JP5891127B2 - 研磨装置および研磨方法 - Google Patents
研磨装置および研磨方法 Download PDFInfo
- Publication number
- JP5891127B2 JP5891127B2 JP2012149414A JP2012149414A JP5891127B2 JP 5891127 B2 JP5891127 B2 JP 5891127B2 JP 2012149414 A JP2012149414 A JP 2012149414A JP 2012149414 A JP2012149414 A JP 2012149414A JP 5891127 B2 JP5891127 B2 JP 5891127B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- pressure
- contact portion
- pressure chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims description 148
- 238000000034 method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 219
- 230000007246 mechanism Effects 0.000 claims description 66
- 239000012530 fluid Substances 0.000 claims description 59
- 238000000926 separation method Methods 0.000 claims description 23
- 230000001737 promoting effect Effects 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 11
- 238000007517 polishing process Methods 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 150
- 239000012528 membrane Substances 0.000 description 83
- 239000010408 film Substances 0.000 description 19
- 238000001514 detection method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 241000255777 Lepidoptera Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012149414A JP5891127B2 (ja) | 2012-07-03 | 2012-07-03 | 研磨装置および研磨方法 |
| US13/932,062 US9105516B2 (en) | 2012-07-03 | 2013-07-01 | Polishing apparatus and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012149414A JP5891127B2 (ja) | 2012-07-03 | 2012-07-03 | 研磨装置および研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014011432A JP2014011432A (ja) | 2014-01-20 |
| JP2014011432A5 JP2014011432A5 (enrdf_load_stackoverflow) | 2015-10-08 |
| JP5891127B2 true JP5891127B2 (ja) | 2016-03-22 |
Family
ID=50107815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012149414A Active JP5891127B2 (ja) | 2012-07-03 | 2012-07-03 | 研磨装置および研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5891127B2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11517996B2 (en) | 2019-09-10 | 2022-12-06 | Kioxia Corporation | Polishing apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6427131B2 (ja) | 2016-03-18 | 2018-11-21 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP2017185589A (ja) * | 2016-04-06 | 2017-10-12 | 株式会社荏原製作所 | 基板処理装置 |
| JP6990980B2 (ja) * | 2017-03-31 | 2022-01-12 | 株式会社荏原製作所 | 基板処理装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3917384B2 (ja) * | 2001-02-15 | 2007-05-23 | 大日本スクリーン製造株式会社 | 基板処理装置および基板洗浄装置 |
| JP5390807B2 (ja) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
| JP5597033B2 (ja) * | 2010-06-07 | 2014-10-01 | 株式会社荏原製作所 | 研磨装置および方法 |
-
2012
- 2012-07-03 JP JP2012149414A patent/JP5891127B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11517996B2 (en) | 2019-09-10 | 2022-12-06 | Kioxia Corporation | Polishing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014011432A (ja) | 2014-01-20 |
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