JP2013539910A5 - - Google Patents

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Publication number
JP2013539910A5
JP2013539910A5 JP2013528347A JP2013528347A JP2013539910A5 JP 2013539910 A5 JP2013539910 A5 JP 2013539910A5 JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013539910 A5 JP2013539910 A5 JP 2013539910A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
sidewall
underfill
removable cover
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013528347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013539910A (ja
Filing date
Publication date
Priority claimed from US12/878,812 external-priority patent/US8691626B2/en
Application filed filed Critical
Publication of JP2013539910A publication Critical patent/JP2013539910A/ja
Publication of JP2013539910A5 publication Critical patent/JP2013539910A5/ja
Pending legal-status Critical Current

Links

JP2013528347A 2010-09-09 2011-09-09 アンダーフィル付き半導体チップデバイス Pending JP2013539910A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/878,812 2010-09-09
US12/878,812 US8691626B2 (en) 2010-09-09 2010-09-09 Semiconductor chip device with underfill
PCT/US2011/051075 WO2012034064A1 (en) 2010-09-09 2011-09-09 Semiconductor chip device with underfill

Publications (2)

Publication Number Publication Date
JP2013539910A JP2013539910A (ja) 2013-10-28
JP2013539910A5 true JP2013539910A5 (OSRAM) 2014-10-30

Family

ID=44652038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013528347A Pending JP2013539910A (ja) 2010-09-09 2011-09-09 アンダーフィル付き半導体チップデバイス

Country Status (6)

Country Link
US (1) US8691626B2 (OSRAM)
EP (1) EP2614521B1 (OSRAM)
JP (1) JP2013539910A (OSRAM)
KR (1) KR101571837B1 (OSRAM)
CN (1) CN103098190A (OSRAM)
WO (1) WO2012034064A1 (OSRAM)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
TWI496254B (zh) * 2010-11-01 2015-08-11 欣興電子股份有限公司 嵌埋半導體元件之封裝結構及其製法
US8363418B2 (en) * 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
US8952540B2 (en) 2011-06-30 2015-02-10 Intel Corporation In situ-built pin-grid arrays for coreless substrates, and methods of making same
US9006004B2 (en) * 2012-03-23 2015-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Probing chips during package formation
TWI508249B (zh) 2012-04-02 2015-11-11 矽品精密工業股份有限公司 封裝件、半導體封裝結構及其製法
US10192810B2 (en) 2013-06-28 2019-01-29 Intel Corporation Underfill material flow control for reduced die-to-die spacing in semiconductor packages
US9412674B1 (en) * 2013-10-24 2016-08-09 Xilinx, Inc. Shielded wire arrangement for die testing
US9721852B2 (en) 2014-01-21 2017-08-01 International Business Machines Corporation Semiconductor TSV device package to which other semiconductor device package can be later attached
KR101622453B1 (ko) * 2014-01-22 2016-05-31 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US9230936B2 (en) * 2014-03-04 2016-01-05 Qualcomm Incorporated Integrated device comprising high density interconnects and redistribution layers
US9373559B2 (en) * 2014-03-05 2016-06-21 International Business Machines Corporation Low-stress dual underfill packaging
JP2016115840A (ja) 2014-12-16 2016-06-23 ソニー株式会社 半導体装置、固体撮像素子、撮像装置、および電子機器
US9437576B1 (en) * 2015-03-23 2016-09-06 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US9798088B2 (en) * 2015-11-05 2017-10-24 Globalfoundries Inc. Barrier structures for underfill blockout regions
US9627784B1 (en) 2015-12-01 2017-04-18 International Business Machines Corporation Method and apparatus for strain relieving surface mount attached connectors
WO2017131694A1 (en) * 2016-01-28 2017-08-03 Hewlett Packard Enterprise Development Lp Printed circuit boards
US10249515B2 (en) * 2016-04-01 2019-04-02 Intel Corporation Electronic device package
WO2017199278A1 (ja) * 2016-05-16 2017-11-23 株式会社日立製作所 半導体装置
US10475766B2 (en) * 2017-03-29 2019-11-12 Intel Corporation Microelectronics package providing increased memory component density
US10304800B2 (en) * 2017-06-23 2019-05-28 Taiwan Semiconductor Manufacturing Company Ltd. Packaging with substrates connected by conductive bumps
US10529693B2 (en) 2017-11-29 2020-01-07 Advanced Micro Devices, Inc. 3D stacked dies with disparate interconnect footprints
US10727204B2 (en) 2018-05-29 2020-07-28 Advances Micro Devices, Inc. Die stacking for multi-tier 3D integration
US10937755B2 (en) 2018-06-29 2021-03-02 Advanced Micro Devices, Inc. Bond pads for low temperature hybrid bonding
JP2020150145A (ja) * 2019-03-14 2020-09-17 キオクシア株式会社 半導体装置
KR102689648B1 (ko) 2020-02-03 2024-07-30 삼성전자주식회사 댐 구조물을 갖는 반도체 패키지
CN113571430B (zh) * 2020-04-28 2025-10-31 桑迪士克科技股份有限公司 具有减小的底部填充面积的倒装芯片封装体
KR102825809B1 (ko) * 2020-07-10 2025-06-27 삼성전자주식회사 언더필이 구비된 반도체 패키지 및 이의 제조 방법
KR102853612B1 (ko) 2020-07-15 2025-09-03 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US11722138B2 (en) * 2020-10-20 2023-08-08 Micron Technology, Inc. Dynamic power and thermal loading in a chiplet-based system
KR20230032592A (ko) * 2021-08-31 2023-03-07 삼성전자주식회사 반도체 패키지
JP7849687B2 (ja) * 2022-01-27 2026-04-22 エスケーハイニックス株式会社 Ｔｓｖ用モールドアンダーフィル組成物
WO2024097032A1 (en) 2022-10-31 2024-05-10 KYOCERA AVX Components Corporation Multilayer capacitor
DE112023004557T5 (de) 2022-10-31 2025-09-11 KYOCERA AVX Components Corporation Mehrschichtiger Kondensator

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3065753B2 (ja) 1991-12-04 2000-07-17 イビデン株式会社 半導体集積回路ベアチップの樹脂封止方法、半導体装置
JPH1074868A (ja) * 1996-08-30 1998-03-17 Oki Electric Ind Co Ltd 半導体実装装置及び半導体装置の封止方法
US5901041A (en) * 1997-12-02 1999-05-04 Northern Telecom Limited Flexible integrated circuit package
JP2000311905A (ja) 1999-04-28 2000-11-07 Nippon Inter Electronics Corp 複合半導体装置の製造方法
JP2000357768A (ja) 1999-06-17 2000-12-26 Hitachi Ltd 半導体装置及びその製造方法
US6589802B1 (en) * 1999-12-24 2003-07-08 Hitachi, Ltd. Packaging structure and method of packaging electronic parts
US6949822B2 (en) * 2000-03-17 2005-09-27 International Rectifier Corporation Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
US6537482B1 (en) 2000-08-08 2003-03-25 Micron Technology, Inc. Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
JP2002124654A (ja) * 2000-10-13 2002-04-26 Mitsubishi Electric Corp 固体撮像装置
US6906415B2 (en) 2002-06-27 2005-06-14 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor devices and methods
TW569416B (en) 2002-12-19 2004-01-01 Via Tech Inc High density multi-chip module structure and manufacturing method thereof
US7122906B2 (en) 2004-01-29 2006-10-17 Micron Technology, Inc. Die-wafer package and method of fabricating same
US7208342B2 (en) * 2004-05-27 2007-04-24 Intel Corporation Package warpage control
JP2006261566A (ja) * 2005-03-18 2006-09-28 Alps Electric Co Ltd 電子部品用ホルダ及び電子部品用保持シート、これらを用いた電子モジュール、電子モジュールの積層体、電子モジュールの製造方法並びに検査方法
CN1949487A (zh) * 2005-10-10 2007-04-18 南茂科技股份有限公司 可防止密封材料溢流的膜上倒装片封装结构
JP2007183164A (ja) * 2006-01-06 2007-07-19 Fujitsu Ltd 半導体集積回路装置及びその試験方法
JP4391508B2 (ja) * 2006-09-29 2009-12-24 Ｏｋｉセミコンダクタ株式会社 半導体装置、及び半導体装置の製造方法
JP2008283004A (ja) * 2007-05-11 2008-11-20 Matsushita Electric Ind Co Ltd 半導体装置
JP5098498B2 (ja) * 2007-08-06 2012-12-12 株式会社デンソー 電子装置
JP2009158623A (ja) * 2007-12-26 2009-07-16 Panasonic Corp 半導体装置の製造方法
CN101777502B (zh) * 2009-01-13 2011-12-07 日月光半导体制造股份有限公司 倒装芯片封装方法

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