WO2013005589A1 - ガラス基板の剥離方法及びガラス基板剥離装置 - Google Patents
ガラス基板の剥離方法及びガラス基板剥離装置 Download PDFInfo
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- WO2013005589A1 WO2013005589A1 PCT/JP2012/066074 JP2012066074W WO2013005589A1 WO 2013005589 A1 WO2013005589 A1 WO 2013005589A1 JP 2012066074 W JP2012066074 W JP 2012066074W WO 2013005589 A1 WO2013005589 A1 WO 2013005589A1
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- glass substrate
- suction
- sheet
- holes
- peeling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- the present invention relates to a glass substrate peeling method and a glass substrate peeling apparatus.
- the glass substrate When the glass substrate is polished, the glass substrate may be sucked and held on the suction sheet bonded to the glass substrate holding surface plate and conveyed through the polishing line. In this case, the glass substrate that has been polished must be peeled from the suction sheet and transferred to the next step, for example, a mounting table of a cleaning device.
- the glass substrate when the glass substrate is peeled from the suction sheet, for example, as described in Patent Document 1, by blowing compressed air toward the boundary between the glass substrate and the suction sheet, At least a part is separated from the suction sheet, and water is supplied to the gap between the separated glass substrate and the suction sheet to release the suction of the glass substrate to the suction sheet.
- the glass substrate is peeled from the suction sheet by being sucked and held by the suction pad.
- An object of the present invention is to provide a peeling method and a glass substrate peeling apparatus.
- the glass substrate peeling apparatus of the present invention is characterized by comprising peeling means for peeling the glass substrate held by suction with the liquid interposed in the suction sheet from the suction sheet.
- the glass substrate is affixed to the suction sheet with a liquid interposed, so that the glass substrate does not have a large suction force even after polishing, and the glass substrate can be easily peeled off from the suction sheet. It becomes.
- the peeling means includes a plurality of suction pads that hold the surface opposite to the suction sheet of the glass substrate that is sucked and held with the liquid interposed in the suction sheet, and the glass substrate.
- An elevating mechanism for independently elevating each of the plurality of suction pads so as to perform one of the approaching and separating operations, and an edge of the glass substrate when peeling the glass substrate from the suction sheet.
- a control means for controlling the elevating mechanism so as to gradually lift the glass substrate from the suction sheet and peel the whole glass substrate from the suction sheet;
- a suction pad moving means that moves the entire pad toward or away from the glass substrate and translates it in the in-plane direction of the glass substrate. It is preferable.
- the glass substrate is attached to the adsorption sheet with liquid interposed, the adsorption force of the glass substrate does not increase so much even after polishing, and there is no occurrence of cracks or scratches in a stable and short time. Can peel.
- the peeling means sucks and holds the glass substrate with the liquid interposed therebetween, and a suction sheet in which a plurality of through holes are provided in a region for sucking and holding the glass substrate, and the suction A glass substrate holding surface plate in which a plurality of holes are provided so as to coincide with the opening surfaces of the plurality of through holes in a region where the sheet is placed and the suction sheet is placed, and disposed in the plurality of holes
- a pin that moves up and down so as to protrude from the through-hole of the suction sheet, a lift mechanism that moves the pin up and down so as to protrude from the suction sheet, and moves the pin up and down to move the glass substrate to the suction sheet
- a control means for controlling the lifting mechanism so as to be peeled off.
- the glass substrate was affixed to the adsorbing sheet with a liquid interposed between them, and the polished glass substrate was pushed up from the non-polished surface with a pin and peeled off, so it was stable without causing cracks or scratches. Can be removed in a short time.
- the plurality of through holes and the plurality of holes are arranged such that, at an end portion of the region where the glass substrate is sucked and held, from the end portion toward the central portion of the glass substrate, In the central portion of the area where the glass substrate is sucked and held, the direction orthogonal to the suction sheet setting surface of the glass substrate holding surface plate is formed obliquely with respect to the orthogonal direction of the suction sheet setting surface of the glass substrate holding surface plate. It is preferable to form it in parallel.
- the glass substrate can be more easily peeled from the adsorption sheet.
- the peeling means sucks and holds the glass substrate with the liquid interposed therebetween, and a suction sheet in which a plurality of through holes are provided in a region for sucking and holding the glass substrate, and the suction A glass substrate holding surface plate in which a plurality of holes are provided so as to coincide with the opening surfaces of the plurality of through holes in a region where the sheet is placed and the suction sheet is placed, and air is provided in the plurality of holes.
- air supply means for blowing the air onto the surface of the glass substrate that is adsorbed and held by the adsorbing sheet.
- the glass substrate was affixed to the adsorption sheet with a liquid interposed between them, and the polished glass substrate was pushed up with air from the non-polished surface and peeled off, so it was stable without causing cracks or scratches. Can be removed in a short time.
- the plurality of through holes and the plurality of holes are arranged such that, at an end portion of the region where the glass substrate is sucked and held, from the end portion toward the central portion of the glass substrate, In the central portion of the area where the glass substrate is sucked and held, the direction orthogonal to the suction sheet setting surface of the glass substrate holding surface plate is formed obliquely with respect to the orthogonal direction of the suction sheet setting surface of the glass substrate holding surface plate. It is preferable to form it in parallel.
- the glass substrate can be more easily peeled from the adsorption sheet.
- the peeling means reverses the glass substrate holding surface plate for holding the glass substrate polished on the upper surface of the suction sheet with the liquid interposed therebetween, and the top and bottom of the glass substrate holding surface plate. Reversing the glass substrate after polishing, the reverse of the top of the glass substrate holding surface plate, the suction sheet is positioned above the gravitational direction, and the glass substrate is positioned below, It is preferable that the glass substrate is peeled off from the adsorbing sheet by its own weight.
- the glass substrate since the top and bottom are reversed and the glass substrate is peeled off by its own weight, it can be peeled stably without causing cracks or scratches.
- the glass substrate peeling method includes a glass substrate having a surface opposite to the suction sheet polished by holding and polishing the suction sheet with a liquid interposed in the suction sheet. Step of sucking with a plurality of suction pads, and from the suction pad that sucks the edge of the glass substrate among the plurality of suction pads, gradually lifted in the direction to retract from the suction sheet, the entire glass substrate A step of separating from the suction sheet, a step of separating the glass substrate from the suction sheet, translating in the in-plane direction of the glass substrate, and transferring the glass substrate to the next work step; It is provided with.
- the glass substrate is attached to the adsorption sheet with liquid interposed, the adsorption force of the glass substrate does not increase so much even after polishing, and there is no occurrence of cracks or scratches in a stable and short time. Can peel.
- the glass substrate peeling method matches the opening surfaces of the plurality of holes placed on the glass substrate holding surface plate provided with the plurality of holes.
- a step of adsorbing and holding a polished glass substrate with a liquid interposed in an adsorption sheet provided with a plurality of through holes, and being disposed in the plurality of holes so as to protrude from the through holes of the adsorption sheet A step of lifting and lowering a pin that moves up and down, and pushing up a surface of the glass substrate that is sucked and held by the suction sheet with the pin to separate the glass substrate from the suction sheet.
- the glass substrate was affixed to the adsorption sheet with a liquid interposed between them, and the polished glass substrate was pushed up from the non-polished surface with a pin and peeled off, so that it was stable without causing cracks or scratches. Can be removed in a short time.
- the plurality of through holes and the plurality of holes are arranged such that, at an end portion of the region where the glass substrate is sucked and held, from the end portion toward the central portion of the glass substrate, It is formed obliquely with respect to the orthogonal direction of the suction sheet installation surface of the glass substrate holding surface plate, and is orthogonal to the adsorption sheet installation surface of the glass substrate holding surface plate in the central portion of the area where the glass substrate is absorbed and held.
- the pins are raised obliquely toward the center of the glass substrate along the through hole and the hole, and the glass In the central portion of the region where the substrate is sucked and held, it is preferable that the pin is raised directly along the through hole and the hole.
- the glass substrate can be more easily peeled from the adsorption sheet.
- the glass substrate peeling method of the present invention matches the opening surfaces of the plurality of holes placed on the glass substrate holding surface plate provided with the plurality of holes.
- a step of adsorbing and holding a polished glass substrate with a liquid interposed in an adsorbing sheet provided with a plurality of through holes, and adsorbing and holding the adsorbing sheet of the glass substrate through the plural holes And a step of blowing air onto the surface to push up the glass substrate and peeling the glass substrate from the suction sheet.
- the glass substrate was affixed to the adsorption sheet with a liquid interposed between them, and the polished glass substrate was pushed up with air from the non-polished surface and peeled off, so it was stable without causing cracks or scratches. Can be removed in a short time.
- the plurality of through holes and the plurality of holes are arranged such that, at an end portion of the region where the glass substrate is sucked and held, from the end portion toward the central portion of the glass substrate, It is formed obliquely with respect to the orthogonal direction of the suction sheet installation surface of the glass substrate holding surface plate, and is orthogonal to the adsorption sheet installation surface of the glass substrate holding surface plate in the central portion of the area where the glass substrate is absorbed and held.
- the air is blown obliquely toward the center of the glass substrate along the through-hole and the hole at the end of the region formed in parallel with the direction and sucking and holding the glass substrate, and the glass substrate It is preferable that the air is blown right above the through hole and the hole in the central portion of the region where the suction is held.
- the glass substrate can be more easily peeled from the adsorption sheet.
- the glass substrate peeling method of the present invention adsorbs a polished glass substrate on the upper surface of an adsorption sheet placed on a glass substrate holding surface plate with a liquid interposed.
- the glass substrate is peeled off from the suction sheet by its own weight so that the suction sheet is located above and the glass substrate is located below.
- the glass substrate since the top and bottom are reversed and the glass substrate is peeled off by its own weight, it can be peeled stably without causing cracks or scratches.
- the glass substrate is attached to the adsorption sheet with a liquid interposed, the adsorption force of the glass substrate is not so great even after polishing, without causing cracks or scratches, It can be peeled stably and in a short time. Further, by pushing up with a pin from the non-polished surface side of the glass substrate or by blowing air to the non-polished surface of the glass substrate, the delamination of the glass substrate is further promoted, and the delamination can be performed stably and in a short time.
- FIG. 1 is a perspective view showing a schematic configuration of a first embodiment of a glass substrate peeling apparatus according to the present invention.
- FIG. 2 is a cross-sectional view showing how the glass substrate peeling apparatus peels the glass substrate from the adsorption sheet.
- FIG. 3 is a perspective view showing an example of a single wafer type polishing apparatus.
- FIG. 4 is a perspective view showing another example of a single wafer type polishing apparatus.
- FIG. 5 is an explanatory view showing a state where the glass substrate after being polished by the polishing apparatus of FIG. 3 is peeled off from the suction sheet.
- FIG. 6 is a cross-sectional view of the main part of the glass substrate peeling apparatus according to the second embodiment.
- FIG. 1 is a perspective view showing a schematic configuration of a first embodiment of a glass substrate peeling apparatus according to the present invention.
- FIG. 2 is a cross-sectional view showing how the glass substrate peeling apparatus peels the glass substrate from the adsorption sheet.
- FIG. 7 is a cross-sectional view showing the operation of the second embodiment.
- FIG. 8 is a cross-sectional view showing a third embodiment of the present invention.
- FIG. 9 is a cross-sectional view showing the operation of the third embodiment.
- FIG. 10 is a cross-sectional view of the main part of the glass substrate peeling apparatus according to the fourth embodiment.
- FIG. 11 is an explanatory view showing a state where the glass substrate is peeled from the suction sheet.
- FIG. 12 is a cross-sectional view showing a state in which the first embodiment is used in combination with the fourth embodiment.
- FIG. 13 is a sectional view showing a fifth embodiment of the present invention.
- FIG. 14 is a cross-sectional view showing the operation of the fifth embodiment.
- FIG. 15 is a cross-sectional view showing a problem when the pins are raised parallel to the direction perpendicular to the suction sheet installation surface of the glass substrate holding surface plate.
- FIG. 16 is a cross-sectional view showing a state in which the pins are raised in a direction oblique to the orthogonal direction of the suction sheet installation surface of the glass substrate holding surface plate.
- FIG. 1 is a perspective view showing a schematic configuration of a first embodiment of a glass substrate peeling apparatus according to the present invention.
- the glass substrate peeling apparatus 10 of the present embodiment is used by a continuous polishing apparatus while being adsorbed and held on an adsorption sheet (for example, a porous urethane sheet) 14 on a glass substrate holding surface plate 12.
- the polished glass substrate G that has been polished and conveyed in the direction of the arrow X is peeled off from the suction sheet 14 on the glass substrate holding surface plate 12 and placed on a device for the next step, for example, a mounting table for a cleaning device. It is an apparatus for transferring.
- the surface of the glass substrate G that is sucked and held by the suction sheet is also referred to as a non-polished surface.
- the glass substrate peeling apparatus 10 of the present embodiment is an FPD (Flat Panel Display) glass substrate used for liquid crystal displays and the like, and is a thin plate having a thickness of about 0.1 to 1.1 mm.
- the size is, for example, 730 mm ⁇ 920 mm, but is not limited thereto, and may be larger than this.
- the glass substrate peeling apparatus 10 includes a glass substrate peeling / transferring device 18 (peeling means) for peeling the glass substrate G from the suction sheet 14 on the glass substrate holding surface plate 12 and transferring it to the next process.
- the glass substrate peeling / transferring device 18 moves the support plate 22 having a large number of suction pads 20 for sucking the glass substrate G and the support plate 22 closer to and away from (up and down) the glass substrate and moves to the next step.
- a guide (suction pad moving means) 24 is provided.
- suction pads 20 are provided with twelve suction pads 20, but the number of suction pads 20 installed on the support plate 22 is not limited to this.
- the suction pad 20 can be moved up and down independently by an independent air cylinder 26. Each air cylinder 26 is controlled to move up and down by a control means (not shown).
- the suction pad 20 is pressed and brought into contact with the polishing surface of the glass substrate G by the lowering operation of the suction pad 20, and the glass substrate G is sucked to the suction pad 20, and the glass substrate G is peeled from the suction sheet 14 by the upward movement of the suction pad 20. Is done.
- the gap between the glass substrate G and the suction sheet 14 is A liquid is interposed in As this liquid, water is usually used, but a liquid other than water may be used.
- Polyhydric alcohol is an example of a liquid other than water. If it is a polyhydric alcohol, not only can the glass substrate G be easily peeled off from the adsorbing sheet 14, but also it will be harder to dry than water.
- the kind of polyhydric alcohol is not particularly limited, and specific examples include glycerin, polyethylene glycol, ethylene glycol, propylene glycol, diethylene glycol and the like. Further, it may be composed of two or more kinds of polyhydric alcohols, and a polyhydric alcohol and water may be mixed to form a polyhydric alcohol aqueous solution.
- the adsorption force is not so strong at the initial stage of attachment, but the glass substrate G is not removed from the polishing pad when polishing the glass substrate G. Due to the pressing, the adsorbing force becomes very large after polishing, so it is difficult to peel the glass substrate G from the adsorbing sheet 14 after polishing. Therefore, a liquid is interposed between the glass substrate G and the suction sheet 14 to increase the suction force at the initial stage of attachment, and the suction force after polishing is not so strong, so that the suction sheet 14 of the glass substrate G after polishing is increased. Can be easily peeled off.
- the amount of the liquid interposed between the glass substrate G and the adsorption sheet 14 is preferably 0.01 ⁇ l / cm 2 to 0.001 ml / cm 2 . If the amount of liquid exceeds 0.001 ml / cm 2 , the glass substrate G is displaced, and the glass substrate G may be damaged during polishing. On the other hand, if the amount of liquid is less than 0.01 ⁇ l / cm 2 , the initial adsorbing power drops as in the case where the liquid is not applied, so that the glass substrate G may be damaged during polishing. Therefore, an appropriate amount of liquid is applied to the surface of the adsorption sheet 14.
- the method of interposing the liquid between the glass substrate G and the adsorption sheet 14 is not particularly limited.
- the liquid when a liquid is applied to the surface (application surface) of the glass substrate G and the suction sheet that contacts the other member, the liquid may be sprayed with a nozzle toward the application surface.
- the absorbed roller may be brought into contact with the application surface to apply the liquid, and an appropriate application means can be used.
- the glass substrate G After applying a liquid to one of the glass substrate G and the suction sheet, the glass substrate G is placed on the suction sheet 14.
- the glass substrate G placed on the suction sheet 14 on the glass substrate holding surface plate 12 and held by suction is polished by a continuous polishing apparatus (not shown) and then to a predetermined position of the glass substrate peeling apparatus 10. Be transported.
- the support plate 22 of the glass substrate peeling / transferring apparatus 18 is moved onto the glass substrate G by the guide 24 and lowered to a predetermined height.
- the suction pad 20 descends toward the glass substrate G by the action of each air cylinder 26 operated by a control means (not shown) and comes into contact with the polishing surface of the glass substrate G.
- the suction pad 20 positioned at the end of the glass substrate G is raised by the control means so as to be separated from the glass substrate G, and the glass substrate G is peeled off from the end as indicated by an arrow Y in FIG. Go.
- the suction force between the glass substrate G and the suction sheet 14 is not so strong, and the end of the glass substrate G can be easily removed from the suction sheet 14. Can be peeled off.
- the support plate 22 is further lifted away from the glass substrate G by the guide 24, and the glass substrate G is held by the suction pad 20 and transferred to the next process apparatus. Included.
- the glass substrate peeling / transferring device 18 having a plurality of suction pads is moved toward or away from the glass substrate G by a control means (not shown) and translated in the in-plane direction of the glass substrate G.
- the glass substrate G is peeled from the suction sheet 14 and conveyed to the next process.
- FIG. 3 shows an example of a batch-type (single-wafer type) polishing apparatus that polishes glass substrates G one by one.
- a single-wafer polishing apparatus 30 shown in FIG. 3 is an example of an apparatus for polishing glass substrates G one by one.
- the single wafer polishing apparatus 30 is installed on a glass substrate holding surface plate 32 having an adsorbing sheet 34 for adsorbing and holding the glass substrate G, a polishing surface plate 35 disposed above the glass substrate holding surface plate 32, and a lower surface thereof.
- a rocking mechanism 38 for moving the polished polishing pad 36 and the polishing surface plate 35 up and down and a rotation mechanism for rotating a glass substrate holding surface plate 32 (not shown) are provided.
- a predetermined amount of liquid is applied to the suction surface of the glass substrate G of the suction sheet 34 on the glass substrate holding surface plate 32 or the non-polished surface of the glass substrate G, and the suction sheet 34 A glass substrate G is attached to the substrate. Then, the glass substrate holding surface plate 32 is rotated, the polishing surface plate 35 is lowered, the polishing pad 36 is pressed against the polishing surface of the glass substrate G, and the polishing pad 36 is shaken while rotating the glass substrate holding surface plate 32. The glass substrate G is polished by moving.
- the glass substrate holding surface plate 32 may be swung with respect to the polishing pad 36 without swinging the polishing pad 36, or both the glass substrate holding surface plate 32 and the polishing pad 36 may be swung. May be swung.
- FIG. 4 shows an example of another single wafer polishing apparatus.
- FIG. 4 is an apparatus for polishing one glass substrate G.
- a circular polishing pad 74 is disposed on a cylindrical polishing surface plate 72 so as to be rotatable about the center of the polishing pad 74.
- the polishing pad 74 is a polishing surface plate. It is rotated in the direction of arrow A in the figure by a motor (not shown) provided at 72.
- the polishing pad 74 is configured to be larger than the size of the glass substrate G.
- a disc-shaped glass substrate holding surface plate 78 is configured to be movable up and down with respect to the polishing pad 74 via a hinge 76 on the polishing surface plate 72, and an arrow B in the figure is shown by a swing driving unit (not shown). Rocks in the direction.
- the suction sheet 80 is fixed to the lower surface of the glass substrate holding surface plate 78. In addition, a rectangular glass substrate G is sucked and held at the center of the suction sheet 80.
- the glass substrate holding surface plate 78 is laid down to press the glass substrate G against the surface of the polishing pad 74. Let Then, the polishing pad 74 is rotated in the direction of arrow A in the drawing, and the glass substrate holding surface plate 78 is swung in the direction of arrow B in the drawing to start polishing the glass substrate G.
- FIG. 5 shows a state where the glass substrate G after being polished by the single-wafer polishing apparatus 30 is peeled from the suction sheet 34.
- the polishing surface plate 35 is retracted to a predetermined retracted position, and instead, the same glass substrate peeling / transferring apparatus as the glass substrate peeling / transferring apparatus 18 of FIG. 40 is moved onto the glass substrate G sucked and held by the suction sheet 34 on the glass substrate holding surface plate 32.
- the glass substrate peeling / transferring device 40 moves up and down the support plate 42 and the support plate 42 having a large number of suction pads 44 for sucking the glass substrate G, and moves them to the next step.
- a guide 48 is provided.
- suction pad 44 can be moved up and down independently by each independent air cylinder 46 as in the first embodiment.
- the adsorbing force between the polished glass substrate G and the adsorption sheet 34 is not so strong and can be easily peeled off.
- FIG. 6 shows a cross-sectional view of the main part of the glass substrate peeling apparatus 50 according to the second embodiment.
- an adsorption sheet 54 for adsorbing and holding the glass substrate G is installed on the glass substrate holding surface plate 52 of the glass substrate peeling apparatus 50.
- a predetermined hole (through hole) 56 is provided in the suction sheet 54, and a hole 58 having the same diameter is provided in the glass substrate holding surface plate 52 so as to be arranged in the same manner as the suction sheet 54. .
- the opening surface on the non-polished surface side of the hole 56 of the suction sheet 54 and the opening surface on the suction sheet 54 side of the hole 58 of the glass substrate holding surface plate 52 are formed so as to be similarly arranged,
- the suction sheet 54 is positioned on the glass substrate holding surface plate 52, and the hole 56 and the hole 58 communicate with each other to form one hole.
- a pin 60 that can be moved up and down by a lifting mechanism (not shown) is disposed in the hole 58 of the glass substrate holding surface plate 52.
- the raising / lowering mechanism of the pin 60 is controlled by the control means not shown like the said embodiment.
- the lifting mechanism of the pin 60 include a mechanism that moves up and down by a well-known mechanical mechanism such as a pinion rack, a mechanism that lifts and lowers using the pressure of a gas such as air or a fluid such as water or oil, and a magnetic mechanism.
- a known mechanism such as a mechanism that lifts and lowers using the repulsive force / attractive force of can be employed.
- the pin 60 is for lifting and pushing up the glass substrate G from the non-polished surface side of the glass substrate G to peel the glass substrate G from the suction sheet 54. Therefore, the tip of the pin 60 is rounded to prevent damage to the glass substrate G.
- the positions of the holes 56 and 58 and the pins 60 are preferably arranged at positions corresponding to the end portions of the glass substrate G and peeled off from the end portions of the glass substrate G as shown in FIG.
- the number of holes and pins is not limited to that shown in FIG. 6, and the number may be further increased according to the size of the glass substrate G, for example.
- FIG. 7 shows the operation of this embodiment.
- the pin 60 is lifted in the direction of arrow C in the drawing by an elevating mechanism (not shown), and the non-polished surface of the glass substrate G that has been polished is pressed by the pin 60 to attract the glass substrate G.
- the sheet is lifted from the sheet 54 and peeled off from the suction sheet 54.
- the speed at which the pins 60 are raised is preferably increased slowly so as not to damage the glass substrate G, preferably at a speed of 30 mm / second or less. .
- the method of lifting the glass substrate G from the suction sheet by pressing the non-polished surface of the glass substrate G with pins in this way and peeling the glass substrate G from the suction sheet is the same as the glass substrate peeling apparatus 10 shown in FIG. It can also be applied to.
- the pin 60 may be provided not only at a position corresponding to the end of the non-polished surface of the glass substrate G but also at a position corresponding to the central portion of the non-polished surface of the glass substrate G.
- the pin 60 is provided also in the location corresponding to the center portion, the pin 60 corresponding to the end portion is first raised, the end portion of the glass substrate G is first peeled off from the suction sheet 54, and then the glass The pin 60 corresponding to the central portion of the substrate G is raised, and the central portion of the glass substrate G is peeled off from the suction sheet 54.
- FIG. 8 shows a third embodiment of the present invention.
- the polishing pad 74 is provided on the lower side, and the glass substrate G is sucked and held on the suction sheet 80 of the upper glass substrate holding surface plate 78.
- 6 is a glass substrate peeling apparatus 71 for peeling the glass substrate G from the suction sheet 80 by applying the pins of the second embodiment as shown in FIG.
- the glass substrate G is sucked and held on the suction sheet 80 on the lower surface of the glass substrate holding surface plate 78.
- a plurality of predetermined holes 82 are formed in the glass substrate holding surface plate 78 and the suction sheet 80.
- a pin 84 that can be moved up and down by a lifting mechanism (not shown) is disposed.
- the non-polished surface of the glass substrate G is pushed by the pins 84 to peel the glass substrate G from the suction sheet 80.
- FIG. 9 shows the operation of this embodiment.
- the pin 84 is lowered in the direction of arrow D in the drawing by a lifting mechanism (not shown), and the non-polished surface of the glass substrate G that has been polished is pressed by the pin 84, so The polished surface is peeled off from the suction sheet 80.
- the pins 84 are arranged so as to contact the end portions of the glass substrate G, so that the glass substrate G peels from the end portions.
- the edge of the glass substrate G is peeled off by the pins 84, and the peeling of the glass substrate G is promoted from the edge toward the center by the weight of the glass substrate G. As a result, the whole glass substrate G peels from the adsorption sheet 80, and the glass substrate G falls.
- the speed of lowering the pin 84 is slow enough not to damage the thin glass substrate G, preferably at a speed of 30 mm / second or less. Moreover, while pushing the non-polishing surface of the glass substrate G with the pin 84, air may be sprayed on this surface to promote peeling. Moreover, it is preferable that a means for receiving the glass substrate G that is peeled off and disposed is arranged in the dropping direction of the glass substrate G to receive the glass substrate G and transfer it to the next step.
- the pin 84 may be provided not only in the portion corresponding to the end portion of the non-polishing surface of the glass substrate G but also in the portion corresponding to the central portion of the non-polishing surface of the glass plate G.
- the pin 84 at the location corresponding to the end portion is first lowered to peel the end portion of the glass plate G from the suction sheet 80 first, and thereafter The pin 84 at a location corresponding to the central portion may be lowered to peel the central portion of the glass plate G from the suction sheet 80.
- FIG. 10 shows a cross-sectional view of the main part of a glass substrate peeling apparatus 90 according to the fourth embodiment.
- an adsorption sheet 54 for adsorbing and holding the glass substrate G is installed on the glass substrate holding surface plate 52 of the glass substrate peeling apparatus 90.
- a hole (through hole) 56 is provided in the suction sheet 54 of the present embodiment, and a hole 58 having the same diameter as the hole 56 is provided in the glass substrate holding surface plate 52.
- the opening surface on the non-polished surface side of the hole 56 of the suction sheet 54 and the opening surface on the suction sheet 54 side of the hole 58 of the glass substrate holding surface plate 52 are arranged in the same manner as in the second embodiment.
- the suction sheet 54 is positioned on the glass substrate holding surface plate 52, and the hole 56 and the hole 58 communicate with each other to form one hole.
- one end of the tube 62 is connected to the opening surface of the hole 58 formed on the bottom surface of the glass substrate holding surface plate 52, which is the surface opposite to the surface on which the suction sheet 54 is installed, and the other end of the tube 62 is not. It is connected to the illustrated air pump (air supply means).
- the air pump is connected to air pump control means (not shown), and air whose pressure is controlled by the air pump control means is supplied to the holes 56 and 58 from the air pump.
- air is blown from the holes 56 and 58 to the non-polished surface of the glass substrate G, and the glass substrate G is peeled off from the suction sheet 54.
- FIG. 11 shows a state where the glass substrate G is peeled from the suction sheet 54.
- the glass substrate G When the polished glass substrate G is peeled from the suction sheet 54, the glass substrate G is removed from the tube 62 through the hole 58 of the glass substrate holding surface plate 52 and the hole 56 of the suction sheet 54 as shown in FIG. Air is blown against the non-polished surface. The glass substrate G is peeled from the suction sheet 54 by the pressure of the air.
- the position and number of holes are not limited to this.
- the number may be further increased according to the size of the glass substrate G or the like.
- the holes 56 and 58 may be provided not only in the portion corresponding to the end portion of the glass substrate G but also in the central portion as shown in FIGS. When a hole is also provided in the central part, air is blown first from the end hole to the glass substrate G to peel off the end part of the glass substrate G first, and then air is supplied from the central hole. It is good to peel off the center part by blowing.
- air is blown onto the non-polished surface of the glass substrate G, and the suction pad installed in the glass substrate peeling / transferring device 18 of the first embodiment described above is used together. Also good. That is, the air supplied from the tube 62 is blown to the non-polished surface of the glass substrate G through the hole 58 of the glass substrate holding surface plate 52 and the hole 56 of the suction sheet 54, and the end of the glass substrate G is discharged from the suction sheet 54. The glass substrate G is lifted and lifted by the suction pad 20 of the glass substrate peeling / transferring device 18 sucked and held on the polished surface of the glass substrate G, whereby the glass substrate G is peeled off from the suction sheet 54 more easily and quickly. it can.
- the glass substrate peeling / transferring apparatus 18 of the first embodiment may be combined with the second embodiment shown in FIG. That is, the non-polished surface of the glass substrate G is pushed up by the pin 60 and the glass substrate G is lifted by the suction pad 20 of the glass substrate peeling / transferring device 18 held by suction on the polished surface of the glass substrate G. Can be peeled off from the adsorption sheet 54 more easily and quickly.
- the non-polished surface of the glass substrate G is pushed up with a pin, and air is blown from the non-polished surface of the glass substrate G to lift the glass substrate G from the adsorption sheet.
- the glass substrate G may be lifted by the suction pad 20 of the glass substrate peeling / transferring apparatus 18 from the G holding surface.
- a hole for blowing air may be a pin hole, or a hole may be provided separately from the pin hole.
- the diameter of the hole of the pin and the diameter of the hole for blowing air are not particularly limited, but the diameter of the hole is preferably 10 mm or less, more preferably 5 mm or less, further preferably 1 mm or less, and most preferably 0. 1 mm or less.
- the diameter of the hole of the pin and the diameter of the hole for blowing out the air are 10 mm or less, there is no possibility that the thin glass substrate is deformed into a concave shape by its own weight in the hole of the pin and the hole for blowing out the air.
- the diameter of the hole which blows off air is 10 mm or less, since the pressure which blows off air can be strengthened, it will become easy to peel the glass substrate G.
- the thickness of the glass substrate is 0.7 mm or less, preferably 0.5 mm or less, more preferably 0.3 mm or less, and most preferably 0.1 mm or less, the effect of preventing the concave deformation and improving the air blowing pressure. Demonstrate.
- FIG. 13 shows the glass substrate peeling mechanism of the present embodiment.
- an adsorption sheet 94 for adsorbing and holding the glass substrate G is installed on the glass substrate holding surface plate 92 of the glass substrate peeling apparatus 98, and the glass substrate G is adsorbed through a liquid such as water. Affixed to the sheet 94.
- the glass substrate holding surface plate 92 is provided with a rotating mechanism 96 that rotates the glass substrate holding surface plate 92.
- the glass substrate holding surface plate 92 When peeling the glass substrate G from the suction sheet 94, as shown in FIG. 14, the glass substrate holding surface plate 92 is rotated in the direction of arrow E by the rotation mechanism 96 provided on the glass substrate holding surface plate 92, The glass substrate holding surface plate 92 is turned upside down to place the glass substrate G below the glass substrate holding surface plate 92. As a result, the glass substrate G is dropped by its own weight in the direction of the arrow F and peeled off from the suction sheet 94.
- the non-polished surface of the glass substrate G is pushed with a pin provided on the glass substrate holding surface plate, or air is blown onto the non-polished surface of the glass substrate G from a hole provided in the glass substrate holding surface plate. Then, peeling of the glass substrate G from the adsorption sheet may be promoted. At this time, pins and air may be applied first from the end of the glass substrate G, and the glass substrate G may be peeled first from the end. Further, it is preferable that a means for receiving the glass substrate G that is peeled off from the suction sheet 94 is arranged in the dropping direction of the glass substrate G and is transferred to the next step after receiving the glass substrate G.
- the glass substrate is attached and fixed with a liquid interposed in the adsorption sheet, so that the adsorption force of the glass substrate does not increase even after polishing. Therefore, the suction pad is used to suck and hold the polished surface of the glass substrate, the non-polished surface of the glass substrate is pushed up with a pin, air is blown from the non-polished surface of the glass substrate, or the glass substrate and the holding member
- the glass substrate can be stably peeled from the suction sheet in a short time by reversing the top and bottom in order to reverse the positional relationship.
- At least one of air (compressed air) and water (high pressure water) may be sprayed toward the interface between the glass substrate and the adsorption sheet.
- Embodiments 2 to 5 when the thin glass substrate is peeled from the suction sheet, the angle of the hole of the pin and the angle of the hole that blows out the air are set to be perpendicular to the suction sheet setting surface of the glass substrate holding surface plate. And oblique. Specifically, the angle of the pin corresponding to the end portion of the glass substrate G is oblique toward the central portion of the glass substrate, and the angle of the pin corresponding to the central portion of the glass substrate is in the direction orthogonal to the non-polished surface. It is preferable that they are parallel to each other.
- the thickness of the glass substrate G is 0.7 mm or less, preferably 0.5 mm or less, more preferably 0.3 mm or less, and most preferably 0.1 mm or less, the effect of preventing local deformation is exhibited.
- Tube 70 ... Single wafer type polishing device, 71 ... Glass Substrate peeling device, 72 ... polishing surface plate, 74 ... polishing pad, 76 ... hinge, 78 ... glass substrate holding surface plate, 80 ... adsorption sheet, 82 ... hole, 84 ... pin, 90 ... glass substrate peeling device, 92 ... glass Board maintenance Surface plate, 94 ... suction sheet, 96 ... rotating mechanism, 98 ... glass substrate peeling apparatus, 100 ... glass substrate holding plate, 100a ... suction sheet mounting surface, 102 ... suction sheet, 104 ... hole 106 ... pin
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Abstract
Description
本出願は、2011年7月4日出願の日本特許出願2011-148552に基づくものであり、その内容はここに参照として取り込まれる。
Claims (13)
- 吸着シートに液体を介在させて吸着保持されたガラス基板を当該吸着シートから剥離する剥離手段を備えたことを特徴とするガラス基板剥離装置。
- 前記剥離手段は、
前記吸着シートに前記液体を介在させて吸着保持された前記ガラス基板の前記吸着シートと反対の面を保持する複数の吸着パッドと、
前記ガラス基板に対して接近及び離間の一方の動作をするように、前記複数の吸着パッドをそれぞれ独立に昇降動作させる昇降機構と、
前記ガラス基板を前記吸着シートから剥離する際には、前記ガラス基板の端部を吸着する前記吸着パッドから、徐々に前記吸着シートから退避する方向に持ち上げて行き、前記ガラス基板全体を前記吸着シートから剥離させるように前記昇降機構を制御する制御手段と、
前記複数の吸着パッド全体を前記ガラス基板に対して接近または離間させ、前記ガラス基板の面内方向に平行移動させる吸着パッド移動手段と、
を備えた請求項1に記載のガラス基板剥離装置。 - 前記剥離手段は、
前記液体を介在させて前記ガラス基板を吸着保持し、当該ガラス基板を吸着保持する領域に複数の貫通穴が設けられた吸着シートと、
前記吸着シートを載置し、前記吸着シートを載置する領域に前記複数の貫通穴の開口面と一致するように複数の穴が設けられたガラス基板保持定盤と、
前記複数の穴の中に配置され、前記吸着シートの貫通穴から突出するように昇降動作するピンと、
前記ピンを前記吸着シートから突出するように昇降動作させる昇降機構と、
前記ピンを昇降動作させて前記ガラス基板を前記吸着シートから剥離させるように前記昇降機構を制御する制御手段と、
を備えた請求項1に記載のガラス基板剥離装置。 - 前記複数の貫通穴及び前記複数の穴は、前記ガラス基板を吸着保持する領域の端部においては、該端部から前記ガラス基板の中央部に向かうように、前記ガラス基板保持定盤の吸着シート設置面の直交方向に対して斜めに形成するとともに、前記ガラス基板を吸着保持する領域の中央部においては、前記ガラス基板保持定盤の吸着シート設置面の直交方向に平行に形成する請求項3に記載のガラス基板剥離装置。
- 前記剥離手段は、
前記液体を介在させて前記ガラス基板を吸着保持し、当該ガラス基板を吸着保持する領域に複数の貫通穴が設けられた吸着シートと、
前記吸着シートを載置し、前記吸着シートを載置する領域に前記複数の貫通穴の開口面と一致するように複数の穴が設けられたガラス基板保持定盤と、
前記複数の穴の中にエアーを供給し、前記ガラス基板の前記吸着シートで吸着保持されている面に前記エアーを吹き付けるエアー供給手段と、
を備えた請求項1に記載のガラス基板剥離装置。 - 前記複数の貫通穴及び前記複数の穴は、前記ガラス基板を吸着保持する領域の端部においては、該端部から前記ガラス基板の中央部に向かうように、前記ガラス基板保持定盤の吸着シート設置面の直交方向に対して斜めに形成するとともに、前記ガラス基板を吸着保持する領域の中央部においては、前記ガラス基板保持定盤の吸着シート設置面の直交方向に平行に形成する請求項5に記載のガラス基板剥離装置。
- 前記剥離手段は、
前記吸着シートの上面に研磨したガラス基板を前記液体を介在させて吸着保持するガラス基板保持定盤と、
前記ガラス基板保持定盤の天地を逆に反転する手段と、
を備え、研磨後のガラス基板を前記ガラス基板保持定盤の天地を逆に反転し、重力方向上方に前記吸着シート、下方に前記ガラス基板が位置するようにして、前記ガラス基板が自重で前記吸着シートから剥離されるようにした請求項1に記載のガラス基板剥離装置。 - ガラス基板を吸着シートに液体を介在させて吸着保持して研磨したガラス基板の前記吸着シートと反対の面を複数の吸着パッドで吸着する工程と、
前記複数の吸着パッドのうち前記ガラス基板の端部を吸着する前記吸着パッドから、徐々に前記吸着シートから退避する方向に持ち上げて行き、前記ガラス基板全体を前記吸着シートから剥離させて行く工程と、
前記ガラス基板を前記吸着シートから離間させ、前記ガラス基板の面内方向に平行移動させて、前記ガラス基板を次の作業工程に移載する工程と、
を備えたことを特徴とするガラス基板の剥離方法。 - 複数の穴が設けられたガラス基板保持定盤上に載置された、前記複数の穴の開口面と一致するように複数の貫通穴が設けられた吸着シートに、研磨したガラス基板を液体を介在させて吸着保持する工程と、
前記複数の穴の中に配置され、前記吸着シートの貫通穴から突出するように昇降動作するピンを昇降動作させて、前記ガラス基板の前記吸着シートで吸着保持されている面を前記ピンで押し上げて前記ガラス基板を前記吸着シートから剥離する工程と、
を備えたことを特徴とするガラス基板の剥離方法。 - 前記複数の貫通穴及び前記複数の穴は、前記ガラス基板を吸着保持する領域の端部においては、該端部から前記ガラス基板の中央部に向かうように、前記ガラス基板保持定盤の吸着シート設置面の直交方向に対して斜めに形成されるとともに、前記ガラス基板を吸着保持する領域の中央部においては、前記ガラス基板保持定盤の吸着シート設置面の直交方向に平行に形成され、前記ガラス基板を吸着保持する領域の端部においては、前記ピンを前記貫通穴及び前記穴に沿って前記ガラス基板の中央部に向かって斜めに上昇させるとともに、前記ガラス基板を吸着保持する領域の中央部においては、前記ピンを前記貫通穴及び前記穴に沿って真上に上昇させる請求項9に記載のガラス基板の剥離方法。
- 複数の穴が設けられたガラス基板保持定盤上に載置された、前記複数の穴の開口面と一致するように複数の貫通穴が設けられた吸着シートに、研磨したガラス基板を液体を介在させて吸着保持する工程と、
前記複数の穴を介して、前記ガラス基板の前記吸着シートで吸着保持されている面にエアーを吹き付けて、前記ガラス基板を押し上げて、前記ガラス基板を前記吸着シートから剥離する工程と、
を備えたことを特徴とするガラス基板の剥離方法。 - 前記複数の貫通穴及び前記複数の穴は、前記ガラス基板を吸着保持する領域の端部においては、該端部から前記ガラス基板の中央部に向かうように、前記ガラス基板保持定盤の吸着シート設置面の直交方向に対して斜めに形成されるとともに、前記ガラス基板を吸着保持する領域の中央部においては、前記ガラス基板保持定盤の吸着シート設置面の直交方向に平行に形成され、前記ガラス基板を吸着保持する領域の端部においては、前記エアーを前記貫通穴及び前記穴に沿って前記ガラス基板の中央部に向かって斜めに吹き付けるとともに、前記ガラス基板を吸着保持する領域の中央部においては、前記エアーを前記貫通穴及び前記穴に沿って真上に吹き付ける請求項11に記載のガラス基板の剥離方法。
- ガラス基板保持定盤上に載置された吸着シートの上面に、研磨したガラス基板を液体を介在させて吸着保持する工程と、
前記ガラス基板保持定盤の天地を逆に反転することにより、前記吸着シート及び前記ガラス基板の天地を逆に反転する工程と、
を備え、前記ガラス基板と前記吸着シートの天地を逆に反転し、重力方向上方に前記吸着シート、下方に前記ガラス基板が位置するようにして、前記ガラス基板が自重で前記吸着シートから剥離するようにしたことを特徴とするガラス基板の剥離方法。
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- 2012-06-22 WO PCT/JP2012/066074 patent/WO2013005589A1/ja active Application Filing
- 2012-07-04 TW TW101124071A patent/TW201307000A/zh unknown
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014133007A1 (ja) * | 2013-02-26 | 2014-09-04 | 日本電気硝子株式会社 | 電子デバイスの製造方法 |
JP2014194541A (ja) * | 2013-02-26 | 2014-10-09 | Nippon Electric Glass Co Ltd | 電子デバイスの製造方法 |
JP2014216632A (ja) * | 2013-04-30 | 2014-11-17 | 東京応化工業株式会社 | 支持体分離装置及び支持体分離方法 |
US9238357B2 (en) | 2013-04-30 | 2016-01-19 | Tokyo Ohka Kogyo Co., Ltd. | Supporting member separation apparatus and supporting member separation method |
US9187358B2 (en) | 2013-05-07 | 2015-11-17 | Corning Incorporated | Process and apparatus for forming shaped glass articles |
US9656899B2 (en) | 2013-05-07 | 2017-05-23 | Corning Incorporated | Process and apparatus for forming shaped glass articles |
CN107471107A (zh) * | 2017-08-31 | 2017-12-15 | 阜阳市风雅颂生产力促进中心有限责任公司 | 一种玻璃磨边机用自动夹持装置 |
CN113299576A (zh) * | 2020-02-21 | 2021-08-24 | 济南晶正电子科技有限公司 | 一种薄膜机械分离装置 |
CN114311952A (zh) * | 2021-12-16 | 2022-04-12 | 珠海市奥德维科技有限公司 | 膜片剥离平台 |
CN114311952B (zh) * | 2021-12-16 | 2022-12-09 | 珠海市奥德维科技有限公司 | 膜片剥离平台 |
Also Published As
Publication number | Publication date |
---|---|
KR20140033433A (ko) | 2014-03-18 |
JP2014179355A (ja) | 2014-09-25 |
TW201307000A (zh) | 2013-02-16 |
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