JP2014007154A - 照明装置 - Google Patents
照明装置 Download PDFInfo
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- JP2014007154A JP2014007154A JP2013113822A JP2013113822A JP2014007154A JP 2014007154 A JP2014007154 A JP 2014007154A JP 2013113822 A JP2013113822 A JP 2013113822A JP 2013113822 A JP2013113822 A JP 2013113822A JP 2014007154 A JP2014007154 A JP 2014007154A
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- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
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- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910017090 AlO 2 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
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- 239000010419 fine particle Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Led Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
【解決手段】複数のLED素子(51)を上面に実装したモジュール基板(20)と、凸部(29)を有し且つ複数のLED素子が発する熱を放散する放熱部材(28)と、開口部(27)を有し且つモジュール基板の下面の一部と放熱部材との間に配置された前縁シート(26)を有し、凸部が開口部を介してモジュール基板における複数のLED素子が実装された領域の下面に近接するように配置されていることを特徴とする照明装置(90)。
【選択図】図5
Description
21 電力供給端子
22 端子配線
23、24 ダム材
25 蛍光樹脂
26 絶縁シート
27 開口
28 放熱部材
29 凸部
51 LEDダイ(LED素子)
52、81 電子部品
53 ワイヤ
54 ホルダー
55 熱伝導性樹脂層
70、71 パッケージLED(LED素子)
72 蛍光体シート
73 サファイヤ基板
74 半導体層
75 突起電極
76 反射部材
77 蛍光部材
82 ハンダ
90 照明装置
100、110 光源部
300 点灯回路
301、302、303、304 ダイオード
305 ダイオードブリッジ回路
306 商用交流電源
307 ヒューズ
310、330 部分LED列
310a、310b、330a、330b LEDダイ(LED素子)
320 バイパス回路
321 第1電流入力端子
322 第2電流入力端子、
323、343 電流出力端子
324、344 FET
325、345 抵抗
Claims (15)
- 複数のLED素子を上面に実装したモジュール基板と、
凸部を有し且つ前記複数のLED素子が発する熱を放散する放熱部材と、
開口部を有し且つ前記モジュール基板の下面の一部と前記放熱部材との間に配置された前縁シートと、を有し、
前記凸部が前記開口部を介して前記モジュール基板において前記複数のLED素子が実装された領域の下面に近接するように配置されている、
ことを特徴とする照明装置。 - 前記凸部は前記モジュール基板において前記複数のLED素子が実装された領域の下面に接触している、請求項1に記載の照明装置。
- 前記モジュール基板の下面と前記凸部との間に熱伝導性樹脂層が配置されている、請求項1に記載の照明装置。
- 前記絶縁シートが前記凸部より厚い、請求項1又は3に記載の照明装置。
- 前記絶縁シートが箱型に形成されている、請求項1〜4の何れか一項に記載の照明装置。
- 前記モジュール基板には、前記複数のLED素子を囲むダム材が設けられ、前記LED素子が蛍光樹脂で被覆されている、請求項1〜5の何れか一項に記載の照明装置。
- 前記モジュール基板には、前記ダム材の外側の領域に点灯回路の一部分が実装され、前記点灯回路の一部分が前記蛍光樹脂で被覆されている、請求項6に記載の照明装置。
- 前記ダム材の一部と、前記点灯回路の一部分を囲むダム材の一部が共通化している、請求項7に記載の照明装置。
- 前記複数のLED素子が樹脂で被覆されパッケージ化している、請求項1〜5の何れか一項に記載の照明装置。
- 前記モジュール基板には、前記複数のLED素子の点灯回路の一部分が実装されている、請求項9に記載の照明装置。
- 前記点灯回路は、ダイオードブリッジ回路と、バイパス回路と、前記複数のLED素子が直列接続したLED列とを含み、
前記ダイオードブリッジ回路は商用交流電源との接続端子を備え、
前記バイパス回路は第1電流入力端子と第2電流入力端子と電流出力端子を備え、
前記LED列は複数の部分LED列から構成され、
前記部分LED列同士の接続部に前記バイパス回路の前記第1電流入力端子が接続し、前記第2電流入力端子に入力する電流に応じて前記第1電流入力端子に入力する電流のオンオフ制御を行われる、請求項7、8及び10の何れか一項に記載の照明装置。 - 前記バイパス回路がディプレッション型のFETを含み、前記FETのドレインが前記第1電流入力端子に接続し、前記FETのソースが前記第2電流入力端子に接続している、請求項11に記載の照明装置。
- 前記モジュール基板がセラミックをベース材料としている、請求項1〜12の何れか一項に記載の照明装置。
- 前記セラミックが白色である、請求項13に記載の照明装置。
- バネ接点を有し且つ前記モジュール基板を固定するホルダーを更に有し、
前記バネ接点は、前記モジュール基板の電力供給端子を押圧し且つ前記電力供給端子と外部回路との電気的接続をとる、請求項1〜14の何れか一項に記載の照明装置。
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JP2013113822A JP6047769B2 (ja) | 2012-06-01 | 2013-05-30 | 照明装置 |
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JP2012126035 | 2012-06-01 | ||
JP2012126035 | 2012-06-01 | ||
JP2013113822A JP6047769B2 (ja) | 2012-06-01 | 2013-05-30 | 照明装置 |
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JP2014007154A true JP2014007154A (ja) | 2014-01-16 |
JP2014007154A5 JP2014007154A5 (ja) | 2016-01-28 |
JP6047769B2 JP6047769B2 (ja) | 2016-12-21 |
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US (1) | US9200795B2 (ja) |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016048607A (ja) * | 2014-08-27 | 2016-04-07 | 東芝ライテック株式会社 | ソケットおよび照明装置 |
US9530760B2 (en) | 2013-12-28 | 2016-12-27 | Nichia Corporation | Light emitting device having plurality of light emitting elements and light reflective member |
JP2017117736A (ja) * | 2015-12-25 | 2017-06-29 | 東芝ライテック株式会社 | ランプ装置および照明装置 |
JP2017208171A (ja) * | 2016-05-16 | 2017-11-24 | パナソニックIpマネジメント株式会社 | 照明器具 |
JPWO2018116698A1 (ja) * | 2016-12-21 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 光源基板の取付構造 |
JP2019185867A (ja) * | 2018-04-02 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 光源装置及び照明器具 |
JP2021026978A (ja) * | 2019-08-08 | 2021-02-22 | 三菱電機株式会社 | 照明器具 |
JP2021068642A (ja) * | 2019-10-25 | 2021-04-30 | 東芝ライテック株式会社 | 車両用照明装置、および車両用灯具 |
US11378259B2 (en) | 2018-12-19 | 2022-07-05 | Nichia Corporation | Light-emitting module |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9035554B2 (en) * | 2013-06-07 | 2015-05-19 | Tai-Hsiang Huang | Adjustable three-stage light emitting diode bulb |
DE102014220656A1 (de) | 2014-03-27 | 2015-10-01 | Tridonic Gmbh & Co Kg | LED-Modul mit integrierter Stromsteuerung |
EP2990725B1 (en) * | 2014-08-27 | 2018-03-07 | Toshiba Lighting & Technology Corporation | Socket and lighting device |
US10257932B2 (en) * | 2016-02-16 | 2019-04-09 | Microsoft Technology Licensing, Llc. | Laser diode chip on printed circuit board |
BE1026114B1 (nl) * | 2018-03-19 | 2019-10-17 | Dk Ceramic Circuits Bvba | Verbinding via component |
DE102018218175A1 (de) * | 2018-10-24 | 2020-04-30 | Osram Gmbh | Leuchte und scheinwerfer |
CN113545171A (zh) * | 2018-12-05 | 2021-10-22 | 亮锐有限责任公司 | 照明模块的载体基座模块 |
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- 2013-05-30 US US13/905,232 patent/US9200795B2/en not_active Expired - Fee Related
- 2013-05-31 CN CN201320311387.3U patent/CN203375196U/zh not_active Expired - Lifetime
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US9530760B2 (en) | 2013-12-28 | 2016-12-27 | Nichia Corporation | Light emitting device having plurality of light emitting elements and light reflective member |
JP2016048607A (ja) * | 2014-08-27 | 2016-04-07 | 東芝ライテック株式会社 | ソケットおよび照明装置 |
JP2017117736A (ja) * | 2015-12-25 | 2017-06-29 | 東芝ライテック株式会社 | ランプ装置および照明装置 |
JP2017208171A (ja) * | 2016-05-16 | 2017-11-24 | パナソニックIpマネジメント株式会社 | 照明器具 |
JPWO2018116698A1 (ja) * | 2016-12-21 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 光源基板の取付構造 |
JP2019185867A (ja) * | 2018-04-02 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 光源装置及び照明器具 |
US11378259B2 (en) | 2018-12-19 | 2022-07-05 | Nichia Corporation | Light-emitting module |
US11619368B2 (en) | 2018-12-19 | 2023-04-04 | Nichia Corporation | Light-emitting module |
JP2021026978A (ja) * | 2019-08-08 | 2021-02-22 | 三菱電機株式会社 | 照明器具 |
JP2021068642A (ja) * | 2019-10-25 | 2021-04-30 | 東芝ライテック株式会社 | 車両用照明装置、および車両用灯具 |
JP7341394B2 (ja) | 2019-10-25 | 2023-09-11 | 東芝ライテック株式会社 | 車両用照明装置、および車両用灯具 |
Also Published As
Publication number | Publication date |
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JP6047769B2 (ja) | 2016-12-21 |
CN203375196U (zh) | 2014-01-01 |
US9200795B2 (en) | 2015-12-01 |
US20130334974A1 (en) | 2013-12-19 |
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