JP2013529386A5 - - Google Patents

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JP2013529386A5
JP2013529386A5 JP2013511174A JP2013511174A JP2013529386A5 JP 2013529386 A5 JP2013529386 A5 JP 2013529386A5 JP 2013511174 A JP2013511174 A JP 2013511174A JP 2013511174 A JP2013511174 A JP 2013511174A JP 2013529386 A5 JP2013529386 A5 JP 2013529386A5
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JP6009436B2 (ja
JP2013529386A (ja
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JP2013511174A 2010-05-17 2011-04-26 化学機械研磨における研磨速度補正のためのフィードバック Active JP6009436B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/781,644 US8190285B2 (en) 2010-05-17 2010-05-17 Feedback for polishing rate correction in chemical mechanical polishing
US12/781,644 2010-05-17
PCT/US2011/033998 WO2011146208A2 (en) 2010-05-17 2011-04-26 Feedback for polishing rate correction in chemical mechanical polishing

Publications (3)

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JP2013529386A JP2013529386A (ja) 2013-07-18
JP2013529386A5 true JP2013529386A5 (https=) 2014-06-19
JP6009436B2 JP6009436B2 (ja) 2016-10-19

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JP2013511174A Active JP6009436B2 (ja) 2010-05-17 2011-04-26 化学機械研磨における研磨速度補正のためのフィードバック

Country Status (5)

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US (3) US8190285B2 (https=)
JP (1) JP6009436B2 (https=)
KR (1) KR101769886B1 (https=)
TW (1) TWI593513B (https=)
WO (1) WO2011146208A2 (https=)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101834944B1 (ko) * 2008-09-04 2018-03-06 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정
US8292693B2 (en) * 2008-11-26 2012-10-23 Applied Materials, Inc. Using optical metrology for wafer to wafer feed back process control
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
US8666665B2 (en) * 2010-06-07 2014-03-04 Applied Materials, Inc. Automatic initiation of reference spectra library generation for optical monitoring
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US10643853B2 (en) 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
WO2013130366A1 (en) * 2012-02-27 2013-09-06 Applied Materials, Inc. Feedback control using detection of clearance and adjustment for uniform topography
US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
US20140030956A1 (en) * 2012-07-25 2014-01-30 Jimin Zhang Control of polishing of multiple substrates on the same platen in chemical mechanical polishing
KR20150085000A (ko) * 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
US20140242877A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Spectrographic metrology with multiple measurements
US9242337B2 (en) 2013-03-15 2016-01-26 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ISPC)
US9490186B2 (en) 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9997420B2 (en) * 2013-12-27 2018-06-12 Taiwan Semiconductor Manufacturing Company Limited Method and/or system for chemical mechanical planarization (CMP)
US10464184B2 (en) 2014-05-07 2019-11-05 Applied Materials, Inc. Modifying substrate thickness profiles
US9610672B2 (en) 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR101679131B1 (ko) * 2014-12-29 2016-11-23 주식회사 엘지실트론 웨이퍼 연마장치 및 그 연마방법
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
JP6847811B2 (ja) 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
US11989492B2 (en) 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI810069B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
KR102737625B1 (ko) * 2020-06-26 2024-12-04 어플라이드 머티어리얼스, 인코포레이티드 변형가능한 기판 척
JP7389718B2 (ja) * 2020-06-29 2023-11-30 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP7637482B2 (ja) * 2020-08-11 2025-02-28 株式会社荏原製作所 基板処理装置及び研磨部材のドレッシング制御方法
EP4215312A4 (en) * 2020-09-15 2024-10-16 National University Corporation Nagaoka University of Technology Polishing state analysis prediction program, storage device, cathode luminescence device, and polishing state analysis prediction method
KR102747336B1 (ko) * 2021-03-03 2024-12-31 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
US11919121B2 (en) 2021-03-05 2024-03-05 Applied Materials, Inc. Control of processing parameters during substrate polishing using constrained cost function
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
CN113246012B (zh) * 2021-05-14 2022-08-09 上海华力集成电路制造有限公司 化学机械研磨的控制方法、设备和存储介质
JP2024040885A (ja) * 2022-09-13 2024-03-26 株式会社荏原製作所 研磨装置におけるグラフの表示方法およびコンピュータプログラム
CN115946036B (zh) * 2022-12-15 2025-08-05 北京晶亦精微科技股份有限公司 一种研磨压力修整方法、装置、计算机设备及介质
CN117140200A (zh) * 2023-09-19 2023-12-01 安徽久泰电气有限公司 一种打磨机器人全自动打磨抛光控制方法及系统

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US6491569B2 (en) * 2001-04-19 2002-12-10 Speedfam-Ipec Corporation Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
JP3932836B2 (ja) 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6945845B2 (en) * 2003-03-04 2005-09-20 Applied Materials, Inc. Chemical mechanical polishing apparatus with non-conductive elements
US6991516B1 (en) * 2003-08-18 2006-01-31 Applied Materials Inc. Chemical mechanical polishing with multi-stage monitoring of metal clearing
US7074109B1 (en) * 2003-08-18 2006-07-11 Applied Materials Chemical mechanical polishing control system and method
JP4464642B2 (ja) * 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
CN1972780B (zh) * 2004-06-21 2010-09-08 株式会社荏原制作所 抛光设备和抛光方法
JP4689367B2 (ja) * 2004-07-09 2011-05-25 株式会社荏原製作所 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置
JPWO2006126420A1 (ja) * 2005-05-26 2008-12-25 株式会社ニコン Ｃｍｐ研磨装置における研磨終了点検出方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法
US8260446B2 (en) * 2005-08-22 2012-09-04 Applied Materials, Inc. Spectrographic monitoring of a substrate during processing using index values
US8392012B2 (en) * 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
WO2007024807A2 (en) * 2005-08-22 2007-03-01 Applied Materials, Inc. Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
KR101398570B1 (ko) * 2005-08-22 2014-05-22 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR101504508B1 (ko) * 2007-02-23 2015-03-20 어플라이드 머티어리얼스, 인코포레이티드 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용
KR101834944B1 (ko) * 2008-09-04 2018-03-06 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정
JP5774482B2 (ja) * 2008-10-27 2015-09-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理中の基板の分光モニタリングにおける適合度
US20100103422A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
US20100114532A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Weighted spectrographic monitoring of a substrate during processing
US20100120331A1 (en) * 2008-11-07 2010-05-13 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US8295967B2 (en) 2008-11-07 2012-10-23 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US8292693B2 (en) * 2008-11-26 2012-10-23 Applied Materials, Inc. Using optical metrology for wafer to wafer feed back process control
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing

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