JP2014011432A5 - - Google Patents

Download PDF

Info

Publication number
JP2014011432A5
JP2014011432A5 JP2012149414A JP2012149414A JP2014011432A5 JP 2014011432 A5 JP2014011432 A5 JP 2014011432A5 JP 2012149414 A JP2012149414 A JP 2012149414A JP 2012149414 A JP2012149414 A JP 2012149414A JP 2014011432 A5 JP2014011432 A5 JP 2014011432A5
Authority
JP
Japan
Prior art keywords
substrate
polishing
holding surface
pressure chamber
contact portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012149414A
Other languages
English (en)
Japanese (ja)
Other versions
JP5891127B2 (ja
JP2014011432A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012149414A priority Critical patent/JP5891127B2/ja
Priority claimed from JP2012149414A external-priority patent/JP5891127B2/ja
Priority to US13/932,062 priority patent/US9105516B2/en
Publication of JP2014011432A publication Critical patent/JP2014011432A/ja
Publication of JP2014011432A5 publication Critical patent/JP2014011432A5/ja
Application granted granted Critical
Publication of JP5891127B2 publication Critical patent/JP5891127B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012149414A 2012-07-03 2012-07-03 研磨装置および研磨方法 Active JP5891127B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012149414A JP5891127B2 (ja) 2012-07-03 2012-07-03 研磨装置および研磨方法
US13/932,062 US9105516B2 (en) 2012-07-03 2013-07-01 Polishing apparatus and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012149414A JP5891127B2 (ja) 2012-07-03 2012-07-03 研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2014011432A JP2014011432A (ja) 2014-01-20
JP2014011432A5 true JP2014011432A5 (enrdf_load_stackoverflow) 2015-10-08
JP5891127B2 JP5891127B2 (ja) 2016-03-22

Family

ID=50107815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012149414A Active JP5891127B2 (ja) 2012-07-03 2012-07-03 研磨装置および研磨方法

Country Status (1)

Country Link
JP (1) JP5891127B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6427131B2 (ja) 2016-03-18 2018-11-21 株式会社荏原製作所 研磨装置および研磨方法
JP2017185589A (ja) * 2016-04-06 2017-10-12 株式会社荏原製作所 基板処理装置
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
JP2021041485A (ja) 2019-09-10 2021-03-18 キオクシア株式会社 研磨装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3917384B2 (ja) * 2001-02-15 2007-05-23 大日本スクリーン製造株式会社 基板処理装置および基板洗浄装置
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法

Similar Documents

Publication Publication Date Title
JP2014011432A5 (enrdf_load_stackoverflow)
JP2006324702A5 (enrdf_load_stackoverflow)
TWI554407B (zh) Sticking device
JP2011507242A5 (enrdf_load_stackoverflow)
US20150279716A1 (en) Apparatus and method for detaching chip
JP5259434B2 (ja) 板取得装置及び板取得方法
WO2013005589A1 (ja) ガラス基板の剥離方法及びガラス基板剥離装置
JP2002229044A5 (enrdf_load_stackoverflow)
JP2010050436A5 (enrdf_load_stackoverflow)
JP2007185725A (ja) 板状体の剥離方法及びその装置
JP2016116597A5 (enrdf_load_stackoverflow)
JP2016039301A (ja) 粘着テープ剥離方法および粘着テープ剥離装置
JP2014216632A5 (enrdf_load_stackoverflow)
JP5572039B2 (ja) ウエーハの剥離方法及びその装置
JP2004327963A5 (enrdf_load_stackoverflow)
CN202518834U (zh) 悬臂式吸盘送板机
WO2013042906A3 (ko) Fpc에 부재플레이트를 부착하기 위한 부재플레이트 부착장치 및 이에 이용되는 부재플레이트 분리 유닛과 프레스 유닛
JP5891127B2 (ja) 研磨装置および研磨方法
CN103311405B (zh) 固晶胶压制方法及加压装置
KR101126685B1 (ko) 필름 부착장치 및 부착방법
CN105772339B (zh) 一种自动擦油设备
CN113964076B (zh) 一种用于半导体晶圆下片用的推片装置
KR20180107727A (ko) 테이프 박리 장치
TWI637454B (zh) 晶片分離裝置與晶片分離方法
KR101791486B1 (ko) 스마트폰 글라스 성형 장치의 상부 금형 가압 구조