JP2013538417A - プラズマ処理チャンバ内のパラシティックプラズマの阻止 - Google Patents
プラズマ処理チャンバ内のパラシティックプラズマの阻止 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【選択図】図3
Description
Claims (20)
- プラズマ処理チャンバの部品であって、
非金属材料の第1の層であって、相対する第1及び第2の表面を有し、前記第1の表面は、前記プラズマ処理チャンバ内でプラズマに暴露され、前記第2の表面は、前記プラズマ処理チャンバ内でプラズマに暴露されない、第1の層と、
導電性材料の第2の層であって、前記第1の層の前記第2の表面に接合される第2の層と、
前記第1の層及び前記第2の層の全体に貫いて、前記プラズマ処理チャンバの内側に開かれているヴォイド空間と、
前記第2の層が前記ヴォイド空間内に露出されないように、及び、前記ヴォイド空間内のパラシティックプラズマが阻止されるように、前記第2の層内で前記ヴォイド空間の内表面を覆う管状スリーブと、
を備え、
前記管状スリーブの一方の端は、前記第1の層及び前記第2の層の対向表面と同一平面にあり、前記管状スリーブのもう一方の端は、前記第2の層の下表面と同一平面にある、部品。 - 請求項1に記載の部品であって、
前記管状スリーブは、前記第1の層と同じ材料で作成されている、
前記管状スリーブは、前記第2の層よりも低い誘電率の材料で作成されている、
前記管状スリーブは、プラスチック若しくはセラミックで作成されている、
及び/又は、
前記管状スリーブは、被覆である、部品。 - 請求項1に記載の部品であって、
前記管状スリーブは、前記第1の層内の前記ヴォイド空間の内径に等しい内径を有する、部品。 - 請求項1に記載の部品であって、
前記管状スリーブは、接着剤、固定具、及び/又は、前記管状スリーブの外表面上のネジ山によって、前記ヴォイド空間の前記内表面に固定される、部品。 - 請求項1に記載の部品であって、
前記第1の層は、アルミナ、窒化アルミニウム、非ドープシリコン、窒化シリコン、酸化シリコン、酸窒化シリコン、及び/又は、イットリアで作成され、
前記第2の層は、金属、グラファイト、及び/又は、ドープシリコンで作成される、部品。 - 請求項1に記載の部品であって、
前記管状スリーブは、前記第2の層内の嵌め合い凹所に収まる外向きに突き出した上フランジ又は外向きに突き出した下フランジを有する、部品。 - 請求項1に記載の部品であって、
前記管状スリーブは、少なくとも0.01インチ(0.0254センチ)の壁厚を有する、部品。 - 請求項1に記載の部品であって、
前記プラズマ処理チャンバ内に存在する高周波数における前記導電性材料の比誘電率は、前記高周波数における前記非金属材料の比誘電率の少なくとも20倍である、部品。 - 請求項1に記載の部品であって、
前記第2の層は、0.5〜5mmの厚さを有する、部品。 - 請求項1に記載の部品であって、更に、
前記第2の層に熱的に接触している少なくとも1つのヒータを備える部品。 - 請求項10に記載の部品であって、
前記少なくとも1つのヒータは、前記第2の層に埋め込まれた又は前記第2の層の底面に取り付けられた薄膜ヒータである、部品。 - 請求項1に記載の部品であって、
前記部品は、上方電極若しくは基板サポートである、
並びに/又は、
前記ヴォイドは、ガスホール、リフトピンホール、ヘリウム通路、導管、及び/若しくはプレナムである、部品。 - 請求項1に記載の部品であって、
前記第2の層は、接着剤によって前記第2の表面に接合される、部品。 - 請求項1に記載の部品であって、更に、
少なくとも1つの埋め込みESC電極を備える部品。 - 請求項1に記載の部品であって、
前記ヴォイド空間の内径は、0.02〜0.08インチ(おおよそ0.0508〜0.203センチ)である、部品。 - 請求項1に記載の部品であって、更に、
前記第2の層に取り付けられて高周波数電力が供給されるベースを備えており、
前記ベースは、埋め込み流体チャネルを有する、
及び/又は、
前記ベースは、前記ヴォイド空間と流体連通している少なくとも1つのプレナムを有する、部品。 - 請求項16に記載の部品であって、
前記ベースは、前記第2の層に接合される、支えられる、留め付けられる、及び/又は、接着される、部品。 - 請求項1に記載の部品を備えるプラズマ処理チャンバ。
- 請求項1に記載の部品を製造する方法であって、
前記第2の層が前記ヴォイド空間内で露出されないように、及び、前記ヴォイド空間内のパラシティックプラズマが阻止されるように、前記第2の層内で前記ヴォイド空間の前記内表面を覆うことと、
前記第2の層を前記第1の層の前記第2の表面に接合することと、
を備える方法。 - 請求項19に記載の方法であって、更に、
前記第2の層にベースを取り付けることを備える方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/844,527 US9728429B2 (en) | 2010-07-27 | 2010-07-27 | Parasitic plasma prevention in plasma processing chambers |
US12/844,527 | 2010-07-27 | ||
PCT/US2011/001270 WO2012018368A2 (en) | 2010-07-27 | 2011-07-18 | Parasitic plasma prevention in plasma processing chambers |
Publications (2)
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JP2013538417A true JP2013538417A (ja) | 2013-10-10 |
JP5815703B2 JP5815703B2 (ja) | 2015-11-17 |
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JP2013521760A Active JP5815703B2 (ja) | 2010-07-27 | 2011-07-18 | プラズマ処理チャンバ、プラズマ処理チャンバの部品及びその製造方法 |
Country Status (7)
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US (1) | US9728429B2 (ja) |
JP (1) | JP5815703B2 (ja) |
KR (1) | KR101854937B1 (ja) |
CN (1) | CN103026799B (ja) |
SG (2) | SG187142A1 (ja) |
TW (1) | TWI662864B (ja) |
WO (1) | WO2012018368A2 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9184028B2 (en) | 2010-08-04 | 2015-11-10 | Lam Research Corporation | Dual plasma volume processing apparatus for neutral/ion flux control |
US8869742B2 (en) * | 2010-08-04 | 2014-10-28 | Lam Research Corporation | Plasma processing chamber with dual axial gas injection and exhaust |
JP6527524B2 (ja) * | 2014-02-07 | 2019-06-05 | インテグリス・インコーポレーテッド | 静電チャックおよびその作製方法 |
US9976211B2 (en) | 2014-04-25 | 2018-05-22 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
TWI798594B (zh) * | 2014-04-25 | 2023-04-11 | 美商應用材料股份有限公司 | 用於高溫應用的耐電漿腐蝕薄膜塗層 |
US9793096B2 (en) | 2014-09-12 | 2017-10-17 | Lam Research Corporation | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity |
KR102477302B1 (ko) | 2015-10-05 | 2022-12-13 | 주성엔지니어링(주) | 배기가스 분해기를 가지는 기판처리장치 및 그 배기가스 처리방법 |
US20180358212A1 (en) * | 2015-12-09 | 2018-12-13 | Applied Materials, Inc. | System configured for sputter deposition on a substrate, shielding device for a sputter deposition chamber, and method for providing an electrical shielding in a sputter deposition chamber |
EP3184073B1 (de) * | 2015-12-22 | 2019-05-29 | Intensiv SA | Werkzeug zur behandlung von interdentalflächen |
US20180016678A1 (en) | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
US20190088518A1 (en) * | 2017-09-20 | 2019-03-21 | Applied Materials, Inc. | Substrate support with cooled and conducting pins |
US10904996B2 (en) | 2017-09-20 | 2021-01-26 | Applied Materials, Inc. | Substrate support with electrically floating power supply |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
WO2020146047A1 (en) * | 2019-01-08 | 2020-07-16 | Applied Materials, Inc. | Pumping apparatus and method for substrate processing chambers |
CN113169026B (zh) | 2019-01-22 | 2024-04-26 | 应用材料公司 | 用于控制脉冲电压波形的反馈回路 |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
KR102640172B1 (ko) | 2019-07-03 | 2024-02-23 | 삼성전자주식회사 | 기판 처리 장치 및 이의 구동 방법 |
US11462389B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Pulsed-voltage hardware assembly for use in a plasma processing system |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US20220399185A1 (en) | 2021-06-09 | 2022-12-15 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
KR102548570B1 (ko) * | 2021-07-22 | 2023-06-29 | 피에스케이 주식회사 | 기판 처리 장치 및 도어 어셈블리 구동 방법 |
US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070204958A1 (en) * | 2006-03-03 | 2007-09-06 | Advanced Display Process Engineering Co., Ltd. | Plasma processing apparatus |
US20070264443A1 (en) * | 2006-05-09 | 2007-11-15 | Applied Materials, Inc. | Apparatus and method for avoidance of parasitic plasma in plasma source gas supply conduits |
US20090022905A1 (en) * | 2007-07-20 | 2009-01-22 | Jozef Kudela | Rf choke for gas delivery to an rf driven electrode in a plasma processing apparatus |
WO2009063950A1 (ja) * | 2007-11-16 | 2009-05-22 | Ulvac, Inc. | カルコゲナイド膜およびその製造方法 |
US20090151636A1 (en) * | 2007-11-16 | 2009-06-18 | Applied Materials, Inc. | Rpsc and rf feedthrough |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4340462A (en) | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
DE3316837C2 (de) | 1983-05-07 | 1986-06-26 | Dornier System Gmbh, 7990 Friedrichshafen | Einrichtung zur Erzeugung von Stoßwellen mittels einer Funkenstrecke für die berührungsfreie Zertrümmerung von Konkrementen in Körpern von Lebewesen |
KR0129663B1 (ko) * | 1988-01-20 | 1998-04-06 | 고다까 토시오 | 에칭 장치 및 방법 |
US5129359A (en) * | 1988-11-15 | 1992-07-14 | Canon Kabushiki Kaisha | Microwave plasma CVD apparatus for the formation of functional deposited film with discharge space provided with gas feed device capable of applying bias voltage between the gas feed device and substrate |
US4948458A (en) | 1989-08-14 | 1990-08-14 | Lam Research Corporation | Method and apparatus for producing magnetically-coupled planar plasma |
US5200232A (en) | 1990-12-11 | 1993-04-06 | Lam Research Corporation | Reaction chamber design and method to minimize particle generation in chemical vapor deposition reactors |
US5800618A (en) * | 1992-11-12 | 1998-09-01 | Ngk Insulators, Ltd. | Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof |
DE4301189C2 (de) | 1993-01-19 | 2000-12-14 | Leybold Ag | Vorrichtung zum Beschichten von Substraten |
JPH07249586A (ja) * | 1993-12-22 | 1995-09-26 | Tokyo Electron Ltd | 処理装置及びその製造方法並びに被処理体の処理方法 |
US5680013A (en) * | 1994-03-15 | 1997-10-21 | Applied Materials, Inc. | Ceramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfaces |
US5748663A (en) | 1994-06-08 | 1998-05-05 | Qsource, Inc. | Retangular discharge gas laser |
US5886863A (en) * | 1995-05-09 | 1999-03-23 | Kyocera Corporation | Wafer support member |
US6140612A (en) | 1995-06-07 | 2000-10-31 | Lam Research Corporation | Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck |
US5824605A (en) | 1995-07-31 | 1998-10-20 | Lam Research Corporation | Gas dispersion window for plasma apparatus and method of use thereof |
US5885423A (en) | 1996-03-29 | 1999-03-23 | Lam Research Corporation | Cammed nut for ceramics fastening |
US5796066A (en) | 1996-03-29 | 1998-08-18 | Lam Research Corporation | Cable actuated drive assembly for vacuum chamber |
US6108189A (en) | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
US5948704A (en) | 1996-06-05 | 1999-09-07 | Lam Research Corporation | High flow vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support |
US5820723A (en) | 1996-06-05 | 1998-10-13 | Lam Research Corporation | Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support |
US6013155A (en) | 1996-06-28 | 2000-01-11 | Lam Research Corporation | Gas injection system for plasma processing |
US6090304A (en) | 1997-08-28 | 2000-07-18 | Lam Research Corporation | Methods for selective plasma etch |
US6073577A (en) * | 1998-06-30 | 2000-06-13 | Lam Research Corporation | Electrode for plasma processes and method for manufacture and use thereof |
US6178919B1 (en) | 1998-12-28 | 2001-01-30 | Lam Research Corporation | Perforated plasma confinement ring in plasma reactors |
US6230651B1 (en) | 1998-12-30 | 2001-05-15 | Lam Research Corporation | Gas injection system for plasma processing |
US6263829B1 (en) | 1999-01-22 | 2001-07-24 | Applied Materials, Inc. | Process chamber having improved gas distributor and method of manufacture |
DE19950922A1 (de) | 1999-10-21 | 2001-04-26 | Beru Ag | Zündkerze |
US6606234B1 (en) | 2000-09-05 | 2003-08-12 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow |
JP2002110679A (ja) | 2000-09-29 | 2002-04-12 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US6333272B1 (en) | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
US6391787B1 (en) | 2000-10-13 | 2002-05-21 | Lam Research Corporation | Stepped upper electrode for plasma processing uniformity |
US6581275B2 (en) | 2001-01-22 | 2003-06-24 | Applied Materials Inc. | Fabricating an electrostatic chuck having plasma resistant gas conduits |
US7161121B1 (en) | 2001-04-30 | 2007-01-09 | Lam Research Corporation | Electrostatic chuck having radial temperature control capability |
US6847014B1 (en) | 2001-04-30 | 2005-01-25 | Lam Research Corporation | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
US6974523B2 (en) | 2001-05-16 | 2005-12-13 | Lam Research Corporation | Hollow anode plasma reactor and method |
KR100427459B1 (ko) | 2001-09-05 | 2004-04-30 | 주성엔지니어링(주) | 아크 방지용 정전척 |
US20040003828A1 (en) | 2002-03-21 | 2004-01-08 | Jackson David P. | Precision surface treatments using dense fluids and a plasma |
US6921724B2 (en) * | 2002-04-02 | 2005-07-26 | Lam Research Corporation | Variable temperature processes for tunable electrostatic chuck |
JP2005019606A (ja) * | 2003-06-25 | 2005-01-20 | Anelva Corp | プラズマ処理装置におけるガスシャワーヘッドまたはターゲットプレートを電極に固定する装置 |
KR100505035B1 (ko) * | 2003-11-17 | 2005-07-29 | 삼성전자주식회사 | 기판을 지지하기 위한 정전척 |
US7244311B2 (en) * | 2004-10-13 | 2007-07-17 | Lam Research Corporation | Heat transfer system for improved semiconductor processing uniformity |
JP4687534B2 (ja) | 2005-09-30 | 2011-05-25 | 東京エレクトロン株式会社 | 基板の載置機構及び基板処理装置 |
CN100440476C (zh) | 2005-09-30 | 2008-12-03 | 东京毅力科创株式会社 | 基板载置机构以及基板处理装置 |
TWI331770B (en) * | 2005-11-04 | 2010-10-11 | Applied Materials Inc | Apparatus for plasma-enhanced atomic layer deposition |
DE502005006841D1 (de) | 2005-12-22 | 2009-04-23 | Applied Materials Gmbh & Co Kg | Zerstäubungsvorrichtung mit einer Rohrkathode und Verfahren zum Betreiben dieser Zerstäubungsvorrichtung |
US7638003B2 (en) * | 2006-01-12 | 2009-12-29 | Asm Japan K.K. | Semiconductor processing apparatus with lift pin structure |
US20080254220A1 (en) * | 2006-01-20 | 2008-10-16 | Tokyo Electron Limited | Plasma processing apparatus |
KR101020160B1 (ko) * | 2006-03-03 | 2011-03-09 | 엘아이지에이디피 주식회사 | 플라즈마 처리장치 |
US7501605B2 (en) * | 2006-08-29 | 2009-03-10 | Lam Research Corporation | Method of tuning thermal conductivity of electrostatic chuck support assembly |
JP5160112B2 (ja) * | 2007-03-19 | 2013-03-13 | 東京エレクトロン株式会社 | 処理装置内構造体、プラズマ処理装置内構造体及びプラズマ処理装置 |
KR101119627B1 (ko) * | 2007-03-29 | 2012-03-07 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 |
US7667944B2 (en) | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
KR101125885B1 (ko) | 2007-07-31 | 2012-03-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 감소된 플라즈마 침투 및 아킹을 갖는 정전척을 제공하는 방법 및 장치 |
US7848076B2 (en) | 2007-07-31 | 2010-12-07 | Applied Materials, Inc. | Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing |
JP5174582B2 (ja) * | 2007-08-30 | 2013-04-03 | 日本碍子株式会社 | 接合構造体 |
JP2009060011A (ja) * | 2007-09-03 | 2009-03-19 | Tokyo Electron Ltd | 基板載置台、基板処理装置、及び温度制御方法 |
JP5201527B2 (ja) * | 2008-03-28 | 2013-06-05 | 東京エレクトロン株式会社 | 静電チャック、及びその製造方法 |
TWI398196B (zh) | 2008-07-04 | 2013-06-01 | Au Optronics Corp | 防電弧保護裝置以及其組裝方法 |
JP5584517B2 (ja) * | 2010-05-12 | 2014-09-03 | 東京エレクトロン株式会社 | プラズマ処理装置及び半導体装置の製造方法 |
-
2010
- 2010-07-27 US US12/844,527 patent/US9728429B2/en active Active
-
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- 2011-07-07 TW TW100124043A patent/TWI662864B/zh active
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- 2011-07-18 SG SG2013004346A patent/SG187142A1/en unknown
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070204958A1 (en) * | 2006-03-03 | 2007-09-06 | Advanced Display Process Engineering Co., Ltd. | Plasma processing apparatus |
US20070264443A1 (en) * | 2006-05-09 | 2007-11-15 | Applied Materials, Inc. | Apparatus and method for avoidance of parasitic plasma in plasma source gas supply conduits |
US20090022905A1 (en) * | 2007-07-20 | 2009-01-22 | Jozef Kudela | Rf choke for gas delivery to an rf driven electrode in a plasma processing apparatus |
WO2009063950A1 (ja) * | 2007-11-16 | 2009-05-22 | Ulvac, Inc. | カルコゲナイド膜およびその製造方法 |
US20090151636A1 (en) * | 2007-11-16 | 2009-06-18 | Applied Materials, Inc. | Rpsc and rf feedthrough |
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KR20130132384A (ko) | 2013-12-04 |
KR101854937B1 (ko) | 2018-05-04 |
JP5815703B2 (ja) | 2015-11-17 |
TW201220961A (en) | 2012-05-16 |
SG187142A1 (en) | 2013-02-28 |
WO2012018368A2 (en) | 2012-02-09 |
WO2012018368A3 (en) | 2012-04-05 |
US9728429B2 (en) | 2017-08-08 |
CN103026799A (zh) | 2013-04-03 |
US20120024449A1 (en) | 2012-02-02 |
WO2012018368A9 (en) | 2012-07-19 |
TWI662864B (zh) | 2019-06-11 |
CN103026799B (zh) | 2016-03-30 |
SG10201505834VA (en) | 2015-09-29 |
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