JP2013531078A - ポリマー厚膜封止材および安定性が向上したｐｔｃ炭素系 - Google Patents

ポリマー厚膜封止材および安定性が向上したｐｔｃ炭素系 Download PDF

Info

Publication number
JP2013531078A
JP2013531078A JP2013506255A JP2013506255A JP2013531078A JP 2013531078 A JP2013531078 A JP 2013531078A JP 2013506255 A JP2013506255 A JP 2013506255A JP 2013506255 A JP2013506255 A JP 2013506255A JP 2013531078 A JP2013531078 A JP 2013531078A
Authority
JP
Japan
Prior art keywords
sealing material
organic medium
composition
thick film
temperature coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2013506255A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013531078A5 (cg-RX-API-DMAC7.html
Inventor
アランチョ ビンス
ロバート ドーフマン ジェイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2013531078A publication Critical patent/JP2013531078A/ja
Publication of JP2013531078A5 publication Critical patent/JP2013531078A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
    • B60N2/56—Heating or ventilating devices
    • B60N2/5678—Heating or ventilating devices characterised by electrical systems
    • B60N2/5685—Resistance
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/16—Homopolymers or copolymers or vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09D127/16—Homopolymers or copolymers of vinylidene fluoride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C08L33/12—Homopolymers or copolymers of methyl methacrylate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Resistance Heating (AREA)
  • Sealing Material Composition (AREA)
JP2013506255A 2010-04-21 2011-04-20 ポリマー厚膜封止材および安定性が向上したｐｔｃ炭素系 Ceased JP2013531078A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/764,185 2010-04-21
US12/764,185 US8093328B2 (en) 2010-04-21 2010-04-21 Polymer thick film encapsulant and enhanced stability PTC carbon system
PCT/US2011/033149 WO2011133614A1 (en) 2010-04-21 2011-04-20 Polymer thick film encapsulant and enhanced stability ptc carbon system

Publications (2)

Publication Number Publication Date
JP2013531078A true JP2013531078A (ja) 2013-08-01
JP2013531078A5 JP2013531078A5 (cg-RX-API-DMAC7.html) 2014-03-20

Family

ID=44222711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013506255A Ceased JP2013531078A (ja) 2010-04-21 2011-04-20 ポリマー厚膜封止材および安定性が向上したｐｔｃ炭素系

Country Status (5)

Country Link
US (2) US8093328B2 (cg-RX-API-DMAC7.html)
EP (1) EP2561017A1 (cg-RX-API-DMAC7.html)
JP (1) JP2013531078A (cg-RX-API-DMAC7.html)
CN (1) CN102812082B (cg-RX-API-DMAC7.html)
WO (1) WO2011133614A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013163808A (ja) * 2012-01-31 2013-08-22 E I Du Pont De Nemours & Co ポリマー厚膜正温度係数炭素組成物

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9573438B2 (en) 2013-04-10 2017-02-21 E I Du Pont De Nemours And Company Polymer thick film positive temperature coefficient carbon composition
US20150101316A1 (en) * 2013-10-14 2015-04-16 General Electric Company Heater assembly with protective coating and method of applying same
US10373745B2 (en) * 2014-06-12 2019-08-06 LMS Consulting Group Electrically conductive PTC ink with double switching temperatures and applications thereof in flexible double-switching heaters
US11302463B2 (en) * 2014-06-12 2022-04-12 Lms Consulting Group, Llc Electrically conductive PTC ink with double switching temperatures and applications thereof in flexible double-switching heaters
US9685270B2 (en) * 2014-07-07 2017-06-20 E I Du Pont De Nemours And Company High K dielectric composition for thermoformable capacitive circuits
US11332632B2 (en) 2016-02-24 2022-05-17 Lms Consulting Group, Llc Thermal substrate with high-resistance magnification and positive temperature coefficient ink
US10822512B2 (en) 2016-02-24 2020-11-03 LMS Consulting Group Thermal substrate with high-resistance magnification and positive temperature coefficient
EP3420041A4 (en) * 2016-02-24 2019-11-13 LMS Consulting Group ELECTRICALLY CONDUCTIVE PTC INK WITH DOUBLE SWITCHING TEMPERATURES AND APPLICATIONS THEREOF IN FLEXIBLE DOUBLE SWITCHES
CN109417834B (zh) * 2016-07-22 2022-04-12 E.I.内穆尔杜邦公司 薄膜加热装置
US20250368836A1 (en) * 2024-05-29 2025-12-04 Celanese Mercury Holdings Inc. Polymer Thick Film Positive Temperature Coefficient Carbon Resistor Composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08339904A (ja) * 1995-03-10 1996-12-24 E I Du Pont De Nemours & Co 正の温度係数組成物
JP2002206040A (ja) * 2000-11-13 2002-07-26 Atofina 温度で自動制御される抵抗を有する電導性ポリマーの複合材料
JP2005054185A (ja) * 2003-08-01 2005-03-03 Arkema Ｐｖｄｆをベースにしたｐｔｃペイントと、その自己調節式暖房システムでの利用
JP2008004921A (ja) * 2006-04-10 2008-01-10 E I Du Pont De Nemours & Co 電子部品保護用の有機封止材組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4416941A (en) * 1982-07-30 1983-11-22 E. I. Du Pont De Nemours & Co. Additive for coating compositions of silica and a fluorinated ethylene oxide polymer
KR20000019372A (ko) * 1998-09-10 2000-04-06 박호군 균질상의 고체고분자합금 전해질 및 그 제조방법과, 그 전해질을 이용한 복합전극, 리튬고분자전지, 리튬이온고분자전지 및그 제조방법
US20050062023A1 (en) * 2003-08-01 2005-03-24 Alexander Korzhenko PVDF-based PTC paints and their applications for self-regulated heating systems
US7338622B2 (en) * 2003-12-04 2008-03-04 E.I. Du Pont De Nemours And Company Thick film compositions for use in electroluminescent applications

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08339904A (ja) * 1995-03-10 1996-12-24 E I Du Pont De Nemours & Co 正の温度係数組成物
JP2002206040A (ja) * 2000-11-13 2002-07-26 Atofina 温度で自動制御される抵抗を有する電導性ポリマーの複合材料
JP2005054185A (ja) * 2003-08-01 2005-03-03 Arkema Ｐｖｄｆをベースにしたｐｔｃペイントと、その自己調節式暖房システムでの利用
JP2008004921A (ja) * 2006-04-10 2008-01-10 E I Du Pont De Nemours & Co 電子部品保護用の有機封止材組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013163808A (ja) * 2012-01-31 2013-08-22 E I Du Pont De Nemours & Co ポリマー厚膜正温度係数炭素組成物

Also Published As

Publication number Publication date
CN102812082A (zh) 2012-12-05
US8575260B2 (en) 2013-11-05
WO2011133614A1 (en) 2011-10-27
CN102812082B (zh) 2015-09-30
US20110263781A1 (en) 2011-10-27
US20120067867A1 (en) 2012-03-22
EP2561017A1 (en) 2013-02-27
US8093328B2 (en) 2012-01-10

Similar Documents

Publication Publication Date Title
CN102812082B (zh) 聚合物厚膜包封剂和稳定性增强的ptc碳体系
JP6412106B2 (ja) ポリマー厚膜正温度係数カーボン組成物
JP3423932B2 (ja) 電気発熱体厚膜形成用抵抗ペースト
JP2013163808A (ja) ポリマー厚膜正温度係数炭素組成物
KR0140203B1 (ko) 전도성 중합체 조성물
JP5462274B2 (ja) Ｒｆｉｄおよび他の用途に使用するための高導電率ポリマー厚膜銀導体組成物
JP2014039012A (ja) ポリマー厚膜導体組成物のフォトニック焼結
JP2014503614A (ja) 薄膜光電池およびその他の用途に使用するためのはんだ付け可能なポリマー厚膜銀電極組成物
CN103366862A (zh) 聚合物厚膜焊料合金/金属导体组合物
JP6517915B2 (ja) 逆硬化プロファイル挙動を有するポリマー厚膜銀導体
JP7696200B2 (ja) 装着可能なヒーター用の伸縮性ポリマー厚膜カーボンブラック組成物
CN103910991B (zh) 用于可热成型电路的防潮层电介质
TWI567764B (zh) 高分子正溫度係數過電流保護裝置
JP2018067640A (ja) 正温度係数抵抗体用組成物、正温度係数抵抗体用ペースト、正温度係数抵抗体ならびに正温度係数抵抗体の製造方法
CN114902355B (zh) 电阻体膏、烧成体以及电气制品
KR101972676B1 (ko) 대기 분위기 소성용 도전성 페이스트 및 그 제조 방법
JP2010113887A (ja) 分散液、金属酸化物含有膜および金属酸化物膜付き基板の製造方法
TWI230949B (en) Polymer thick film resistor paste composition
JP6737872B2 (ja) はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス
JP2020198404A5 (cg-RX-API-DMAC7.html)
JPH03209702A (ja) Ｐｔｃ組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140131

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140131

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140428

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140725

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150127

A045 Written measure of dismissal of application [lapsed due to lack of payment]

Free format text: JAPANESE INTERMEDIATE CODE: A045

Effective date: 20150526