JP2014011335A5 - - Google Patents
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- Publication number
- JP2014011335A5 JP2014011335A5 JP2012147389A JP2012147389A JP2014011335A5 JP 2014011335 A5 JP2014011335 A5 JP 2014011335A5 JP 2012147389 A JP2012147389 A JP 2012147389A JP 2012147389 A JP2012147389 A JP 2012147389A JP 2014011335 A5 JP2014011335 A5 JP 2014011335A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- adhesive layer
- wiring
- support substrate
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 42
- 239000012790 adhesive layer Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012147389A JP6029873B2 (ja) | 2012-06-29 | 2012-06-29 | 配線基板、配線基板の製造方法及び半導体装置の製造方法 |
| US13/926,214 US8945336B2 (en) | 2012-06-29 | 2013-06-25 | Wiring substrate and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012147389A JP6029873B2 (ja) | 2012-06-29 | 2012-06-29 | 配線基板、配線基板の製造方法及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014011335A JP2014011335A (ja) | 2014-01-20 |
| JP2014011335A5 true JP2014011335A5 (enExample) | 2015-08-06 |
| JP6029873B2 JP6029873B2 (ja) | 2016-11-24 |
Family
ID=49777270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012147389A Active JP6029873B2 (ja) | 2012-06-29 | 2012-06-29 | 配線基板、配線基板の製造方法及び半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8945336B2 (enExample) |
| JP (1) | JP6029873B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185716A (zh) * | 2014-02-13 | 2015-12-23 | 群成科技股份有限公司 | 电子封装件、封装载板及两者的制造方法 |
| KR20160001169A (ko) * | 2014-06-26 | 2016-01-06 | 삼성전자주식회사 | 마킹층을 포함하는 반도체 패키지 |
| JP2016122802A (ja) * | 2014-12-25 | 2016-07-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2017157593A (ja) * | 2016-02-29 | 2017-09-07 | 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法 |
| CN114080088B (zh) * | 2020-08-10 | 2024-05-31 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制备方法 |
| US20230106612A1 (en) * | 2021-10-05 | 2023-04-06 | Advanced Semiconductor Engineering, Inc. | Method of manufacturing electrical package |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1213755A3 (en) * | 1994-03-18 | 2005-05-25 | Hitachi Chemical Co., Ltd. | Fabrication process of semiconductor package and semiconductor package |
| JP3529507B2 (ja) * | 1995-09-04 | 2004-05-24 | 沖電気工業株式会社 | 半導体装置 |
| JPH10270592A (ja) * | 1997-03-24 | 1998-10-09 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
| JP4103482B2 (ja) * | 2002-07-16 | 2008-06-18 | 日立化成工業株式会社 | 半導体搭載基板とそれを用いた半導体パッケージ並びにそれらの製造方法 |
| US7556984B2 (en) * | 2005-06-17 | 2009-07-07 | Boardtek Electronics Corp. | Package structure of chip and the package method thereof |
| JP4984502B2 (ja) | 2005-11-28 | 2012-07-25 | 凸版印刷株式会社 | Ｂｇａ型キャリア基板の製造方法及びｂｇａ型キャリア基板 |
| JP2007150099A (ja) * | 2005-11-29 | 2007-06-14 | Hitachi Cable Ltd | 配線基板及びその製造方法並びに配線基板を用いた電子部品の製造方法及びその装置 |
| US8288869B2 (en) * | 2009-05-13 | 2012-10-16 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with substrate having single metal layer and manufacturing methods thereof |
-
2012
- 2012-06-29 JP JP2012147389A patent/JP6029873B2/ja active Active
-
2013
- 2013-06-25 US US13/926,214 patent/US8945336B2/en active Active
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