
JP2016131218A (ja) | 放熱装置 | |
US7400507B2 (en) | Fastening structure | |
US20140254100A1 (en) | Cooling Apparatus for Fanless Desktop Enclosure of an Elastomericly Suspended Circuit Board | |
JP2016063055A (ja) | 電子機器の放熱構造 | |
TWM504431U (zh) | 固定支架 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140428 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140609 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140908 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150323 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150508 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150629 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150729 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5788438 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |