JP2013542422A5 - - Google Patents

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Publication number
JP2013542422A5
JP2013542422A5 JP2013531611A JP2013531611A JP2013542422A5 JP 2013542422 A5 JP2013542422 A5 JP 2013542422A5 JP 2013531611 A JP2013531611 A JP 2013531611A JP 2013531611 A JP2013531611 A JP 2013531611A JP 2013542422 A5 JP2013542422 A5 JP 2013542422A5
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JP
Japan
Prior art keywords
conductive electrode
dielectric layer
conductive
sensor element
thickness
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Pending
Application number
JP2013531611A
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English (en)
Japanese (ja)
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JP2013542422A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/050609 external-priority patent/WO2012050686A1/en
Publication of JP2013542422A publication Critical patent/JP2013542422A/ja
Publication of JP2013542422A5 publication Critical patent/JP2013542422A5/ja
Pending legal-status Critical Current

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JP2013531611A 2010-09-30 2011-09-07 センサー素子、その製造方法、及びそれを含むセンサー装置 Pending JP2013542422A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38814610P 2010-09-30 2010-09-30
US61/388,146 2010-09-30
PCT/US2011/050609 WO2012050686A1 (en) 2010-09-30 2011-09-07 Sensor element, method of making the same, and sensor device including the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016153865A Division JP2016200605A (ja) 2010-09-30 2016-08-04 センサー素子、その製造方法、及びそれを含むセンサー装置

Publications (2)

Publication Number Publication Date
JP2013542422A JP2013542422A (ja) 2013-11-21
JP2013542422A5 true JP2013542422A5 (enExample) 2014-10-23

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013531611A Pending JP2013542422A (ja) 2010-09-30 2011-09-07 センサー素子、その製造方法、及びそれを含むセンサー装置
JP2016153865A Pending JP2016200605A (ja) 2010-09-30 2016-08-04 センサー素子、その製造方法、及びそれを含むセンサー装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016153865A Pending JP2016200605A (ja) 2010-09-30 2016-08-04 センサー素子、その製造方法、及びそれを含むセンサー装置

Country Status (5)

Country Link
US (1) US10228344B2 (enExample)
EP (1) EP2622333B1 (enExample)
JP (2) JP2013542422A (enExample)
CN (1) CN103154712B (enExample)
WO (1) WO2012050686A1 (enExample)

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CN109952154B (zh) * 2018-06-26 2022-05-13 京东方科技集团股份有限公司 样本分析芯片及其制造方法
CN110208329B (zh) * 2019-06-24 2021-07-20 徐豫青 一种套筒灌浆密实度检测方法及装置
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CN103477215B (zh) 2011-04-13 2015-07-29 3M创新有限公司 检测挥发性有机化合物的方法

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